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| Number | Title | Issue Date |
| 7378836 | Automated loading/unloading of devices for burn-in testing The automatic loading and unloading of devices for burn-in testing is facilitated by loading burn-in boards in a magazine with the stacked boards in the magazine moved into and out of a burn-in oven by means of a trolley. The trolley can include an elevator whereby ... | 05/27/2008 |
| 7378837 | Method and system for calibrating a micro-electromechanical system (MEMS) based sensor using tunneling current sensing A system and method for controlling a tunneling current between a first element and a second element of a micro-electro-mechanical system (MEMS) sensor. The system includes a tunneling current excitation source for providing a tunneling current between the elements ... | 05/27/2008 |
| 7378834 | Electronic assembly tester and method for optoelectronic device An electronic assembly tester for testing an electrical component of an optoelectronic device. The electrical component includes a transmit and receive port. The tester includes of a base, an arm, and a hinge. The arm includes a flex circuit and cables. The arm is r... | 05/27/2008 |
| 7375508 | Device and a process for the calibration of a semiconductor component test system A device and a process for the calibration of a semi-conductor component test system The invention relates to a process and a device for the calibration of a probe card and/or of a semi-conductor component test apparatus including a first connection, at which... | 05/20/2008 |
| 7375540 | Process monitor for monitoring and compensating circuit performance A method and system for monitoring and compensating the performance of an operational circuit is provided. The system includes one or more integrated circuit chips and a controller. Each integrated circuit chip includes one or more operational circuits, each operati... | 05/20/2008 |
| 7372287 | Semiconductor device testing apparatus and device interface board A interface board is provided with a first and second contact instruments each comprising a first and second contact terminal groups to which a first to third type semiconductor devices having different numbers of external terminals used can be connected. The first ... | 05/13/2008 |
| 7373574 | Semiconductor testing apparatus and method of testing semiconductor A semiconductor testing apparatus, includes a test signal generating unit that generates a test signal corresponding to a test pattern to output the generated test signal to a device under test (DUT); a comparison signal generating unit that generates a comparison s... | 05/13/2008 |
| 7373575 | Method and apparatus for generating expect data from a captured bit pattern, and memory device using same Expect data signals are generated for a series of applied data signals having a known sequence to determine if groups of the data signals were properly captured. A first group of the applied data signals is captured, and a group of expect data signals are generated ... | 05/13/2008 |
| 7373263 | Analog-type measurements for a logic analyzer A logic analyzer that performs analog-type measurements on digital data includes circuitry in its acquisition system that is programmable to search through acquired data to detect analog-type signal characteristics. In a first embodiment, the logic analyzer includes... | 05/13/2008 |
| 7370514 | Determining quality of lubricating oils in use Resistivity ρ values of a lubricating oil are repeatedly determined at a predetermined temperature (range) as it is in use in a working mechanism such as a vehicle engine. Such accumulated properties over operating time of the working lubricant can be plotted graph... | 05/13/2008 |
| 7373622 | Relocatable built-in self test (BIST) elements for relocatable mixed-signal elements An apparatus including a base layer of a platform application specific integrated circuit (ASIC), a mixed-signal function and a built-in self test (BIST) function. The base layer of the platform ASIC generally includes a plurality of pre-diffused regions disposed ar... | 05/13/2008 |
| 7371676 | Method for fabricating semiconductor components with through wire interconnects A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a c... | 05/13/2008 |
| 7372251 | Semiconductor integrated circuit and memory test method A semiconductor integrated circuit has a memory operating on a first clock. A memory device captures first output data, being output from the memory in synchronization with the first clock, depending on a second clock having a frequency equal to or less than the fir... | 05/13/2008 |
| 7372252 | Automated platform for electronic apparatus environmental testing & method of use An automated platform for electronic apparatus environmental testing and the methods of its operation holds and positions electronic devices during environmental testing. The automated platform may be a multi-legged table and includes a surface for providing vertica... | 05/13/2008 |
| 7372250 | Methods and apparatus for determining a position of a substrate relative to a support stage A sensing system includes a plurality of probes arranged in a spaced relation around a stage that is adapted to support a substrate. Each probe includes a detection portion adapted to move from a known starting position toward an edge of the substrate that is suppor... | 05/13/2008 |
| 7372072 | Semiconductor wafer with test structure The invention relates to a semiconductor wafer (1) having a plurality of first sawing regions (201-211) running parallel to one another in a first direction (X) and a plurality of second sawing regions (301-311) running parallel to... | 05/13/2008 |
| 7373275 | System and method of point matching measured positions to template positions A system and method of point matching measured positions to template, or reference, positions for various applications may generally comprise creating force field vectors and moments operative to perturb measured point locations into alignment with template point lo... | 05/13/2008 |
| 7372288 | Test apparatus for testing multiple electronic devices There is disclosed a test apparatus including a driver that outputs a test signal, a first switch that is provided between the driver and a terminal of the first device under test, a second switch that is provided between the driver and a terminal of the second devi... | 05/13/2008 |
| 7368017 | Method and apparatus for semiconductor wafer planarization Broadly speaking, the present invention provides a method and an apparatus for planarizing a semiconductor wafer (“wafer”). More specifically, the present invention provides for depositing a planarizing layer over the wafer, wherein the planarizing layer serves ... | 05/06/2008 |
