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| Number | Title | Issue Date |
| 7679882 | Multilayered chip capacitor and capacitance tunning method of the same There is provided a multilayer chip capacitor capable of tuning capacitance, including: a capacitor body where a plurality of dielectric layers are laminated; a plurality of pairs of first and second internal electrodes arranged alternately, while interposing a corr... | 03/16/2010 |
| 7675733 | Multilayer capacitor There is provided a multilayer capacitor including an inner connecting conductor of at least one polarity; a plurality of first and second outer electrodes formed on a surface of the body, wherein the inner connecting conductor is connected to a corresponding one of... | 03/09/2010 |
| 7667949 | Capacitor having improved surface breakdown voltage performance and method for marking same A capacitor having improved surface breakdown voltage performance and a method for applying laser marking to capacitors which does not reduce capacitor surface breakdown voltage, can be applied using existing laser marking technologies and apparatus, and which resul... | 02/23/2010 |
| 7667950 | Multilayer capacitor and electronic device A multilayer capacitor has a laminate body in which a first internal electrode and a second internal electrode are alternately laminated with a dielectric layer in between, a first terminal electrode provided on one end side of the laminate body, and a second termin... | 02/23/2010 |
| 7663862 | Multilayer capacitor A first internal electrode includes a main electrode portion whose longer-side direction agrees with a longer-side direction of first and second principal faces, and a lead portion extending from an end of the main electrode portion on the first end face side toward... | 02/16/2010 |
| 7660100 | Through-type multilayer capacitor array A through-type multilayer capacitor array comprises a capacitor body, and two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, a first outer connecting conductor, and a second outer connecting conductor. The... | 02/09/2010 |
| 7652869 | Multilayer capacitor A multilayer capacitor comprises a multilayer body and a plurality of terminal electrodes formed on a side face of the multilayer body. The multilayer body includes an inner layer portion in which a plurality of dielectric layers and a plurality of inner electrodes ... | 01/26/2010 |
| 7646586 | Multilayer capacitor and method of manufacturing same A multilayer capacitor comprises a multilayer body in which a plurality of dielectric layers and a plurality of first and second inner electrodes are laminated alternately, and first and second terminal electrodes arranged on the multilayer body. The first terminal ... | 01/12/2010 |
| 7633739 | Stacked multilayer capacitor A capacitor device, which is mountable on a substrate, has an electrically conductive bottom lead frame with a bottom plate mountable substantially parallel to, and in contact with, the substrate and an electrically conductive top lead frame having a top plate space... | 12/15/2009 |
| 7623338 | Multiple metal-insulator-metal capacitors and method of fabricating the same In a device including multiple metal-insulator-metal (MIM) capacitors and a method of fabricating the same, the multiple MIM capacitors comprise a lower interconnect in a substrate; a first dielectric layer on the lower interconnect; a first intermediate electrode p... | 11/24/2009 |
| 7619873 | Feedthrough multilayer capacitor A feedthrough multilayer capacitor has a capacitor body, at least two signal terminal electrodes, at least one grounding terminal electrode, and at least one connecting conductor. The capacitor body includes a plurality of insulator layers laminated, a signal inner ... | 11/17/2009 |
| 7602601 | Multilayer capacitor, manufacturing method thereof A multilayer capacitor is provided that includes a dielectric body, an internal layer portion, an external layer portion and a first terminal electrode and a second terminal electrode to be set at different electric potentials from each other and formed at least on ... | 10/13/2009 |
| 7599166 | Multilayer chip capacitor A multilayer chip capacitor includes a capacitor body having dielectric layers, and internal electrode layers separated from each other in the capacitor body by the dielectric layers. Each internal electrode layer has one or two leads and includes at least one copla... | 10/06/2009 |
| 7595973 | Multilayer chip capacitor and circuit board apparatus having the capacitor There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units disposed in a laminated direction; first to fourth outer electrodes formed on side surfaces of the capacitor body, respectively; and at least one con... | 09/29/2009 |
| 7589952 | Multilayer electronic device and method for manufacturing the same A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, f... | 09/15/2009 |
| 7589951 | Laminated electronic component and method for manufacturing the same A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 Î... | 09/15/2009 |
| 7589953 | Multilayer capacitor A multilayer capacitor has a first inner electrode connected to a first terminal electrode, a second inner electrode connected to a second terminal electrode, and third and fourth inner electrodes connected to third and fourth terminal electrodes. The first and seco... | 09/15/2009 |
| 7576968 | Plated terminations and method of forming using electrolytic plating A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes ... | 08/18/2009 |
| 7573698 | Window via capacitors A method of forming a window via capacitor comprises a first step of providing a plurality of interleaved dielectric layers and paired electrode layers to create a multilayered arrangement characterized by top and bottom surfaces and a plurality pf side surfaces. Fi... | 08/11/2009 |
| 7570477 | Ceramic electronic component and method for manufacturing the same In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resi... | 08/04/2009 |
