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| Number | Title | Issue Date |
| 7437819 | Method for making under water connector A method for sealing an electrical connector having a transition end and a cable. A protective coating is applied to the transition end of the connector. The connector, transition end and cable are positioned within halves of a mold. An annular resilient seal is pos... | 10/21/2008 |
| 7370410 | Method of manufacturing a device, device, non-contact type card medium, and electronic equipment Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to... | 05/13/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7356911 | Method for producing an insulated wire A method for producing an insulated wire having a cross section of a desired shape, in which a conductor having a cross section of a desired shape is coated with an insulating film, which method comprises: supplying a raw conductor while passing through a rolling un... | 04/15/2008 |
| 7352601 | USB flash memory device A memory device for interconnection with a Universal Serial Bus (USB) Series A type receptacle of an electronic device includes a housing wherein the housing is largely rectangular, with the width and height of a USB Series A plug standard housing; a connector withi... | 04/01/2008 |
| 7337009 | Lead having composite tubing A lead assembly includes a flexible lead body which extends from a proximal end to a distal end, the lead body includes one or more conductors. The lead assembly further includes an electrode assembly, and at least one coating of insulative material coated directly ... | 02/26/2008 |
| 7331797 | Electrical connector and a manufacturing method thereof A manufacturing method for an electrical connector is provided. The electrical connector includes a main portion and a plurality of supporting members that are connected with the main portion. The supporting members are applied with a plurality of metal layers there... | 02/19/2008 |
| 7325302 | Method of forming an interconnection element A method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than t... | 02/05/2008 |
| 7320174 | Methods for creating ground paths for ILS Methods for creating a ground path between a stainless steel suspension and a copper trace layer in an integrated lead assembly of a disk drive suspension. The invention prevents electrostatic discharge (ESD) damage by providing a means for grounding a lead to a con... | 01/22/2008 |
| 7310870 | Method for forming an annular magnetostrictive coat on an outer peripheral surface of a rotational shaft of magnetostrictive torque sensor For forming an annular magnetostrictive coat on an outer peripheral surface of a rotational shaft associated with a magnetostrictive torque sensor, a magnetostrictive-coat forming method comprises a step of fitting a cylindrical masking jig over the outer peripheral... | 12/25/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7263771 | Method of manufacturing a contact sheet and socket including same A contact sheet is provided including two insulative base sheets having a plurality of through-holes formed therethrough in an array pattern and a plurality of conductive contacts interposed between the insulative base sheets. Each contact includes a fixed part bond... | 09/04/2007 |
| 7257449 | Extendable/retractable lead having downsized lead body A lead assembly includes a flexible lead body extending from a proximal end to a distal end, and the lead body includes two or more conductors disposed therein. The second conductor is disposed within the first conductor, and the second conductor has a coating of in... | 08/14/2007 |
| 7252515 | Non-oriented wire in elastomer electrical contact A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an el... | 08/07/2007 |
| 7249405 | Method for manufacturing a magnetic medium Disclosed is a magnetic recording medium and a method for manufacturing the same to provide a magnetic recording medium reducing medium noise and having excellent thermal stability. The magnetic recording medium includes a substantially amorphous seed layer and a po... | 07/31/2007 |
| 7246424 | Magnetic devices having magnetic features with CMP stop layers A magnetic device having a magnetic feature, the magnetic feature including a magnetic portion comprising a magnetic material, a region of non-magnetic material adjacent to the magnetic portion, and a stop layer disposed above the region of non-magnetic material, de... | 07/24/2007 |
| 7246432 | Method of manufacturing semiconductor device A method of manufacturing a semiconductor device includes (a) forming a first resin layer on a semiconductor substrate including an electrode pad and a passivation film, (b) curing the first resin layer, (c) forming a second resin layer which slopes more gently than... | 07/24/2007 |
| 7240427 | Pin contact and method and apparatus for its manufacture A pin contact for pressing into electrical engagement with a plated section in a hole in a circuit board. The contact includes a deformable portion for engaging the plated section with a feed-through portion and a terminal portion at opposite ends thereof. An end pa... | 07/10/2007 |
| 7234237 | Method for producing a protective cover for a device In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device an... | 06/26/2007 |
