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| Number | Title | Issue Date |
| 8184303 | Film-thickness measurement method and apparatus therefor, and thin-film device fabrication system Objects are to reduce the burden on an operator and to improve fabrication efficiency. A transparent conductive film or a transparent optical film formed on a substrate W is irradiated with line illumination light by means of a line illumination device 3, lin... | 05/22/2012 |
| 8184302 | Measuring system for optical monitoring of coating processes The invention concerns a measuring system for optical monitoring of coating processes in a vacuum chamber, in which the light source is arranged inside the vacuum chamber between the substrate carrier and a shutter is arranged beneath the substrate carrier and the l... | 05/22/2012 |
| 8174708 | Analysis of molecular interactions on and/or in thin layers The invention relates to a carrier for a thin layer and a method for the analysis of molecular interactions on and/or in such a thin layer. A thin layer disposed on a carrier is illuminated with electromagnetic radiation from at least one radiation source and a refl... | 05/08/2012 |
| 8164760 | Method and system for interrogating the thickness of a carbon layer A method and system for interrogating a thickness of a carbon layer are described. The carbon layer resides on at least one of a magnetic recording head and a magnetic recording disk. The method and system include providing an enhancement film on the carbon layer. T... | 04/24/2012 |
| 8125654 | Methods and apparatus for measuring substrate edge thickness during polishing Systems, methods and apparatus are provided for determining a substrate polishing endpoint. The invention includes a light source adapted to transmit light to an edge of a substrate; one or more detectors adapted to detect an arrangement of light reflected from the ... | 02/28/2012 |
| 8102542 | Method and apparatus for layer thickness measurement A technique for optical measurement of a thickness of a layer on a surface uses diffuse reflections at opposite boundaries of the layer, operates on transparent, or translucent layers. The thickness is determined by computing a separation between the centers of the ... | 01/24/2012 |
| 8072616 | Application of crossed teflon diffuser to coatings on oriented surfaces A system and method for measuring coating thickness upon a substrate containing directionally oriented elements is disclosed. A near infrared light is directed upon the coating and reflected near infrared light is collected to determine the coating thickness. A pair... | 12/06/2011 |
| 8064072 | Method and apparatus for thickness measurement The material strength of extensive objects can be determined efficiently by using two distance measures, wherein a first distance measurer determines the distance to a first main surface of the object and a second distance measurer determines the distance to a secon... | 11/22/2011 |
| 8059282 | Reflective film thickness measurement method A reflective film thickness measurement method includes reading an original spectral image of a thin film measured by a broadband light source passing through a measurement system, transforming the original spectral image into a broadband reflectance wavelength func... | 11/15/2011 |
| 8040532 | Thin films measurement method and system A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at leas... | 10/18/2011 |
| 8014004 | Determining physical property of substrate A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, ... | 09/06/2011 |
| 8004695 | Measurement of film thickness in motor exhaust systems Systems and methods are provided for measuring the thickness of a film on an interior surface of an exhaust pipe system of a vehicle. The film is typically a layer of a nitrogen-oxides reductant, such as urea, deposited during operation of a selective catalytic redu... | 08/23/2011 |
| 7969586 | Electronic leveling apparatus and method An electronic leveling apparatus for optically measuring a height difference relative to a leveling staff comprises a telescope, a camera fixed to the telescope, a first actuator for rotating both said telescope and said camera in a horizontal plane about a fixed ve... | 06/28/2011 |
| 7933027 | Processing waveform-based NDE A computer implemented process for simultaneously measuring the velocity of terahertz electromagnetic radiation in a dielectric material sample without prior knowledge of the thickness of the sample and for measuring the thickness of a material sample using terahert... | 04/26/2011 |
| 7903265 | Method for measuring coating uniformity A method of determining thickness uniformity of a coating, the coating being formed on the surface of an object, the method comprising determining coating thickness data within portions of the surface, the portions including at least one generally concave portion an... | 03/08/2011 |
| 7894080 | Width and thickness detecting mechanism of a shredder A width and thickness detecting mechanism of a shredder includes a shredding path, a first width sensor, a second width sensor, a third width sensor, a thickness detecting module, and a control unit. The thickness detecting module includes two thickness sensors. Aft... | 02/22/2011 |
| 7889358 | Color filter inspection method, color filter manufacturing method, and color filter inspection apparatus Included are an illumination lamp (2) for illuminating a color filter edge (23) at a predetermined angle of incidence, a sensor (3) for taking at least two images by imaging light reflected at a predetermined angle different from the angle of in... | 02/15/2011 |
| 7869062 | Apparatus for supporting substrate, apparatus for measuring surface potential, apparatus for measuring film thickness, and apparatus for inspecting substrate In a substrate supporting apparatus of a surface potential measuring apparatus, a first fluid is ejected around a target region on an upper surface of a substrate from a circular-shaped first porous member of a first fluid ejection part and a second fluid is ejected... | 01/11/2011 |
| 7864344 | Method and system for measuring patterned structures A method and system are presented for determining a line profile in a patterned structure, aimed at controlling a process of manufacture of the structure. The patterned structure comprises a plurality of different layers, the pattern in the structure being formed by... | 01/04/2011 |
| 7835017 | Lithographic apparatus, method of exposing a substrate, method of measurement, device manufacturing method, and device manufactured thereby A method of exposing a substrate (e.g. in a lithographic apparatus comprising a substrate table to support a substrate) according to one embodiment of the invention includes performing first and a second height measurement of a part of at least one substrate with a ... | 11/16/2010 |
