Did You Know...
...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 8174335 | Process for reduction of the common mode current for power line communications equipment A process for reducing common-mode current in a power-line communication equipment, where a power-line network is used as a communication medium, includes applying a signal transmitted by the power-line communication equipment via a common-mode choke circuit. The co... | 05/08/2012 |
| 8159311 | High frequency package and manufacturing method thereof A high frequency package in which the resonance frequency of a metal seal ring is high, a reflection loss and a insertion loss of an input terminal and an output terminal are reduced in working frequency, and which has an excellent RF (radio frequency) characteristi... | 04/17/2012 |
| 8134423 | Noise filter and noise-filter-incorporated amplifier circuit A ladder LPF includes a first capacitor formed of a transistor in which two terminals out of three are diode-connected, and a second capacitor formed by connecting a pn junction capacitor and an insulating capacitor in parallel. In the second capacitor, the pn junct... | 03/13/2012 |
| 8130052 | Semiconductor circuit board and semiconductor circuit The present invention is intended to efficiently implement noise countermeasures for a semiconductor circuit board and for a semiconductor circuit. The present invention is constituted by a control substrate, and a semiconductor circuit connected to the control subs... | 03/06/2012 |
| 8125290 | Apparatus for silencing electromagnetic noise Proposed is an apparatus for silencing electromagnetic noise, characterized by a plurality of centrally symmetrical ring-shaped through-via-hole crystalline units provided between a high voltage plane and a low voltage plane at a regular interval, thereby forming an... | 02/28/2012 |
| 8102219 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from t... | 01/24/2012 |
| 8076990 | Communications medium connector with integrated common-mode noise suppression According to one exemplary embodiment, a connector for coupling a communications medium to an electronic device includes a common-mode suppression block coupled to a number of connector pins. The common-mode suppression block is configured to reduce common-mode nois... | 12/13/2011 |
| 8040201 | Substrate having a structure for suppressing noise generated in a power plane and/or a ground plane, and an electronic system including the same A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive laye... | 10/18/2011 |
| 8013684 | Radio frequency noise and interference suppression in an integrated circuit In an integrated circuit having a number of circuit units on a single semiconductor chip, particularly in a system-on-chip integrated circuit including an integrated transceiver, interference between the circuit units is suppressed using on-chip resonant elements. E... | 09/06/2011 |
| 8004369 | Arrangement structure of electromagnetic band-gap for suppressing noise and improving signal integrity An electromagnetic-wave suppression structure in a multilayer PCB or package structure is supplied with a power to be used therein by a power distribution network including a power plane and a ground plane. The multilayer PCB and package includes: an electromagnetic... | 08/23/2011 |
| 7994871 | Chip on film trace routing method for electrical magnetic interference reduction A chip on film (COF) trace routing method for EMI reduction includes: providing a flexible circuit board; mounting a chip that has a first signal pad, a second signal pad and a ground pad on the flexible circuit board; and forming a first signal trace, a second sign... | 08/09/2011 |
| 7990228 | Semiconductor device and wiring part thereof A technique capable of achieving both improvement of mounting density and noise reduction for a semiconductor device is provided. An LSI mounted on a printed wiring board comprises a grounding BGA ball and a power BGA ball to get power supply from the printed wiring... | 08/02/2011 |
| 7978019 | Configuration having an RF component and a method for compensation of linking inductance In a configuration with at least one RF component disposed in a signal path and including a ground connection to an external circuit environment, a coupling element is provided which electromagnetically couples to at least part of the ground connection and at the sa... | 07/12/2011 |
| 7969256 | Signal transmission circuit and signal transmission system with reduced reflection A signal transmission circuit includes a transmitting circuit for outputting a transmitting signal to a transmission line, a parallel circuit including a capacitor and a first resistance connected between an output terminal of the transmitting circuit and the transm... | 06/28/2011 |
| 7952447 | Adaptive EMI reduction technique for wireline PHYS in multi-port applications An adaptive electromagnetic interference (EMI) detection and reduction device for multi-port applications is provided. The invention includes at least two physical devices (PHY), where the PHYs transmit data along wire pairs to a register jack (RJ). The transmission... | 05/31/2011 |
| 7944320 | Electromagnetic bandgap structure and printed circuit board including multi-via An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a... | 05/17/2011 |
| 7936232 | Substrate for semiconductor package A substrate for a semiconductor package includes a dielectric substrate, a circuit pattern formed on a first surface of the dielectric substrate, and an electromagnetic band gap (EGB) pattern. The EGB pattern includes multiple unit structures formed on a second surf... | 05/03/2011 |
| 7924111 | Method and device for transferring single-ended signal with interference-resistance The invention provides a method of transferring single ended signal with interference-resistance. The transmission of the single ended signal includes an input device and an output device. The output device has its signal output terminal connected with a signal inpu... | 04/12/2011 |
| 7911289 | Filter with magnetic layer and manufacturing method thereof A filter includes a first magnetic layer, a second magnetic layer, an insulating layer, a plurality of coils, a first non-magnetic layer and a second non-magnetic layer. The insulating layer is disposed between the first magnetic layer and the second magnetic layer,... | 03/22/2011 |
| 7902938 | Data transmitter, data transmission line, and data transmission method A data transmitter uses a transmission line including a ground conductor (305), a signal conductor (201), and an insulating material (3) which insulates them from each other. The insulating material includes a dielectric (320) exhibiting ... | 03/08/2011 |
