Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Number | Title | Issue Date |
| 8169276 | Vertical transmission line structure that includes bump elements for flip-chip mounting A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reduci... | 05/01/2012 |
| 8169275 | Circuit board with jumper structure A circuit board with jumper structure is disclosed. The circuit board includes a substrate, a ground layer, a first signal transmission line, and a second signal transmission line. The ground layer is formed on a second plane of the substrate. The first signal trans... | 05/01/2012 |
| 8164397 | Method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications A method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications. A method includes: forming a plurality of openings in a ground plane associated with a signal line; forming a plurality... | 04/24/2012 |
| 8164396 | Harmonic processing circuit and amplifying circuit using the same The present invention provides a harmonic processing circuit capable of miniaturizing a circuit, and an amplifier circuit using this harmonic processing circuit. A first impedance adjustment section and a second impedance adjustment section are provided. The ... | 04/24/2012 |
| 8125292 | Coaxial line to planar RF transmission line transition using a microstrip portion of greater width than the RF transmission line A coaxial transition includes a first conductor aligned along a first axis. The transition also includes a ground shield surrounding the first conductor such that a first gap exists between the first conductor and the ground shield. An electric field radiates betwee... | 02/28/2012 |
| 8115567 | Method and system for matching networks embedded in an integrated circuit package Methods and systems for matching networks embedded in an integrated circuit package are disclosed and may include controlling impedance within an integrated circuit via one or more impedance matching networks. The impedance matching networks may be embedded within a... | 02/14/2012 |
| 8115568 | Layout of a circuit board with stacked signal and reference layers and an opening in the reference layer A layout of a circuit board includes a first signal layer, a second signal layer, and a third signal layer. The first signal layer has a transmission line. The second signal layer is stacked below the first signal layer, and has an opening. The third signal layer is... | 02/14/2012 |
| 8085112 | Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor l... | 12/27/2011 |
| 8026774 | Radio frequency signal transmission method with coaxial connection having a dielectric material for impedance matching A radio frequency signal transmission method for transmitting a radio frequency signal through an inner conductor serving as a signal line, the radio frequency signal transmission method including: causing the radio frequency signal to be input to and propagate thro... | 09/27/2011 |
| 8013685 | Broadband transition from a via interconnection to a planar transmission line in a multilayer substrate According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor l... | 09/06/2011 |
| 7969257 | Tunable microwave devices with auto-adjusting matching circuit An embodiment of the present invention provides an apparatus, comprising a power amplifier with a tunable impedance matching circuit including a plurality of tunable dielectric varactors and a DC voltage source interface capable of providing voltage to said pluralit... | 06/28/2011 |
| 7952449 | Coaxial connector having a dielectric material for impedance matching A coaxial connector includes a first inner conductor and a second inner conductor. A capacitor connects between the first inner conductor and the second inner conductor. An outer conductor extends along and surrounds the first and second inner conductors and the cap... | 05/31/2011 |
| 7940144 | Substrate with embedded signal line and ground planes with a slot therein A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two groun... | 05/10/2011 |
| 7940143 | Vertical transmission line structure that includes bump elements for flip-chip mounting A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reduci... | 05/10/2011 |
| 7847654 | Multilayer microstripline transmission line transition A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnectin... | 12/07/2010 |
| 7834718 | Signal module with reduced reflections Signal modules and methods for electrically interfacing with an electronic device are provided. The signal module includes a dielectric and a conductor extending through a surface of the dielectric. The surface of the dielectric is located away from perpendicular re... | 11/16/2010 |
| 7830223 | Ground straddling in PTH pinfield for improved impedance High-speed communication links are improved by having differential pairs of traces in a connector pinfield on layers of a multilayer printed circuit board (PCB) to straddle respective rows of reference (ground) pins rather than the respective rows of signal vias. Th... | 11/09/2010 |
| 7795993 | Wiring board, method of designing the same, and electronic apparatus According to one embodiment, a wiring board includes a transmission line provided to perform communications between a first semiconductor chip and a second semiconductor chip, the transmission line is formed of a distributed constant wiring portion having a characte... | 09/14/2010 |
| 7755449 | Printed circuit board having impedance-matched strip transmission line A printed circuit board (PCB) including an impedance-matched strip transmission line includes a strip transmission line including a main line and at least one pair of branch lines branching off from the main line. An upper ground layer is disposed over the strip tra... | 07/13/2010 |
| 7728693 | Tunable microwave devices with auto-adjusting matching circuit An embodiment of the present invention provides an apparatus, comprising a filter; and a matching network coupled to the filter, the matching network including a plurality of voltage tunable dielectric varactors. ... | 06/01/2010 |
| 7724106 | Coaxial connecting part The invention relates to a coaxial connecting part which is used to connect a coaxial plug socket to a circuit carrier in an internal conductor. An elastically flexible bellows made of a conductive material is incorporated therein in order to keep axial and radial f... | 05/25/2010 |
