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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 8081057 | Current protection device and the method for forming the same A current protection device comprises a substrate having an upper portion and a lower portion; a fusing layer installed between the upper portion and the lower portion; ends of the fusing layer exposed from the substrate; a cavity formed near surfaces of the fusing ... | 12/20/2011 |
| 7884698 | Electronic component, and method for manufacturing the same An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the ... | 02/08/2011 |
| 7570148 | Low resistance polymer matrix fuse apparatus and method A low resistance fuse includes a fuse element layer, and first and second intermediate insulation layers extending on opposite sides of the fuse element layer and coupled thereto. The fuse element layer is formed on the first intermediate insulation layer and the se... | 08/04/2009 |
| 7489230 | Semiconductor device and method of manufacturing the same A semiconductor device includes a first insulating layer, which is formed on a semiconductor substrate (not shown), and formed with a concave portion, and an electric fuse which has a conductive member, a first terminal provided on one end and a second terminal prov... | 02/10/2009 |
| 7489229 | Fuse component A fuse component includes an electrically insulating substrate having a top surface, a thick film fuse element applied to the top surface and a cover layer. The cover layer is made of an electrically insulating material having good caloric conductivity. The cover la... | 02/10/2009 |
| 7477130 | Dual fuse link thin film fuse A surface mount fuse having a plurality of fusible links is provided. The links are located on opposite sides of an insulative substrate or one otherwise thermally insulated or decoupled from one another. The fuse links entered to terminals that can be asymmetricall... | 01/13/2009 |
| 7436284 | Low resistance polymer matrix fuse apparatus and method A low resistance fuse includes a polymer membrane, a fuse element layer formed on the polymer membrane, and first and second intermediate insulation layers extending on opposite sides of the fuse element layer and coupled thereto. At least one of the first and secon... | 10/14/2008 |
| 7429780 | Fuse circuit and semiconductor device including the same A semiconductor device includes a fuse circuit, which includes a first conductive region and a second conductive region. The first conductive region has a multi-layered structure, and the second conductive region has a less layered structure than the first conductiv... | 09/30/2008 |
| 7417526 | Self-configuring component by means of arcing A component with an internal conductor is so configured that it is ruptured at a predetermined position while forming an arc, if predetermined current/voltage conditions occur at the terminals of the component. The component includes a circuit element which is so ar... | 08/26/2008 |
| 7414513 | Organic component for overvoltage protection and associated circuit The invention concerns a component of predominantly organic material which affords overvoltage protection for electronic circuits, and a circuit by which a multiple of the threshold voltage of an individual component can be implemented. ... | 08/19/2008 |
| 7385475 | Low resistance polymer matrix fuse apparatus and method A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermedia... | 06/10/2008 |
| 7354805 | Method of making electrically programmable fuse for silicon-on-insulator (SOI) technology A fuse structure and method of forming the same is described, wherein the body of the fuse is formed from a crystalline semiconductor body on an insulator, preferably of a silicon-on-insulator wafer, surrounded by a fill-in dielectric. The fill-in dielectric is pref... | 04/08/2008 |
| 7332791 | Electrically programmable polysilicon fuse with multiple level resistance and programming A method to form a programmable resistor device in an integrated circuit device is achieved. The method comprises depositing a semiconductor layer overlying a substrate. The semiconductor layer is patterned to form a plurality of lines. The lines are electrically pa... | 02/19/2008 |
| 7304366 | Self correcting multiple-link fuse An improved fuse link structure and fuse blowing method, the fuse-link structure including a plurality of elongated fuse-link members comprising polysilicon electrically connected in parallel according to a common input Voltage contact and common output current cont... | 12/04/2007 |
| 7301432 | Fusing terminal device A fusible link device comprising a housing that contains terminals for terminating incoming/outgoing wires, and that also contains a fusible link that interconnects a pair of the terminals in series, the fusible link device providing a self-contained unit/module for... | 11/27/2007 |
| 7288804 | Electrically programmable π-shaped fuse structures and methods of fabrication thereof Electrically programmable fuse structures for an integrated circuit and methods of fabrication thereof are presented, wherein the electrically programmable fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The first te... | 10/30/2007 |
| 7286037 | Protective element A protective element with improved spherical segmentation performance during the melting of a low-melting metal member, has a heat-generating member and a low-melting metal member on a substrate, in which the low-melting metal member is heated and blown out by the h... | 10/23/2007 |
| 7273788 | Ultra-thin semiconductors bonded on glass substrates A method for forming a semiconductor on insulator structure includes providing a glass substrate, providing a semiconductor wafer, and performing a bonding cut process on the semiconductor wafer and the glass substrate to provide a thin semiconductor layer bonded to... | 09/25/2007 |
| 7242072 | Electrically programmable fuse for silicon-on-insulator (SOI) technology A fuse structure and method of forming the same is described, wherein the body of the fuse is formed from a crystalline semiconductor body on an insulator, preferably of a silicon-on-insulator wafer, surrounded by a fill-in dielectric. The fill-in dielectric is pref... | 07/10/2007 |
