Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Number | Title | Issue Date |
| 7880489 | Printing of redistribution traces on electronic component A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistr... | 02/01/2011 |
| 7868633 | Modular liquid cooled burn in system An electronic device burn-in thermal management system includes Burn-in-Boards (BIBs) with quick disconnect connectors to easily connect and disconnect the BIB (102) from liquid cooling lines (104, 106) in a rack that can hold one or more BIBs. The BIB... | 01/11/2011 |
| 7863916 | Device mounted apparatus, test head, and electronic device test system A device mounted apparatus includes a board on which a plurality of devices are mounted and a device cooling cover covering the plurality of devices, and formed inside it with a channel through which a refrigerant can flow. The device cooling cover includes a first ... | 01/04/2011 |
| 7855569 | Wafer holder for wafer prober and wafer prober equipped with the same The invention provides a wafer-prober wafer holder that allows positional precision and temperature uniformity to be increased, and also allows the chip to be heated and cooled rapidly, and a wafer prober device provided with the same. The wafer-prober wafer holder ... | 12/21/2010 |
| 7852098 | On-die heating circuit and control loop for rapid heating of the die An integrated circuit includes a heating circuit configured to heat the integrated circuit under the control of a controller. A transfer function with adjustable pole, zero and overall gain is implemented in the controller such that a temperature response of the int... | 12/14/2010 |
| 7839158 | Method of detecting abnormality in burn-in apparatus A method of detecting an abnormality in a burn-in apparatus, which brings a heater and a temperature sensor into contact with various devices under test during a burn-in test and controls power consumption of the heater to adjust levels of temperature of the devices... | 11/23/2010 |
| 7839157 | Surface mount testing system Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and condu... | 11/23/2010 |
| 7834648 | Controlling temperature in a semiconductor device Systems and methods for reducing temperature dissipation during burn-in testing are described. Devices under test are each subject to a body bias voltage. The body bias voltage can be used to control junction temperature (e.g., temperature measured at the device und... | 11/16/2010 |
| 7830164 | Ducted test socket A ducted test socket for thermally testing a device under test (DUT) is provided that can accommodate a large DUT and will improve the thermal transfer efficiency between a precision temperature forcing system (PTFS) and the DUT. The ducted test socket comprises a c... | 11/09/2010 |
| 7812627 | Test device A test device includes a movable mounting table having a temperature controlling mechanism therein; a probe card provided with a plurality of probes positioned above the mounting table; and a first temperature control unit for controlling the temperature controlling... | 10/12/2010 |
| 7772863 | Mechanical decoupling of a probe card assembly to improve thermal response A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the fra... | 08/10/2010 |
| 7768286 | Electronic device testing apparatus and temperature control method in an electronic device testing apparatus An electronic device testing apparatus is described that includes a temperature measurement device for measuring a temperature of an IC device based on a voltage of a thermal diode provided inside the IC device, a temperature sensor and a temperature applying device... | 08/03/2010 |
| 7750655 | Multilayer substrate and probe card It is an object of the present invention to dramatically reduce thermal deformation without using any special material in a multilayer substrate and a probe card. According to the present invention, in a probe card including at least one circuit board connect... | 07/06/2010 |
| 7750654 | Probe method, prober, and electrode reducing/plasma-etching processing mechanism A probe method of this invention includes a step of reducing an electrode of a wafer by using a forming gas, and a step of bringing the electrode and a probe pin into contact with each other in a dry atmosphere. The probe method further includes, prior to a reducing... | 07/06/2010 |
| 7737713 | Apparatus for hot-probing integrated semiconductor circuits on wafers An apparatus for hot-probing integrated semiconductor circuits on wafers is disclosed that includes a support device for accommodating the wafer, a measurement card with electronic circuitry for functional verification of the integrated semiconductor circuits on the... | 06/15/2010 |
| 7719298 | Full-wafer test and burn-in mechanism Assemblies include a substrate, such as a printed circuit board, with a first array of contact pads disposed thereon; a guide ring structure disposed on the substrate and at least partially surrounding the first array of contact pads; a translator socket disposed on... | 05/18/2010 |
| 7714599 | Integrated circuit burn-in test system and associated methods An integrated circuit burn-in test system includes an integrated circuit and a tester. The integrated circuit includes operating circuitry, a heater for heating the operating circuitry, and burn-in test circuitry for testing the operating circuitry while being heate... | 05/11/2010 |
| 7701237 | Semiconductor integrated circuit device, method of testing semiconductor integrated circuit device, and probe card used for burn-in stress and D/S tests According to one embodiment of the invention, a semiconductor chip includes: a test target circuit to which a given burn-in stress is applied; and a burn-in counter that is configured: to acquire a first parameter indicating a test voltage applied to the test target... | 04/20/2010 |
| 7696768 | On-die heating circuit and control loop for rapid heating of the die An integrated circuit includes a heating circuit configured to heat the integrated circuit under the control of a controller. A transfer function with adjustable pole, zero and overall gain is implemented in the controller such that a temperature response of the int... | 04/13/2010 |