| 7567425 | Multilayer chip capacitor There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units; and first to fourth outer electrodes, wherein the first capacitor unit includes at least one pair of first and second inner electrodes, the second c... | 07/28/2009 |
| 7558049 | Multilayer capacitor array Among a plurality of first inner electrodes, at least one first inner and a second inner electrode are arranged as opposed with at least one of the dielectric layers in between. Third and fourth inner electrodes are arranged as opposed with at least one of the diele... | 07/07/2009 |
| 7545624 | Multilayer chip capacitor A multilayer chip capacitor including: a capacitor body where a plurality of dielectric layers are deposited, the capacitor body having opposing first and second sides and opposing third and fourth sides; a plurality of layers of internal electrodes deposited altern... | 06/09/2009 |
| 7542264 | Capacitor block and laminated board A capacitor block includes a first capacitor electrode connected to a first terminal, a first common capacitor electrode, a third capacitor electrode connected to a third terminal, a second common capacitor electrode, and a second capacitor electrode connected to a ... | 06/02/2009 |
| 7529077 | Composite electronic component A composite electronic component has: a first multilayer section including an electrode layer; and a second multilayer section laid on the first multilayer section and including at least one ground electrode layer on which a ground electrode is formed, and at least ... | 05/05/2009 |
| 7508647 | Multilayer capacitor In a multilayer capacitor including a capacitor body, first capacitor portions and a second capacitor portion are arranged in the direction of lamination. While a resonant frequency of the first capacitor portions is set to be greater than a resonant frequency of th... | 03/24/2009 |
| 7502216 | Multilayer chip capacitor A multilayer chip capacitor includes: a capacitor body; internal electrodes disposed in the capacitor body, each internal electrode having one or more lead; and external electrodes disposed on first and second side surfaces of the capacitor body to be electrically c... | 03/10/2009 |
| 7495884 | Multilayer capacitor A multilayer capacitor has a capacitor element body of a nearly rectangular parallelepiped shape in which a signal electrode layer and a GND electrode layer are laminated with a dielectric layer in between, and signal terminal electrodes and GND terminal electrodes ... | 02/24/2009 |
| 7495885 | Multilayer capacitor A multilayer capacitor has a capacitor element, inner electrodes arranged within the capacitor element, and first to fourth terminal electrodes. Electrode parts of the first to fourth terminal electrodes cover ridges formed between first and third side faces, first ... | 02/24/2009 |
| 7468881 | Multilayer electronic component A multilayer electronic component has: a first capacitive electrode layer of a rectangular shape on which four capacitive electrode portions are formed at four comers; and a ground electrode layer which is laid on the first capacitive electrode layer and on which a ... | 12/23/2008 |
| 7466535 | Multilayer capacitor In a multilayer capacitor including a capacitor body, first capacitor portions and a second capacitor portion are arranged in the direction of lamination. While a resonant frequency of the first capacitor portions is set to be greater than a resonant frequency of th... | 12/16/2008 |
| 7460355 | Multilayer capacitor and method of manufacturing same A multilayer capacitor comprises a multilayer body in which a plurality of dielectric layers and a plurality of first and second inner electrodes are laminated alternately, and first and second terminal electrodes arranged on the multilayer body. The first terminal ... | 12/02/2008 |
| 7457099 | Multilayer capacitor A multilayer capacitor has a capacitor element, inner electrodes arranged within the capacitor element, and first terminal electrodes and second terminal electrodes arranged on the capacitor element. The capacitor element has an element part held between the inner e... | 11/25/2008 |
| 7443649 | Ferroelectric capacitor A ferroelectric capacitor including a lower electrode, a ferroelectric layer and an upper electrode. A part of at least any one of the lower and upper electrodes is formed of a material selected from the group consisting of TiOx, TaOx, ReOx, WOx, IrO2, Pt... | 10/28/2008 |
| 7439199 | Capacitive element, method of manufacture of the same, and semiconductor device A capacitive element is characterized by including: a base (12); a lower barrier layer (13) formed on the base (12); capacitors (Q1 and Q2) made by forming a lower electrode (14a), capacitor dielectric layers ... | 10/21/2008 |
| 7440256 | Laminated ceramic substrate and manufacturing method therefor A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly ab... | 10/21/2008 |
| 7436649 | Ceramic electronic component and method for manufacturing the same The heat resistance of a joint between a terminal electrode and a metal terminal as well as the bonding strength of the joint are increased in a ceramic electronic component. The surface of the metal terminal in contact with a binder is formed of a coating layer whi... | 10/14/2008 |
| 7435360 | Manufacturing process of conductive composition and a manufacturing process of conductive paste A manufacturing method of conductive paste comprising arranging process (S20 to S23) of ceramics particles, arranging process (S10 to S14) of wetted metal particles, forming process (S30) of slurry wherein metal particles and ceram... | 10/14/2008 |
| 7436650 | Laminated ceramic capacitor A laminated ceramic capacitor has a high breakdown voltage and excellent withstand-voltage performance, and prevents cracks generated during firing even when the number of lamination layers constituted by ceramic layers and inner electrode layers is increased. The l... | 10/14/2008 |
| 7436648 | Multilayer capacitor and mounted structure thereof A multilayer capacitor has a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and terminal electrodes formed on each of two mutually opposed side faces of the multilayer body. Each internal electrode layer includes ... | 10/14/2008 |