| 7224255 | Overheat protection device for movable body surface, overheat protection apparatus using the same and temperature control device An overheat protection device for a movable body surface includes a thermal fuse having a fuse element which melts at a predetermined temperature, bridges electrodes in a pair and melts at a temperature equal to or higher than the predetermined temperature to break ... | 05/29/2007 |
| 7215001 | Semiconductor device and method of manufacturing the same A semiconductor device capable of controlling an operation of a fuse element by increasing a resistance of the fuse element without fusing the fuse wiring by the laser beam irradiation comprises a semiconductor substrate, a first wiring formed above the semiconducto... | 05/08/2007 |
| 7209027 | Fuse structure A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region h... | 04/24/2007 |
| 7176551 | Fuse structure for a semiconductor device A fuse structure for a semiconductor device is provided. The fuse structure includes a fuse layer between the upper and lower insulating layers. The fuse layer is connected to the other metal layers through the via plugs. The fuse layer includes at least two separat... | 02/13/2007 |
| 7170387 | Fuse structure A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region h... | 01/30/2007 |
| 7154160 | Semiconductor fuse box and method for fabricating the same A semiconductor fuse box includes a fuse structure and a protective structure disposed between the fuse structure and an integrated circuit structure. The protective structure has at least one irregular side surface. The protective structure (which may also include ... | 12/26/2006 |
| 7148424 | Disposable electronic devices with deconstructable construction and method A disposable electronic device has a body constructed of juxtaposed lengths of an elongate, ribbon-like substrate of dielectric material secured together to establish a multiple-layered self-sustaining structure, and circuitry formed on the substrate. At least a por... | 12/12/2006 |
| 7119653 | Fuse element A fuse element is formed integrally from a conductive metal plate such that two narrow portions are formed side by side between a pair of electrical connection portions. The narrow portions each assume an arch shape and constitute a parallel conductive path. Arch-sh... | 10/10/2006 |
| 7116208 | Printed-circuit board with fuse A printed wiring board includes a substrate (20) on which a wiring pattern (12) has been formed, and a fuse (6) provided on the substrate (20). One end of the fuse (6) is directly connected to a first pad (12a) of the... | 10/03/2006 |
| 7109564 | Low power fuse structure and method of making the same A fuse comprises a silicide element disposed above a substrate, a first terminal contact coupled to a first end of the silicide element, and a first metal line disposed above the silicide element and coupled to the first terminal contact. The fuse further comprises ... | 09/19/2006 |
| 7106164 | Apparatus and method for electronic fuse with improved ESD tolerance Tolerance to ESD is increased in an electronic fuse by providing at least one non-conductive region adjacent to a conductive region on the surface of an insulator. Such an arrangement reduces the thermal stresses imposed on the insulator in high current applications... | 09/12/2006 |
| 7088216 | Protective device Protective devices for preventing overcurrent and overvoltage are disclosed. The devices includes a base substrate, a pair of electrodes formed on the base substrate, and a low-melting metal element connected between the pair of electrodes to interrupt the current f... | 08/08/2006 |
| 7068141 | Thermal fuse A thermal fuse having a quick melting property is provided. In the thermal fuse, metal layers 15, 16 connected to a fusible alloy 13 are provided at respective leading ends of a pair of metal terminals 11. The metal layers 15, 16 have lar... | 06/27/2006 |
| 7042327 | Alloy type thermal fuse and wire member for a thermal fuse element An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, the operating temperature belongs to the range of 130 to 170° C., the overload characteristic and the dielectric breakdown characteristic are excellent, the insulation stability a... | 05/09/2006 |
| 7034378 | Fuse structure used in an integrated circuit device A novel fuse structure. An optimal position of laser spot is defined above a substrate. A first conductive layer is formed on part of the substrate. A dielectric layer is formed on the substrate and the first conductive layer. A second conductive layer comprising th... | 04/25/2006 |
| 7008854 | Silicon oxycarbide substrates for bonded silicon on insulator A method for forming a semiconductor on insulator structure includes forming a semiconductor layer on an insulating substrate, where the substrate is a different material than the semiconductor layer, and has a coefficient of thermal expansion substantially equal to... | 03/07/2006 |
| 6970394 | Programming method for electrical fuse cell and circuit thereof A programming method for fuse cells. A core circuit is applied with a first power voltage. The fuse cell includes an electrical fuse element connected to a common node, and a driver device connected between the electrical fuse element and a ground node. The ground n... | 11/29/2005 |
| 6960978 | Fuse structure A fuse structure is described. The fuse structure includes a first region adapted to be coupled to a voltage source, a second region adapted to be coupled to a ground, and a current flow region disposed between the first and second regions. The current flow region h... | 11/01/2005 |
| 6936775 | Selectively configurable circuit board Embodiments of the invention provide thermally actuatable switches and selectively configurable circuit boards which may employ such switches. A circuit board of one embodiment includes a substrate having board leads and a plurality of electrical connectors arranged... | 08/30/2005 |
| 6927100 | Method of fabricating semiconductor device having blocking layer and fuse The semiconductor device comprises: an insulation film 72 having a contact hole 74 which reaches a substrate 10 formed in; an interconnection layer 78 connected to the substrate 10 through the contact hole 74; a blocking lay... | 08/09/2005 |
| 6926387 | Electrodes for a drop-on demand printer The invention provides a drop-on-demand printer having a row of ink ejection locations for ejecting plural ink droplets, each ejection location having an associated ejection electrode for causing electrostatic ejection of the droplets from the respective ejection lo... | 08/09/2005 |