| 7714678 | Tunable microwave devices with auto-adjusting matching circuit An embodiment of the present invention provides an apparatus, comprising a delay line and a matching network coupled to the delay line, the matching network including a plurality of voltage tunable dielectric varactors. ... | 05/11/2010 |
| 7671696 | Radio frequency interconnect circuits and techniques A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which pro... | 03/02/2010 |
| 7671695 | Parallel coupled CPW line filter A parallel coupled CPW line filter is provided, including a first and a second coupled lines arranged on one side of an insulating body and connected in parallel with each other, and a ground arranged on the same plane as the first and the second coupled lines, comp... | 03/02/2010 |
| 7656250 | Differential signal termination block A termination block for connecting a first signal device and a second signal device. The termination block includes a housing, first and second pair of connectors, and an electrical circuit having passive elements that connect the first and second pair of connectors... | 02/02/2010 |
| 7656249 | Matching circuit First, second and third matching parts 110, 120, and 130 are connected in series between a circuit element 199 whose impedance has a frequency characteristic and a circuitry 198 having a constant impedance. The second matching part 120... | 02/02/2010 |
| 7626473 | Signal transmission line for millimeter-wave band Provided is a signal transmission line for a millimeter-wave band. The signal transmission line includes: a dielectric substrate; an input line formed on the dielectric substrate; a pair of serial transmission lines formed on the dielectric substrate, the serial tra... | 12/01/2009 |
| 7619490 | Semiconductor device and adjusting method for semiconductor device An object of the invention is to provide a semiconductor device and an adjusting method for a semiconductor device wherein power source noises and noises radiated as radio waves can be reduced and power source noises inside the semiconductor device can be cut. The o... | 11/17/2009 |
| 7619489 | Semiconductor integrated circuit A semiconductor device comprising a signal transmission line of a microstrip structure, capable of increasing the characteristic impedance of the signal transmission line and reducing coupling between a plurality of signal lines. In a signal transmission line of a m... | 11/17/2009 |
| 7605673 | Transformer for impedance-matching power output of RF amplifier to gas-laser discharge An RF impedance-matching transformer for matching the output impedance of an RF amplifier to the discharge of a gas-discharge laser includes upper and lower dielectric plates arranged face-to-face and bonded together. A primary U-shaped strip winding is embedded in ... | 10/20/2009 |
| 7583160 | Broadband transmission line transformer A broadband transmission line impedance transformer performs impedance transformation with improved frequency response and efficiency across a wide operational bandwidth. In particular, the bandwidth of a transmission line 2:1 impedance transformer may be significan... | 09/01/2009 |
| 7579925 | Adjusting a characteristic of a conductive via stub in a circuit board A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through... | 08/25/2009 |
| 7532085 | Electronic device An electronic device includes a first transmission line, a second transmission line and a ground-coupling portion. The first transmission line is composed of a first signal line transmitting a given high frequency wave signal and a first ground. The second transmiss... | 05/12/2009 |
| 7498897 | Impedance matching circuit, and semiconductor element and radio communication device using the same An impedance matching circuit, a semiconductor element and a radio communication device using the same, adjusting bandwidth while permitting it to be constructed on the semiconductor element by reducing its occupation area. Since a reactance compensating distributed... | 03/03/2009 |
| 7492234 | Printed circuit board A printed circuit board (PCB) includes at least one signal layer, a ground layer, at least two signal lines, and at least one grounded line. The signal lines are arranged on the signal layer for transmitting signals. The grounded line is arranged on the signal layer... | 02/17/2009 |
| 7463111 | Semiconductor device At least one of wiring areas divided by substrate dividing slits includes a region on which none of the strip conductors is located, the region having a U-shape as viewed in plan and enclosing one of the strip conductors on three sides. The length of the enclosed st... | 12/09/2008 |
| 7463112 | Area efficient, differential T-coil impedance-matching circuit for high speed communications applications An integrated circuit (IC) system provides a broadband impedance matching function in a minimal IC area for operation with an external high-speed differential communications channel. The IC system includes a first semi-conductive substrate with a first face and an o... | 12/09/2008 |
| 7459987 | Electrical adaption network with a transformation line A network for electrical matching of an electrical component is disclosed. The network includes n first conductor plane and a second conductor plane separated by a ceramic intermediate layer. The network also includes a transformation line formed in or on a substrat... | 12/02/2008 |
| 7456701 | Flexible substrate and electronic equipment A flexible substrate including: a first part provided with a first device DV1; a second part provided with a second device; a wiring part placed between the first part and the second part and including a plurality of wirings for coupling the first device and ... | 11/25/2008 |
| 7443265 | Method for impedance matching between differential vias and transmission lines A method for impedance matching between differential vias and associated transmission lines is provided. The method includes: deducing a relationship of a space between the differential vias, and a radius of the differential vias while a characteristic impedance of ... | 10/28/2008 |