| 7227095 | Wire bonders and methods of wire-bonding Wire bonders and methods of wire-bonding are disclosed herein. In one embodiment, a method includes attaching a wire to a terminal of a microelectronic component and generating an arc between a first electrode and a second electrode to sever the wire at a point at l... | 06/05/2007 |
| 7223135 | Terminal fitting and a connector provided therewith A terminal fitting has a rectangular tube (10) formed with a locking hole (19). A resilient contact piece (25) is in the rectangular tube (10) for contacting a tab of a mating terminal fitting. Displacement restricting portions (15... | 05/29/2007 |
| 7219426 | Method of manufacturing protruding-volute contact A method of manufacturing a protruding-volute contact for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a lay... | 05/22/2007 |
| 7217138 | Multipath interconnect with meandering contact cantilevers An interconnect assembly includes a number of interconnect stages combined in a carrier structure. Each interconnect stage includes at least two contact sets having an upwards pointing cantilever contact and a downwards pointing cantilever contact. The cantilever co... | 05/15/2007 |
| 7216426 | Method for forming a separable electrical connector A method for forming a separable electrical connector having an electrical interface surface includes the steps of molding an interface shell from a thermoplastic, placing the interface shell against an electrical interface portion of a mold cavity and molding a hou... | 05/15/2007 |
| 7213741 | Lead wire bonding method After respective one ends of lead wires are fixed to a printed circuit board, the lead wires are bent, the printed circuit board is brought into a case and the other ends of the lead wires are bonded to terminals of the case. Since the lead wires are processed befor... | 05/08/2007 |
| 7214604 | Method of fabricating ultra thin flip-chip package Provided is a method of fabricating an ultra thin flip-chip package. In the above method, an under barrier metal film is formed on a bond pad of a semiconductor chip. Three-dimensional structured solder bumps are formed on the under barrier metal film, each of the s... | 05/08/2007 |
| 7204697 | Non-oriented wire in elastomer electrical contact A method and apparatus for interconnecting an electronic module to a substrate through resilient wire conductors in an interposer arrangement. A carrier layer of insulating material with an array of apertures, arranged to align with both the electrical pads on an el... | 04/17/2007 |
| 7204015 | Electric heating cloth method A method for producing a uniformly heated electric heating cloth comprising the steps of forming heating threads by dissolving a thermoplastic polymer in an organic solvent, adding an industrial carbon which is produced from acetylene to form a first mixture, grindi... | 04/17/2007 |
| 7197362 | Cardiac lead having coated fixation arrangement Implantable cardiac monitoring and stimulation devices and methods using cardiac leads employ coated fixation arrangements. The coating, such as an expanded polytetrafluoroethylene, reduces exit block by reducing the tissue response to the fixation arrangement, decr... | 03/27/2007 |
| 7185419 | Method of manufacturing a mask for evaporation A mask frame assembly for evaporation includes a mask and a frame which supports the mask. The mask includes a metal layer having a predetermined pattern, and a coating layer which is formed on a surface of the metal layer so as to increase a precision of the predet... | 03/06/2007 |
| 7185821 | Method and apparatus for delivering high-current power and ground voltages using top side of chip package substrate An electronic interconnection system for delivering high-current power and ground voltages using a non-bottom side of a chip package substrate. The system includes a printed wiring board (PWB), a chip package, and a bridge lead. The PWB has at least a first and a se... | 03/06/2007 |
| 7181831 | Method of manufacturing strain sensor A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation res... | 02/27/2007 |
| 7174626 | Method of manufacturing a plated electronic termination A method of making a lead finish incorporating mechanically flattening the plated coating of metal leads. This may be accomplished by mechanical means such as rolling, stamping, peening, coining, forging, or other suitable flattening techniques. ... | 02/13/2007 |
| 7174629 | Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit.... | 02/13/2007 |
| 7161370 | Semiconductor testing device A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the sp... | 01/09/2007 |
| 7146722 | Method of forming a bond pad structure A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, a... | 12/12/2006 |
| 7140085 | Process for manufacturing a capacitive vacuum measuring cell A capacitive vacuum measuring cell includes first and second ceramic housing bodies (1, 4) joined by an edge seal (3). A thin ceramic membrane (2) is supported between first and second housing bodies (1, 4) by the edge seal (3) at ... | 11/28/2006 |
| 7131192 | Method of manufacturing printed circuit boards using miniature contact block packagings This invention is a method of manufacturing printed circuit boards using a contact block packaging to provide and support electrical contact blocks relative to a printed circuit board panel. The contact block packaging is situated adjacent to the printed circuit boa... | 11/07/2006 |
| 7131194 | Method of manufacturing a device Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to... | 11/07/2006 |
