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| Number | Title | Issue Date |
| 8151457 | Method of providing crosstalk compensation in a jack The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the ... | 04/10/2012 |
| 8037600 | Method of producing a land grid array interposer structure A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and mounting at least one interposer on a first surface of the carrier plane. The interposer possesses a hemi-toroidal configuration in transverse... | 10/18/2011 |
| 8011093 | Method of manufacturing connectors A method for manufacturing connectors comprises providing a carrier strip with a plurality of first alignment apertures and a plurality of contacts arranged in a row. The carrier strip is cut to desired lengths to form contact band pieces. The first alignment apertu... | 09/06/2011 |
| 7987595 | Method for making a probe card A method for making a probe card includes: mounting a plurality of probe needles on a probe-mounting seat; forming a conductive protective coating on tips of the probe needles; and bonding the probe needles to a printed circuit board through welding techniques after... | 08/02/2011 |
| 7987594 | Method of manufacturing an interconnected foil contact array A method of manufacturing an array of thin metallic foil strips of predetermined thickness, the strips assembled to form circuits that can be electrically connected to a printed circuit board, cables or attached to wires. The strips are assembled to a base using con... | 08/02/2011 |
| 7958632 | Flexible printed-circuit boards bonding method and printed circuit board A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that t... | 06/14/2011 |
| 7908747 | Method for assembling testing equipment for semiconductor substrate Upon an assembly of a probe head unit, the relative positions of the probe pins 28ai to those of the electrode group 24E in the pitch-changing substrate 24 are determined by making the positions of the through-holes 26A, 26B... | 03/22/2011 |
| 7856713 | Method for manufacturing combined terminals A combined terminal is made by combination of first and second terminals. The first terminal has a first plate portion. The second terminal has a second plate portion and a window portion formed in the second plate portion. The first and second terminals are combine... | 12/28/2010 |
| 7823283 | Method of forming a land grid array interposer A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is ... | 11/02/2010 |
| 7721430 | Approach for fabricating cantilever probes An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attac... | 05/25/2010 |
| 7698814 | Method for linearizing potentiometric sensors A method for linearizing potentiometric sensors is provided, the method can include the steps of: insertion in a measurement and/or processing station of a potentiometric sensor provided with a resistive track; application of a defined voltage and/or of a defined cu... | 04/20/2010 |
| 7650695 | Method of assembling conductive terminals of a plurality of electrical connectors and electrical connector module assembled thereby A method of assembling conductive terminals of a plurality of electrical connectors includes the steps of: (1) providing at least two overlapping housings each of which has a terminal receiving portion including fixing holes and guiding holes each partially overlapp... | 01/26/2010 |
| 7617601 | Manufacturing process for smaller active areas in flat panel X-ray detectors The present invention generally relates to a method for forming a flat panel for an X-ray detector device. The method comprises forming an active area of a first size on a substrate of a second size and extending at least one contact of the active area. The method f... | 11/17/2009 |
| 7587817 | Method of making electrical connector on a flexible carrier A compliant, scalable, thermal-electrical-mechanical, flexible electrical connector. In one configuration, the flexible electrical connector comprises a flexible substrate, a first and second conductive layer, and a plating contiguously applied over the conductive l... | 09/15/2009 |
| 7543377 | Perimeter matrix ball grid array circuit package with a populated center A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the pa... | 06/09/2009 |
| 7421778 | Method of making an electronic assembly According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of ... | 09/09/2008 |
| 7392581 | Method for manufacturing a magnetic element A plate member includes a frame portion (51) provided in a state of coupling both one end portion and other end portion and mounting terminal portions (44) protruding from the one end portion and the other end portion of said frame portion (51) ... | 07/01/2008 |
| 7383632 | Method for fabricating a connector A method for fabricating an electrical connector made up of an array of metallic contacts that act as conductive carriers, each attached to a flexible insulating sheet in one of an array of openings provided in the flexible sheet. The metallic contacts have portions... | 06/10/2008 |
| 7370414 | Methods for manufacturing lead frame connectors for optical transceiver modules Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon... | 05/13/2008 |
