Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7960986 | Methods and apparatus for multi-modal wafer testing Access to integrated circuits of a wafer for concurrently performing two or more types of testing, is provided by bringing a wafer and an edge-extended wafer translator into an attached state. The edge-extended wafer translator having wafer-side contact terminals an... | 06/14/2011 |
| 7948252 | Multilayered probe card A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with da... | 05/24/2011 |
| 7924034 | Electric connecting apparatus In an electrical connecting apparatus, a thermal deformation restriction member, a reinforcing plate, and an auxiliary member are made of materials having smaller thermal expansion coefficients in this order, and a wiring board supporting a probe assembly is coupled... | 04/12/2011 |
| 7898272 | Probe card A probe card includes a flat wiring board having a wiring pattern corresponding to a circuit structure for generating a signal for a test, an interposer that is stacked on the wiring board and relays wirings of the wiring board, a space transformer that is stacked o... | 03/01/2011 |
| 7893701 | Method and apparatus for enhanced probe card architecture A technique for distributing power to a plurality of dies uses a probe card. The probe card can include a plurality of regulators, each regulator accepting a bulk power input and producing a regulated output. The regulated output can be controlled by a programmable ... | 02/22/2011 |
| 7893700 | Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer A process or apparatus for testing a plurality of semiconductor dies on a semiconductor wafer utilizing a tester configured to test the dies in groups can include controlling as a logical whole provision of first test signals through a plurality of first communicati... | 02/22/2011 |
| 7888956 | Apparatus for testing a semiconductor device and a method of fabricating and using the same Example embodiments provide for an apparatus for testing various kinds of semiconductor devices having different distances between probes. Example embodiments also provide for a method of fabricating and using said apparatus. In accordance with example embodiments, ... | 02/15/2011 |
| 7888955 | Method and apparatus for testing devices using serially controlled resources Methods and apparatus for testing devices using serially controlled resources have been described. Examples of the invention can relate to an apparatus for testing a device under test (DUT). In some examples, an apparatus can include an integrated circuit (IC) havin... | 02/15/2011 |
| 7888957 | Probing apparatus with impedance optimized interface In a membrane probing apparatus, the impedance of the interface between coaxial cables connected to the test instrumentation and the membrane supported co-planar waveguide that conductively connects to the probe's contacts is optimized by eliminating a ground plane ... | 02/15/2011 |
| RE42115 | Mechanism for fixing probe card In a mechanism for fixing a probe card, the probe card and a support frame are joined to each other about the axis of each of the probe card and the support frame by a plurality of first fastening members. Also, the outer circumferential edge portion of the support ... | 02/08/2011 |
| 7884628 | Interposer and probe card having the same An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least ... | 02/08/2011 |
| 7884627 | Stiffener assembly for use with testing devices A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurali... | 02/08/2011 |
| 7884629 | Probe card layout Multi-touchdown, parallel test probe cards having probe elements arranged to provide greater efficiency during testing of a substrate having a plurality of die thereon. Probe elements may be arranged in a number of configurations that allow for efficient usage of th... | 02/08/2011 |
| 7880486 | Method and apparatus for increasing operating frequency of a system for testing electronic devices A test system includes a communications channel that terminals in a probe, which contacts an input terminal of an electronic device to be tested. A resistor is connected between the communications channel near the probe and ground. The resistor reduces the input res... | 02/01/2011 |
| 7880487 | Test lead probe with retractable insulative sleeve The present invention is directed to a test probe having an indexable probe tip. In one embodiment, an insulative sleeve extends from the test probe and surrounds a portion of the exposed probe tip. The insulative sleeve is moveable relative to the probe tip and may... | 02/01/2011 |
| 7876115 | Chuck for holding a device under test A chuck includes a conductive element that contacts a device under test in a location on the chuck. The chuck includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The ... | 01/25/2011 |
| 7876114 | Differential waveguide probe A wafer probe comprises a contact conductively interconnected with the wall of a waveguide channel and supported by a substrate that projects from an end of a waveguide channel. ... | 01/25/2011 |
| 7872482 | High density interconnect system having rapid fabrication cycle An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mou... | 01/18/2011 |
| 7872483 | Circuit board having bypass pad An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pad... | 01/18/2011 |
| 7863915 | Probe card cooling assembly with direct cooling of active electronic components A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the ... | 01/04/2011 |
| 7863914 | Method for testing semiconductor memory device using probe and semiconductor memory device using the same Example embodiments relate to a semiconductor memory device including a first pad having a probe region and a sensing region, the first pad may be adapted to come in contact with a primary probe, a sensing unit adapted to sense a weak contact of the first pad and th... | 01/04/2011 |