| RE41906 | Two dimensional beam deflector A two dimensional beam deflector is disclosed which deflects beams from multiple optical assemblies. The input of beams of the multiple optical assemblies follow parallel optical paths until deflection to a wafer. An ellipsometer using a two-dimensional beam deflect... | 11/02/2010 |
| 7821655 | In-situ absolute measurement process and apparatus for film thickness, film removal rate, and removal endpoint prediction An apparatus and process for in-situ measurement of thin film thickness, ash rate, and end point generally include generating and measuring shallow angle interference patterns. The apparatus generally includes a chamber having a first viewing port and a second viewi... | 10/26/2010 |
| 7817289 | Methods and apparatus for measuring thickness of etching residues on a substrate A method of determining a thickness of a residue layer on a substrate includes: (1) taking a first set of optical scatterometry measurements on the substrate after an etching procedure; (2) taking a second set of optical scatterometry measurements on the substrate a... | 10/19/2010 |
| 7782471 | Optical method for the characterization of laterally-patterned samples in integrated circuits Disclosed is a method for characterizing a sample having a structure disposed on or within the sample, comprising the steps of applying a first pulse of light to a surface of the sample for creating a propagating strain pulse in the sample, applying a second pulse o... | 08/24/2010 |
| 7768659 | Determining copper concentration in spectra Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described. ... | 08/03/2010 |
| 7755776 | Inspection system and inspection method There is a need for inspecting a heightwise variation in a sample. A holder holds a sample. A charge control unit charges the sample held by the holder. A retarding power supply applies a voltage to the sample held by the holder. An electro-optic system radiates an ... | 07/13/2010 |
| 7746485 | Determining physical property of substrate A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, ... | 06/29/2010 |
| 7738119 | Optical inspection system for a wafer Provided is an optical inspection system for a semiconductor wafer, by which a threshold value optimal for inspection can be determined and optical inspection of each chip can be performed based on the threshold value, by obtaining in advance a table indicating a re... | 06/15/2010 |
| 7719697 | Probe for measuring the thickness of frost accretion on a surface A probe for measuring the thickness of frost accretion on a surface includes a plurality of measuring stages that are stacked substantially orthogonally to the base of the probe. Each measuring stage has an emitter that emits a light beam that is substantially paral... | 05/18/2010 |
| 7692801 | Optical stacked structure inspecting method and optical stacked structure inspecting apparatus An inspecting method inspects an optical stacked structure having a reflection layer and at least one light transmitting thin film sequentially stacked on a substrate. The inspecting method irradiates inspection light on the optical stacked structure from a side pro... | 04/06/2010 |
| 7675634 | Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through th... | 03/09/2010 |
| 7663769 | Sheet thickness measuring device and image forming apparatus A sheet thickness measuring device includes: an illumination unit that outputs a light that is illuminated into a stack of sheets from a first area defined on one of faces including a top face, a bottom face, and side faces of the stack of sheets; a detection unit t... | 02/16/2010 |
| 7626712 | Methods and systems for characterizing semiconductor materials Methods for determining parameters of a semiconductor material, for example, non-classical substrates such as silicon-on-insulator (SOI) substrates, strained silicon-on-insulator (sSOI) substrates, silicon-germanium-on-insulator (GeOI) substrates, and strained silic... | 12/01/2009 |
| 7599076 | Method for optically detecting height of a specimen and charged particle beam apparatus using the same The present invention provides an optical height detection method and electron beam apparatus to which the method is applied, in which the focusing accuracy of the CD-SEM apparatus, a SEM inspection apparatus, and others is improved by reducing detection errors and ... | 10/06/2009 |
| 7595896 | Thin films measurement method and system A method and system are presented for use in controlling the processing of a structure. First measured data is provided being indicative of at least one of the following: a thickness (d2) of at least one layer (L2) of the structure W in at leas... | 09/29/2009 |
| 7580138 | Methods and systems for characterizing semiconductor materials Methods for determining parameters of a semiconductor material, in particular non-classical substrates such as silicon-on-insulator (SOI) substrates, strained silicon-on-insulator (sSOI) substrates, silicon-germanium-on-insulator (GOI) substrates, and strained silic... | 08/25/2009 |
| 7573586 | Method and system for measuring a coating thickness A method of measuring a coating thickness involves projecting a pattern of light on a surface. A first reflection of the pattern of light is received by a first image capturing device. A second reflection of the pattern of light is received by an image capturing dev... | 08/11/2009 |
| 7570372 | Optical device for measuring the thickness of an at least partially transparent medium The inventive optical device for measuring the thickness of a medium which is at least partially transparent for an incident beam and covers a second medium comprises a laser for generating the light incident beam in such a way that a beam reflected by the first med... | 08/04/2009 |
| 7508531 | System and method for measuring germanium concentration for manufacturing control of BiCMOS films A system and method is disclosed for measuring a germanium concentration in a semiconductor wafer for manufacturing control of BiCMOS films. Germanium is deposited over a silicon substrate layer to form a silicon germanium film. Then a rapid thermal oxidation (RTO) ... | 03/24/2009 |
| 7505154 | Optical method for the characterization of laterally patterned samples in integrated circuits Disclosed is a method for characterizing a sample having a structure disposed on or within the sample, comprising the steps of applying a first pulse of light to a surface of the sample for creating a propagating strain pulse in the sample, applying a second pulse o... | 03/17/2009 |