| 7370402 | Method for producing stator packs for long-stator linear motors of magnetic levitation railways A method for producing stator packs for long-stator linear motors of magnetic levitation vehicles is described. At first steel sheets are stacked to form a sheet stack, cross members are inserted into grooves of the sheet stack and the sheet stack and the cross memb... | 05/13/2008 |
| 7367121 | Electrical wiring method An electrical box is mounted on a wall stud, and a wiring panel is installed within the electrical box so as to partition the interior of the electrical box into a user inaccessible wiring compartment and a user accessible module compartment. A protective cover is a... | 05/06/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7361031 | Printed circuit board assembly and method of producing the same A printed circuit board assembly is formed by a press-fit connector attached to a printed circuit board. The press-fit connector includes a plurality of press-fit terminals and a housing. An overlapping resist part is formed on the printed circuit board. The overlap... | 04/22/2008 |
| 7341462 | Connector terminal fabrication process and connector terminal An upper tier terminal is provided with a fitting portion and a board attachment portion. When the upper tier terminal is being fabricated, a first wire member which is a component of the fitting portion and a second wire member which is a component of the board att... | 03/11/2008 |
| 7337536 | Multipoint nanoprobe and method for fabrication A nanoprobe includes a substrate having a layer, which forms a projected portion. A plurality of conductive lines is adhered to the projected portion and the lines extend beyond an end of the projected portion by a distance to form contact points, wherein the lines ... | 03/04/2008 |
| 7338327 | Coupling A coupling with two sleeves facing in opposite directions for the plugs of two shielded data cables that are to be connected to each other is in particular configured as an RJ 45 coupling. A printed circuit board (10) carries a contact assembly for each of th... | 03/04/2008 |
| 7332374 | Prealignment and gapping for RF substrates A method is provided for manufacturing electronic module assemblies comprising a plurality of substrates and a housing. The method comprises providing an alignment plate having a plurality of protrusions disposed through an upper surface thereof, wherein the protrus... | 02/19/2008 |
| 7325303 | Three-dimensional flexible interposer A generally planar interposer having a plurality of interposer contact pads to contact a plurality of first contacts of a first electronic device on one side of the interposer, and a plurality of electrical connections between the interposer contact pads and a plura... | 02/05/2008 |
| 7325302 | Method of forming an interconnection element A method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than t... | 02/05/2008 |
| 7316064 | Induction reflow apparatus and method of using the same A method for manufacturing an electrical contact includes providing a series of electrical contacts joined on a carrier strip to a plating station followed by an induction heating station. At the plating station, plating the electrical contacts with a conductive all... | 01/08/2008 |
| 7316065 | Method for fabricating a plurality of elastic probes in a row A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shapin... | 01/08/2008 |
| 7310875 | Connector for high-speed communications A high speed electrical connector is provided that comprises a substantially planar dielectric, a substantially planar ground plane, and a signal conductor. The ground plane is disposed on one planar surface of the planar dielectric and the signal conductor is dispo... | 12/25/2007 |
| 7302758 | Manufacturing and mounting method of electrical contacts for control members of small dimensions, in particular for the horological field There is disclosed a method for manufacturing and mounting electric contacts for control members of small dimensions, particularly for control members used in the horological field. This method includes the following steps: a) stamping and pre-shaping a plate of ele... | 12/04/2007 |
| 7299541 | Contact press-fitting apparatus It is an object of the present invention to provide a contact press-fitting apparatus which can perform the press-fitting of all of the contacts with high reliability, without leading to problems such as buckling of the contacts, even in cases where the array pitch ... | 11/27/2007 |
| 7300812 | Micro electrical mechanical system This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using t... | 11/27/2007 |
| 7297563 | Method of making contact pin card system A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structur... | 11/20/2007 |
| 7291037 | Flexible circuit board A flexible circuit board is provided, comprising a flexible substrate having an upper surface and a lower surface and a plurality of electrically conductive pads overlaid on an upper surface of the flexible substrate. Front ends of the electrically conductive pads d... | 11/06/2007 |
| 7287322 | Lithographic contact elements A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a... | 10/30/2007 |
| 7287326 | Methods of forming a contact pin assembly A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The... | 10/30/2007 |
| 7284321 | Method for testing a chip with a package and for mounting the package on a board A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted ... | 10/23/2007 |
