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| Number | Title | Issue Date |
| 7382143 | Wafer probe interconnect system A wafer probe interconnect apparatus for use in testing a plurality of uncut chips in a semiconductor wafer. The apparatus includes a support block and a dielectric substrate coupled to the support block and supported on a patterned array of posts to inhibit displac... | 06/03/2008 |
| 7382144 | Test fixture for holding signal terminals or pins and related method for assembling the test fixture A test fixture has a socket, a plurality of signal terminals, and a fixing module. A plurality of holes are formed in the socket for installing the signal terminals. The fixing module is installed on the socket to fix the signal terminals in the holes. The number of... | 06/03/2008 |
| 7382141 | Testing a batch of electrical components The invention relates a method for testing a batch of electrical components like Integrated Circuits, the method involving applying a first test (6) on each electrical component from the batch; and applying a second test (12) on electrical components t... | 06/03/2008 |
| 7378860 | Wafer test head architecture and method of use A wafer test head and ATE for testing semiconductor wafers. The wafer test head having a plurality of sides that can each be used to test a different semiconductor wafer. The architecture of the wafer test head enables electrical connections to probe card located on... | 05/27/2008 |
| 7378836 | Automated loading/unloading of devices for burn-in testing The automatic loading and unloading of devices for burn-in testing is facilitated by loading burn-in boards in a magazine with the stacked boards in the magazine moved into and out of a burn-in oven by means of a trolley. The trolley can include an elevator whereby ... | 05/27/2008 |
| 7378832 | Probing high-frequency signals Apparatus and associated systems and methods may relate to a wide bandwidth cable assembly that may include an active amplification stage to receive high frequency signals (e.g., 1 GHz or above) through a transmission line extending distally to a passive, high densi... | 05/27/2008 |
| 7374293 | Apparatus, system and method for testing electronic elements An electronic element testing apparatus for use with a number of probes. Each probe has a lower pole and an upper pole. The apparatus includes: a first plate having a first side and a second side, the first side having an array of lower pole regions disposed thereab... | 05/20/2008 |
| 7375508 | Device and a process for the calibration of a semiconductor component test system A device and a process for the calibration of a semi-conductor component test system The invention relates to a process and a device for the calibration of a probe card and/or of a semi-conductor component test apparatus including a first connection, at which... | 05/20/2008 |
| 7372250 | Methods and apparatus for determining a position of a substrate relative to a support stage A sensing system includes a plurality of probes arranged in a spaced relation around a stage that is adapted to support a substrate. Each probe includes a detection portion adapted to move from a known starting position toward an edge of the substrate that is suppor... | 05/13/2008 |
| 7372286 | Modular probe card A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circu... | 05/13/2008 |
| 7371128 | Cable terminal with air-enhanced contact pins An electrical connector has a body with a number of probes. Each probe has a spring biased pin with a contact tip, and includes a sleeve receiving the pin. Each sleeve has a first end connected to an incoming conductor, a second end connected to the body and from wh... | 05/13/2008 |
| 7372284 | Method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a VLSI IC package to a substrate or socket A probe for an array of interconnecting leads between a PCA and an IC has one or more contacts extending laterally from or plated upon one or more arms formed of a flexible printed circuit, and connected by traces along the arm(s) to a header that itself affords con... | 05/13/2008 |
| 7372288 | Test apparatus for testing multiple electronic devices There is disclosed a test apparatus including a driver that outputs a test signal, a first switch that is provided between the driver and a terminal of the first device under test, a second switch that is provided between the driver and a terminal of the second devi... | 05/13/2008 |
| 7372287 | Semiconductor device testing apparatus and device interface board A interface board is provided with a first and second contact instruments each comprising a first and second contact terminal groups to which a first to third type semiconductor devices having different numbers of external terminals used can be connected. The first ... | 05/13/2008 |
| 7368930 | Adjustment mechanism A probe card assembly can comprise a support structure to which a plurality of probes can be directly or indirectly attached. The probes can be disposed to contact an electronic device to be tested. The probe card assembly can further comprise actuators, which can b... | 05/06/2008 |
| 7368925 | Probe station with two platens A probe station for testing a device under test. A first platen supporting an electrical probe. A chuck supporting the device under test. A second platen supporting an optical probe. The first platen and the second platen positioned above the device under test. A pe... | 05/06/2008 |
| 7368924 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated... | 05/06/2008 |
| 7368926 | Electric signal connecting device and probe assembly and probing device using the same The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into c... | 05/06/2008 |