| 7889021 | Reception of wideband signals with high temperature superconducting components to reduce co-site interference A comb limiter combiner for front end filtering reduces bit error rates with an increased reception range. Notch filters are tuned to suppress interfering frequency-hopped signals. An output comb filter suppresses out-of-band intermodulation products generated by an... | 02/15/2011 |
| 7889020 | Asymmetrical filter Disclosed is methodology and apparatus for producing an asymmetrical filter for use with implantable medical devices, and in other input filtering environments. Differing forward and reverse characteristic responses are provided by inserting a low value resistor in ... | 02/15/2011 |
| 7863995 | Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS A transient voltage suppressing (TVS) circuit with uni-directional blocking and symmetric bi-directional blocking capabilities integrated with an electromagnetic interference (EMI) filter supported on a semiconductor substrate of a first conductivity type. The TVS c... | 01/04/2011 |
| 7795987 | Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS A transient voltage suppressing (TVS) circuit with uni-directional blocking and symmetric bi-directional blocking capabilities integrated with an electromagnetic interference (EMI) filter supported on a semiconductor substrate of a first conductivity type. The TVS c... | 09/14/2010 |
| 7772938 | Electrical multiple-wire system for push-pull signal transmission with an attenuating or filtering element and data transmission bus The electric multiple conductor system (1) is used for the transmission of signals in differential mode, and has two signal lines (5, 6) and a shared reference line (7). Each signal line (5, 6) includes an attenuation or filter element ( | 08/10/2010 |
| 7760044 | Substrate for semiconductor package A substrate for a semiconductor package comprises a dielectric substrate, a circuit pattern, and an electromagnetic band gap (EBG) pattern. The circuit pattern is formed on a first surface of the dielectric substrate and is connected to ground via a ground connectio... | 07/20/2010 |
| 7728692 | Reduction of noise in a metallic conductor signal pair using controlled line balancing and common mode impedance reduction In order to reduce noise on twisted metallic pair signal conductors, circuits are disclosed in which the signal balance between the wires of the pair is significantly improved, thereby reducing the line's susceptibility to external electromagnetic interference and e... | 06/01/2010 |
| 7705691 | Capacitor interconnection A substrate for power decoupling and a method of forming a substrate for power decoupling. The substrate comprises one or more decoupling capacitors; and one or more interconnections to the decoupling capacitors. At least one of the interconnections comprises a loss... | 04/27/2010 |
| 7623001 | Electromagnetic interference eliminating apparatus An electromagnetic interference eliminating apparatus includes a multi-stage filter that is composed of inductors, capacitors and resistors, and an active filter. The multi-stage filter receives an input signal and provides an eliminating band to eliminate the noise... | 11/24/2009 |
| 7518463 | Circuit assembly with conical inductor A circuit assembly has a conical inductor disposed in a slot formed in a substrate. ... | 04/14/2009 |
| 7498895 | Noise filter, outdoor unit and air conditioner A noise filter eliminates noise generated by a noise generating source in an outdoor unit in an air conditioner. Power is supplied from a power source to an indoor unit via the outdoor unit. A choke coil is formed by winding power source lines and indoor/outdoor lin... | 03/03/2009 |
| 7459986 | Method and apparatus for rejecting common mode signals on a printed circuit board and method for making same In one embodiment, the invention is an apparatus. The apparatus includes a pair of parallel traces on a first level of a PCB (printed circuit board). The apparatus also includes a stub on a second level of the PCB. The stub is parallel to the pair of parallel traces... | 12/02/2008 |
| 7432781 | Monolithic duplexer and fabrication method thereof A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer, a plurality of elements distanced from each other on a top portion of a device wafer, first sealing parts formed on the top portion of the device wafer, and a pl... | 10/07/2008 |
| 7432782 | Signal splitter A signal splitter includes a low-pass filter circuit for permitting a low-frequency component of an incoming signal in an incoming telephone line coupled to a first connecting port to pass therethrough to a second connecting port, and a coupling circuit including a ... | 10/07/2008 |
| 7426118 | Printed wiring board To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3a is formed on a surface 1a of an insulating substrate 1. A second interconnection pattern 5a | 09/16/2008 |
| 7414491 | Method and apparatus for changing the polarization of a signal A method and apparatus for changing the polarization of an input signal includes propagating a polarized input signal having orthogonal E-field components by at least one surface each having a respective surface impedance and varying at least one of the surface impe... | 08/19/2008 |
| 7408423 | Semiconductor device and adjusting method for semiconductor device An object of the invention is to provide a semiconductor device and an adjusting method for a semiconductor device wherein power source noises and noises radiated as radio waves can be reduced and power source noises inside the semiconductor device can be cut. The o... | 08/05/2008 |
| 7408426 | Method and device for transmission without crosstalk The invention relates to a method and a device for transmission without crosstalk in interconnections used for sending a plurality of signals, such as the interconnections made with flat multiconductor cables, or with the tracks of a printed circuit board, or inside... | 08/05/2008 |
| 7408424 | Compact RF circuit with high common mode attenuation A compact RF differential circuit has a first differential I/O port comprising a first pair of signal carrying terminals which is connected to a source termination and a second differential I/O port comprising a second pair of signal carrying terminals which is conn... | 08/05/2008 |
| 7397322 | Radiation noise suppression circuit for differential transmission line A radiation noise suppression circuit for a differential transmission line includes a differential transmission line which has plus line signal wiring to which a plus line signal of a differential signal is applied, and minus line signal wiring to which a minus line... | 07/08/2008 |