| 7696769 | Method of obtaining accurately a heat-dissipating requirement for electronic systems A method of obtaining accurately a heat-dissipating requirement for electronic systems of a same kind uses a thermal analysis software, a passed thermal module with a fan, and a fan speed regulating device. The method includes steps of: (1) connecting the fan to the... | 04/13/2010 |
| 7683649 | Testing system contactor A testing system contactor with an integral temperature measurement sensor. ... | 03/23/2010 |
| 7675307 | Heating apparatus for semiconductor devices A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor ... | 03/09/2010 |
| 7675306 | Prober apparatus and operating method therefor An operating method for a prober apparatus is disclosed which includes controlling the temperature of at least one part of the prober apparatus. Another operating method for a prober apparatus includes production and transfer of thermal energy between means for the ... | 03/09/2010 |
| 7671615 | Method and apparatus for controlling the temperature of electronic components In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact... | 03/02/2010 |
| 7667474 | Probe device A probe device includes a stage for fixing a semiconductor device having an external connection pad; a heating unit provided in the stage, for heating the semiconductor device to a predetermined temperature; and a probe card having a probe pin and a support substrat... | 02/23/2010 |
| 7667475 | Electronics tester with a signal distribution board and a wafer chuck having different coefficients of thermal expansion The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the ... | 02/23/2010 |
| 7667476 | Measuring module for rapid measurement of electrical, electronic and mechanical components at cryogenic temperatures and measuring device having such a module Measuring module for the measurement of an object (6), having a measuring chamber (4), with a contact element (5a, 5b), wherein the object to be measured (6) is thermally connected to a first contact surface (9... | 02/23/2010 |
| 7663389 | Automated test equipment with DIB mounted three dimensional tester electronics bricks Automated test equipment is provided which includes a test head having a tester electronics bricks mounted to a device interface board. In some embodiments, support circuitry is positioned adjacent the tester electronics bricks opposite the DIB. The support circuitr... | 02/16/2010 |
| 7663388 | Active thermal control unit for maintaining the set point temperature of a DUT A thermal control unit (TCU) for maintaining the set point temperature of an IC device under test (DUT) has a thermoelectric module (a Peltier device), a fluid circulation block, a lower pedestal assembly containing a thermal sensor, and an upper cover housing arran... | 02/16/2010 |
| 7663390 | Inspection apparatus and method There are provided an inspection apparatus and method that can locally perform sample temperature regulation, so that the sample drift can be suppressed. There are included a sample stage 109 that holds a semiconductor sample 118, multiple probes 10... | 02/16/2010 |
| 7659738 | Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same A test socket includes a socket body in which a semiconductor package is located, a socket head combined with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element. A test equipment includes the test socket and a... | 02/09/2010 |
| 7656180 | Burn-in board connection device and method A burn-in board connection device includes a first connection unit to hold a burn-in board and move in a first direction perpendicular to the burn-in board that is inserted in a chamber of a burn-in test device, a second connection unit to move in a second direction... | 02/02/2010 |
| 7649371 | Thermal stratification methods A method and apparatus for a thermal stratification test providing cyclical and steady-state stratified environments. In order to test an electronic device, for example one having one or more levels of ball-grid-array interconnections, e.g., connecting a chip to a f... | 01/19/2010 |
| 7642795 | Drive method and drive circuit of peltier element, attaching structure of peltier module and electronic device handling apparatus By limiting a current change rate of a power to be supplied to a peltier element by using a pulse width control means for controlling to increase/decrease a pulse width of a pulse signal so that a temperature change of the peltier element does not exceed a predeterm... | 01/05/2010 |
| 7639030 | Creating a jet impingement pattern for a thermal control system In one embodiment, a head assembly to be adapted about a solid immersion lens includes a plurality of jets configured in a radial pattern that extends from a central portion to a substantial periphery of the head assembly. The jets may expel a liquid coolant stream ... | 12/29/2009 |
| 7639029 | Heat sink pedestal with interface medium chamber A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be ... | 12/29/2009 |
| 7633307 | Method for determining temperature profile in semiconductor manufacturing test A method is provided for testing semiconductor devices. In accordance with the method, a first usage temperature T1 is obtained which represents the maximum or minimum temperature to which a semiconductor device will be exposed during its first use by a c... | 12/15/2009 |
| 7626407 | Miniature fluid-cooled heat sink with integral heater A temperature control device that includes a miniature liquid-cooled heat sink with integral heater and sensing elements is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testi... | 12/01/2009 |
| 7619428 | Wafer level burn-in and electrical test system and method A burn-in and electrical test system (20) includes a temperature controlled zone (22) and a cool zone (24) separated by a transition zone 25. The temperature controlled zone (22) is configured to receive a plurality of wafer cartri... | 11/17/2009 |
| 7619427 | Temperature control device and temperature control method Pressing an electronic device (2) to be tested to contact terminals (132a and 132b) while bringing a heater (112) having equal or close temperature change characteristics to those of the electronic device to be tested by a t... | 11/17/2009 |