| 7368902 | Impedance calibration for source series terminated serial link transmitter Substantially-accurate calibration of output impedance of a device-under-test (DUT) to within a predetermined range of allowable impedance. The DUT is part of a source series terminated (SST) serial link transmitter, in which two branches of parallel transistors eac... | 05/06/2008 |
| 7368678 | Method for sorting integrated circuit devices A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including automatically reading the ID code of each of the IC devices and sorting the IC devices in accordance with their auto... | 05/06/2008 |
| 7368933 | Method for testing standby current of semiconductor package A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chip... | 05/06/2008 |
| 7368304 | Fabricating die with separate test pads selectively coupled to cores Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits w... | 05/06/2008 |
| 7367252 | Integrated circuit package separators An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond... | 05/06/2008 |
| 7365555 | Semiconductor device, method for testing the same and IC card A semiconductor device has a boosting circuit configured to generate a boosting potential to an output line. An internal circuit is supplied with the boosting potential from the boosting circuit via the output line. A test line is connected to the output line. A con... | 04/29/2008 |
| 7365550 | Low impedance test fixture for impedance measurements A test fixture couples with a test instrument to measure impedance of a device. An upper layer of the test fixture has (a) a first and a second solder pad for electrical connection to the device, (b) a first, second, third and fourth multi-solder pad for electrical ... | 04/29/2008 |
| 7365552 | Surface mount package fault detection apparatus A fault detection apparatus for surface mount packages is provided. The apparatus can include a retainer for releasably securing a circuit board such as a printed circuit board having an electrical component mounted thereon via a ball grid array surface mount packag... | 04/29/2008 |
| 7363814 | Multi-axial angular velocity sensor An angular velocity sensor for detecting angular velocity about a Z-axis in an XYZ coordinate system has a substrate oscillator, a flexible member for connecting the oscillator to a casing, a device for oscillating the oscillator in an X-axis direction, and a detect... | 04/29/2008 |
| 7365529 | Test structure design for reliability test A flexible semiconductor test structure that may be incorporated into a semiconductor device is provided. The test structure may include a plurality of test pads designed to physically stress conductive lines to which they are attached during thermal cycling. By uti... | 04/29/2008 |
| 7364461 | Direct attachment of coaxial cables Techniques for attaching a coaxial cable to an assembly are provided. A conductive layer is applied to a top and bottom surface of a first layer and the bottom surface of a second layer. An aperture is formed through the first layer. The first layer is affixed to th... | 04/29/2008 |
| 7365558 | In-tray burn-in board, device and test assembly for testing integrated circuit devices in situ on processing trays A burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices that is disposed in one or more processing trays may include a substrate having an interface surface and a plurality of electrical contacts disposed on the interface surf... | 04/29/2008 |
| 7362124 | Method and apparatus for testing liquid crystal display using electrostatic devices A method and apparatus are provided for inspecting an electrical defectiveness of a liquid crystal display substrate. The method includes shorting ESD protection devices with a conductive shorting bar to form a current path on each of signal wirings of the substrate... | 04/22/2008 |
| 7363033 | Method of and system for testing equipment during manufacturing A platform system for a mobile terminal for a wireless telecommunications system includes a mobile-terminal platform assembly. The mobile-terminal platform assembly includes a software services component having at least one functional software unit, a hardware compo... | 04/22/2008 |
| 7360716 | Method of determining at least one marking element on a substrate A method of establishing at least one marking element on a substrate (1). By means of design data of the substrate (1) at least a fictitious marking element (5) on the substrate (1) is determined. The fictitious marking element (5)... | 04/22/2008 |
| 7362087 | Adapter for circuit board examination and device for circuit board examination An adaptor for inspection of circuit boards includes a wiring board for connection, on a front surface of which a plurality of connecting electrodes are formed correspondingly to electrodes to be inspected, and an anisotropically conductive elastomer sheet detachabl... | 04/22/2008 |
| 7362117 | Cooling fin connected to a cooling unit and a pusher of the testing apparatus A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connectio... | 04/22/2008 |
| 7362148 | Device for controlling a semiconductor element A control device for controlling a load drive semiconductor element for driving a load has a test operation mode for measuring a leak current of the load drive semiconductor element. In the test operation mode, a control terminal of the load drive semiconductor elem... | 04/22/2008 |
| 7363175 | Query based electronic battery tester An electronic battery tester for testing a storage battery provides a test output indicative of a condition of the battery. Electronic measurement circuitry provides a measurement output related to a condition of the battery. The battery condition is determined base... | 04/22/2008 |
| 7360455 | Force detector and acceleration detector and method of manufacturing the same An electrode layer is formed on the upper surface of a first substrate, and a processing for partially removing the substrate is carried out in order to allow the substrate to have flexibility. To the lower surface of the first substrate, a second substrate is conne... | 04/22/2008 |
| 7362088 | Non contact method and apparatus for measurement of sheet resistance of P-N junctions A contactless sheet resistance measurement apparatus and method for measuring the sheet resistance of upper layer of ultra shallow p-n junction is disclosed. The apparatus comprises alternating light source optically coupled with first transparent and conducting ele... | 04/22/2008 |
