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| Number | Title | Issue Date |
| 7456641 | Probe card that controls a temperature of a probe needle, test apparatus having the probe card, and test method using the test apparatus Provided are a probe card, a test apparatus having the probe card, and a test method using the test apparatus. The probe card includes a probe substrate having a signal line, a probe needle connected to the signal line and fixed to the probe substrate, and a cooling... | 11/25/2008 |
| 7456640 | Structure for coupling probes of probe device to corresponding electrical contacts on product substrate An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate including a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second s... | 11/25/2008 |
| 7456639 | Compliant contact structure A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 11/25/2008 |
| 7453275 | Probe card The board of a probe card of the present invention comprises a first substrate having a first inclined surface at the side surfaces and a second substrate having a second inclined surface. The first substrate and the second substrate are disposed such that the first... | 11/18/2008 |
| 7453276 | Probe for combined signals A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resi... | 11/18/2008 |
| 7449900 | Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof A probe card including probes, a build-up interconnection layer having a multilayer interconnection structure therein and carrying the probes on a top surface in electrical connection with the multilayer interconnection structure, and a capacitor provided on the bui... | 11/11/2008 |
| 7449902 | Probe system A probe apparatus and a probe system are provided. The probe apparatus uses a larger printed circuit board to dispose a plurality of testers. The layout of each of the testers on the circuit board is modified accordingly, such that more number of the testers can be ... | 11/11/2008 |
| 7449901 | Grounding scheme for high speed probing with reduced loop area A grounding scheme for improved high speed probing of a system-under-test (“SUT”) using a ground rail positioned on the SUT near each side of a package attached to the SUT having signal access points, whereby each of the ground rails are electrically connected t... | 11/11/2008 |
| 7449899 | Probe for high frequency signals A high frequency probe has contact tips located within the periphery of a terminal section of a coaxial cable and shielded by a ground conductor of the coaxial cable. ... | 11/11/2008 |
| 7446545 | Anisotropically conductive sheet An anisotropic conductivity sheet (10) comprising an insulating sheet (11) having a number of through-holes (12) and a number of conductive bodies is provided. The insulating sheet (11) has an inner layer (11A) of a heat resistant ... | 11/04/2008 |
| 7446546 | Method and system of trace pull test The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer al... | 11/04/2008 |
| 7446544 | Probe apparatus, wafer inspecting apparatus provided with the probe apparatus and wafer inspecting method A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal electrodes and a contact member, an anisotropically conductive connector arra... | 11/04/2008 |
| 7443190 | Method for testing micro SD devices using each test circuits A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. The method of the illustrative... | 10/28/2008 |
| 7443181 | High performance probe system A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. T... | 10/28/2008 |
| 7443182 | Coordinate transformation device for electrical signal connection There is disclosed a coordinate transformation device for electrical signal connection used for a probe card applicable to narrow pitch pads, which particularly simplifies wiring from the terminal onto the inspection apparatus board and prevents electrical contact f... | 10/28/2008 |
| 7443179 | Zero motion contact actuation A device for testing small electronic components includes a test plate for moving a plurality of spaced electronic components to a test station. A roller is designed to press on the test plate and electronic component exerting a first force between 10-20 grams when ... | 10/28/2008 |
| 7442571 | Semiconductor probe with resistive tip and method of fabricating the same, and information recording apparatus, information reproducing apparatus, and information measuring apparatus having the semiconductor probe Provided are a semiconductor probe having a resistive tip, a method of fabricating the semiconductor probe, and a method of recording and reproducing information using the semiconductor probe. The semiconductor probe includes a tip and a cantilever. The tip is doped... | 10/28/2008 |
| 7443180 | On-chip probing apparatus The invention is directed to an on-chip probing apparatus. In accordance with an embodiment of the present invention, the on-chip probing apparatus includes: a plurality of switches on a chip; a plurality of externally accessible probe points on the chip; and a mult... | 10/28/2008 |
| 7437813 | Probe repair methods A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the pro... | 10/21/2008 |