| 7368933 | Method for testing standby current of semiconductor package A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chip... | 05/06/2008 |
| 7368932 | Testing device for printed circuit board A testing device for testing a printed circuit board includes a testing signal converting module for receiving testing signals from the printed circuit board and outputting the testing signals and a plurality of I/O control signals to a plurality of testing circuits... | 05/06/2008 |
| 7368927 | Probe head having a membrane suspended probe A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for conta... | 05/06/2008 |
| 7368928 | Vertical type high frequency probe card A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the groundin... | 05/06/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7365553 | Probe card assembly A probe card assembly has a probe contractor substrate having a plurality of probe contractor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contractor substrate are vertically adjustable un... | 04/29/2008 |
| 7363694 | Method of testing using compliant contact structures, contactor cards and test system A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 04/29/2008 |
| 7365558 | In-tray burn-in board, device and test assembly for testing integrated circuit devices in situ on processing trays A burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices that is disposed in one or more processing trays may include a substrate having an interface surface and a plurality of electrical contacts disposed on the interface surf... | 04/29/2008 |
| 7365552 | Surface mount package fault detection apparatus A fault detection apparatus for surface mount packages is provided. The apparatus can include a retainer for releasably securing a circuit board such as a printed circuit board having an electrical component mounted thereon via a ball grid array surface mount packag... | 04/29/2008 |
| 7364985 | Method for creating electrical pathways for semiconductor device structures using laser machining processes A method for creating electrical pathways for semiconductor device structures using laser machining processes is provided. The method of the present invention includes providing a semiconductor substrate and forming one or more depressions in the semiconductor subst... | 04/29/2008 |
| 7365280 | Switch and manufacturing method thereof A switch provided with a fixed contact and a movable contact coming into contact with each other and separating from each other. The surface of at least one of the fixed contact and the movable contact is provided with a plurality of recesses whose edges are overlap... | 04/29/2008 |
| 7364474 | Cable terminal with contact pins including electrical component A cable terminal or connector has several electrical probes. Each probe has a conductive sleeve defining a bore, with a probe pin received in the bore. The probe pin has a free end contact tip extending in a first direction beyond the periphery of a circuit board su... | 04/29/2008 |
| 7365550 | Low impedance test fixture for impedance measurements A test fixture couples with a test instrument to measure impedance of a device. An upper layer of the test fixture has (a) a first and a second solder pad for electrical connection to the device, (b) a first, second, third and fourth multi-solder pad for electrical ... | 04/29/2008 |
| 7365551 | Excess overdrive detector for probe cards A novel structure for a probe card that comprises a deformable metal or other deformable material for detecting excess overdrive and a method for using the same are disclosed. This detection structure may be positioned on the substrate along the bending path of the ... | 04/29/2008 |
| 7361844 | Power converter package and thermal management Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface and a bottom surface of the circuit board. The lower portion encloses a... | 04/22/2008 |
| 7362632 | Test parallelism increase by tester controllable switching of chip select groups Embodiments of the invention generally provide methods and systems for increasing the level of parallelism in testing memory devices. A set of test signals provided by a memory tester may be shared by two or more devices under test. A chip selector may be used to se... | 04/22/2008 |
| 7362118 | Probe with contact ring A spring probe having a barrel, plunger, spring and contact ring is provided in which the contact ring provides electrical contact between the plunger and the barrel. Two or more contact rings may be provided to improve the pointing accuracy of the probe. ... | 04/22/2008 |
| 7362115 | Chuck with integrated wafer support An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surf... | 04/22/2008 |
| 7361862 | Laser marking system for dice carried in trays and method of operation A laser marking system for IC packages including a tray input shuttle assembly and a tray transport borne by a transport actuator for moving a tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttl... | 04/22/2008 |
| 7362114 | Apparatus for interfacing electronic packages and test equipment A test apparatus for testing electrical devices such as ICs is provided. The test apparatus includes a test socket mounted on a DUT board in which a contact plunger assembly is at least partially positioned. ... | 04/22/2008 |
| 7362119 | Torsion spring probe contactor design The present invention relates to a probe for making electrical connection to a contact pad on a microelectronic device. A foot having a length, a thickness, a width, a proximal end, and a distal end, is connected to a substrate. The length of the foot is greater tha... | 04/22/2008 |
| 7362584 | Heat relief socket A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and th... | 04/22/2008 |