| 7859280 | Probe card for testing semiconductor devices A probe card is disclosed that is easily assembled and maintained and configured to prevent the controlled level of a space transformer from changing due to various causes such as a thermal deformation during a test process. The probe card includes an installation m... | 12/28/2010 |
| 7859281 | Finger tester for testing unpopulated printed circuit boards and method for testing unpopulated printed circuit boards using a finger tester A finger tester for testing non-componented printed circuit boards uses two or more test fingers, each having a test probe. A detection device is provided above each test probe for optical detection of the position above the circuit board of at least one contact tip... | 12/28/2010 |
| 7859279 | Charge eliminating apparatus and method, and program storage medium A charge eliminating apparatus eliminates, when an electrical characteristics test of a target object is performed by moving a mounting table mounting the target object thereon and a probe card relative to each other to bring the target object into electrical contac... | 12/28/2010 |
| 7859277 | Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester ... | 12/28/2010 |
| 7859278 | Probe holder for a probe for testing semiconductor components A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force comprises a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test ap... | 12/28/2010 |
| 7852094 | Sharing resources in a system for testing semiconductor devices Probes in a plurality of DUT probe groups can be connected in parallel to a single tester channel. In one aspect, digital potentiometers can be used to effectively switch the tester channel from a probe in one DUT probe group to a probe in another DUT probe group. I... | 12/14/2010 |
| 7852095 | Device and method for electrical contacting semiconductor devices for testing A device and method are disclosed for electrical contacting of semiconductor devices for testing. One embodiment provides for testing semiconductor devices or integrated circuits, including a probe card with contact tips for the electrical contacting of the semicond... | 12/14/2010 |
| 7847568 | Multi-site probe Various probe substrates for probing a semiconductor die and methods of use thereof are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first matrix array of conductor pins and a second matrix array of conductor pins on a prob... | 12/07/2010 |
| 7847567 | Verifying a printed circuit board manufacturing process prior to electrical intercoupling Apparatus and method for performing a verification buy-off operation during an assembly manufacturing process, such as during printed circuit board (PCB) manufacturing. A processing device is configured to establish contact between a probe assembly and a first compo... | 12/07/2010 |
| 7847569 | Probe device and method of regulating contact pressure between object to be inspected and probe Contact pressure between a wafer and a probe is maintained at an appropriate level. A probe card 2 has a contactor 11 for supporting a probe 10, a printed wiring board 13 electrically connected to the contactor 11, and a reinforcem... | 12/07/2010 |
| 7843202 | Apparatus for testing devices Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, t... | 11/30/2010 |
| 7843203 | Support member assembly having reinforcement member for conductive contact members Provided is a support member assembly suitable for use in a contact probe head comprising a support member formed with a plurality of holder holes for supporting conductive contact members in a mutually parallel relationship, and a reinforcing member integrally form... | 11/30/2010 |
| 7843204 | Electrical connecting apparatus The object of the present invention is to prevent an operator from touching electronic elements arranged on an upper surface of a probe assembly of an electrical connecting apparatus at the time of carrying the electrical connecting apparatus and to restrict bowing ... | 11/30/2010 |
| 7839155 | Methods and apparatus to analyze on-chip controlled integrated circuits Methods and apparatus for analyzing an integrated circuit are disclosed. An example method includes supplying power to an on-chip supply power regulator of integrated circuit, instructing the on-chip supply power regulator to output a circuit supply signal having a ... | 11/23/2010 |
| 7834647 | Alignment features in a probing device An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For examp... | 11/16/2010 |
| 7830162 | Vertical probe and methods of fabricating and bonding the same Disclosed is a vertical probe and methods of fabricating and bonding the same. The probe is comprised of a contactor equipped with two tips, a connector electrically linking with a measuring terminal of a measurement system, And a bump connecting the contactor to th... | 11/09/2010 |
| 7825674 | Probe card configuration for low mechanical flexural strength electrical routing substrates A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the su... | 11/02/2010 |
| 7825675 | Method and apparatus for providing active compliance in a probe card assembly A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the... | 11/02/2010 |
| 7821277 | Parallel test fixture for mixed signal integrated circuits The present invention provides a parallel test fixture for mixed signal integrated circuits (ICs). The fixture includes a multi-layer printed circuit board (PCB). The fixture includes: a test area, which is disposed on a central area of the multi-layer PCB and inclu... | 10/26/2010 |