| 7439751 | Apparatus and method for testing conductive bumps An apparatus and method for testing conductive bumps are provided. An exemplary embodiment of a bump testing unit comprises a support substrate with two probes protruding one surface thereof. A digital detecting device is embedded in the support substrate, comprisin... | 10/21/2008 |
| 7436194 | Shielded probe with low contact resistance for testing a device under test A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. ... | 10/14/2008 |
| 7436192 | Probe skates for electrical testing of convex pad topologies A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe... | 10/14/2008 |
| 7436193 | Thin film probe card contact drive system A probe card includes a flexible membrane, a plurality of probes attached to the flexible membrane, and a layer of foam connected to the flexible membrane so that when the probes are moved into the flexible membrane, the layer of foam is also deflected to produce a ... | 10/14/2008 |
| 7436171 | Apparatus for probing multiple integrated circuit devices A probing apparatus comprises a platform with a rectangular opening, two vertical rails positioned at two sides of the rectangular opening, two vertical sliding modules each including a vertical sliding base positioned on the vertical rail, a bearing member and a pi... | 10/14/2008 |
| 7436191 | Differential measurement probe having a ground clip system for the probing tips A differential measurement probe has a ground clip system for electrically coupling outer shielding conductors of differential probing tips together. In one embodiment, the probing tips independently move vertically relative to each other with the ground clip system... | 10/14/2008 |
| 7432727 | Electric signal connecting device and probe assembly and probing device using the same The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into c... | 10/07/2008 |
| 7432728 | Blade probe and blade probe card A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground ... | 10/07/2008 |
| 7432726 | Probe According to an embodiment, a probe coming into contact with an electrode pad of a measurement object comprises a connection terminal part integrally formed and connected to a substrate, a contact part having a tapered configuration, and a supporting part which supp... | 10/07/2008 |
| 7432698 | Modular active test probe and removable tip module therefor A modular active test probe and removable tip module therefor. Within the scope of the invention, there is a probe tip module comprising a first probe tip adapted for probing a circuit under test to receive a signal therefrom. The probe tip module includes an amplif... | 10/07/2008 |
| 7427768 | Apparatus, unit and method for testing image sensor packages The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packag... | 09/23/2008 |
| 7427869 | Resilient contact probe apparatus Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secure... | 09/23/2008 |
| 7427868 | Active wafer probe A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may have a rigid probing member and include a flexible interconnection between the active circuit and a support structure. The active circuit may have a relatively low capa... | 09/23/2008 |
| 7425837 | Spatial transformer for RF and low current interconnect A spatial transformer includes an insulating substrate; a plurality of test terminal assemblies on the substrate; and a plurality of contact surfaces on the transformer, each providing an interconnection point for electrical connection between a respective test term... | 09/16/2008 |
| 7425838 | Body for keeping a wafer and wafer prober using the same According to the invention, there is provided a wafer holding member for use in a wafer prober for inspecting a semiconductor wafer, including a chuck top and a supporting member for supporting the chuck top, wherein the supporting member has a bottom portion facing... | 09/16/2008 |
| 7423419 | Chuck for holding a device under test A chuck for a probe station. ... | 09/09/2008 |
| 7423439 | Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device In a prove card comprising: a probe sheet having a contact terminal contacting with an electrode provided on a wafer, a wiring led from the contact terminal, and an electrode electrically connected to the wiring; and a multilayered wiring substrate having an electro... | 09/09/2008 |
| 7423441 | Contactor assembly A contactor assembly suitable for high frequency testing and having a large overdrive is to be provided. For this purpose, there is realized a multiple beam-synthesized type contactor assembly including: a resin film constituting a base material; an electroconductiv... | 09/09/2008 |
| 7420381 | Double sided probing structures A test configuration for double sided probing of a device under test includes a holder to secure the device under test in a first orientation, a calibration substrate secured in a second orientation and a probe capable of calibration using the calibration substrate ... | 09/02/2008 |
| 7420106 | Scanning probe characterization of surfaces Characterizing dielectric surfaces by detecting electron tunneling. An apparatus includes an atomic force probe. A mechanical actuator is connected to the atomic force probe. A mechanical modulator is connected to the mechanical actuator. The mechanical modulator mo... | 09/02/2008 |
| 7420382 | Apparatus and method for testing semiconductor chip An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed... | 09/02/2008 |
