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| Number | Title | Issue Date |
| 7412767 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 08/19/2008 |
| 7383632 | Method for fabricating a connector A method for fabricating an electrical connector made up of an array of metallic contacts that act as conductive carriers, each attached to a flexible insulating sheet in one of an array of openings provided in the flexible sheet. The metallic contacts have portions... | 06/10/2008 |
| 7370413 | Method of making an electrical connector An electrical connector has a hard base part forming at least one rearwardly and forwardly open seat and formed with a transverse passage extending across the seat generally at the rear seat end, a respective contact in the seat having a front end and a rear end, a ... | 05/13/2008 |
| 7358176 | Screen printing method of forming conductive bumps A screen printing method of conductive material is applied to a wafer with a conductive surface thereon. A dielectric layer on the wafer exposes the conductive surface to a first opening. A mask formed on the dielectric layer has a plurality of second openings corre... | 04/15/2008 |
| 7323245 | Electric connecting part It comprises an electric conduction pattern member (11) which is flexible and plate-shaped, a gel member (13) having the electric conduction pattern member embedded therein, and flexible substrate sheets (15a, 15b) holding the gel ... | 01/29/2008 |
| 7307020 | Membrane 3D IC fabrication General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 12/11/2007 |
| 7290336 | Method of fabricating an array of multi-electroded piezoelectric transducers for piezoelectric diaphragm structures A circuit provides energy to a plurality of piezoelectric diaphragm structures formed in a two-dimensional array. Each piezoelectric diaphragm structure includes a piezoelectric element in operational contact with at least a first side electrode and a second side el... | 11/06/2007 |
| 7284324 | Method of making photolithographically-patterned out-of-plane coil structures An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coi... | 10/23/2007 |
| 7263771 | Method of manufacturing a contact sheet and socket including same A contact sheet is provided including two insulative base sheets having a plurality of through-holes formed therethrough in an array pattern and a plurality of conductive contacts interposed between the insulative base sheets. Each contact includes a fixed part bond... | 09/04/2007 |
| 7254880 | Electromechanical drive device and method for manufacture thereof During the positioning of a control device for controlling an electromechanical drive, contact elements, which are connected to the control device in a fixed manner, are positioned in relation to one or more openings in a connector collar. To position the control de... | 08/14/2007 |
| 7249971 | Hermetic electrical connector A hermetic pressure connector which provides a pressure-tight, electrically conductive connection through a hole in a bulkhead. The connector includes a transverse support member having a high pressure side and an opposite low pressure side. A passage extends throug... | 07/31/2007 |
| 7213330 | Method of fabricating an electronic device A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relations... | 05/08/2007 |
| 7202007 | Method of forming patterned films This method forms a patterned film. The method prepares a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed, performs stripping treatment on surfaces of at least ridges formed on the transfer surf... | 04/10/2007 |
| 7144275 | Water-resistant casing structure for electronic control device A circuit board supporting electronic components mounted thereon is housed in a casing. The casing has a joint hole defined therein, and a connector is inserted in the joint hole with a water-resistant seal placed in a gap between the connector and edges of the casi... | 12/05/2006 |
| 7140101 | Method for fabricating anisotropic conductive substrate A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into ... | 11/28/2006 |
| 7140105 | Method of fabricating a notched electrical test probe tip A method of fabricating a notched electrical test probe tip preferably includes the first step of providing an elongate electrically conductive blank having a longitudinal planar axis, a first end, and a second end opposite the first end. Preferably, the next step i... | 11/28/2006 |
| 7090423 | Connecting structures Joint formations that, in joining together joining members employed in a variety of electrical and electronic components, yield sufficiently high joint strength in the direction perpendicular to the plane in which two joining members join, and meanwhile in the direc... | 08/15/2006 |
| 7086149 | Method of making a contact structure with a distinctly formed tip structure A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an i... | 08/08/2006 |
| 7083476 | Base for a headlight lamp and headlight lamp A base for a headlight lamp, which has a plastic base part having at least two electrical connections, which have a first end with a contact face, the first ends protruding from the base part when mounted such that the contact faces are perpendicular to the longitud... | 08/01/2006 |
| 7073255 | Method for producing ribbon cable using flash curing A method of manufacturing a ribbon cable, comprising providing a set of insulated wires and aligning said insulated wires in a predetermined arrangement. The insulated wires are warmed sufficiently for said insulation to be become soft and adhesive, are pressed toge... | 07/11/2006 |
| 7074047 | Zero insertion force high frequency connector A connector or connector assembly having a signal array having at least one shielded conductor having opposite ends and including an axial conductive element and an outer conductive element surrounding the axial conductive element and a compressible interface elemen... | 07/11/2006 |
| 7065870 | Segmented contactor A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled ... | 06/27/2006 |
| 7064432 | Method and system for bonding a semiconductor chip onto a carrier using micro-pins An anisotropically conductive layer “ACL” (50) for mechanical and electrical bonding of two circuit containing structures, such as a flip chip and carrier is disclosed. The ACL is formed of a rigid insulating substrate (72) or membrane (61) ... | 06/20/2006 |
| 7059867 | High density multi-lead surface mount interconnect and devices including same A multi-lead surface mount interconnect. The interconnect includes a carrier, a first lead connected to the carrier, and a second lead connected to the carrier. The carrier defines a first receiving area and a second receiving area. The first lead includes a first p... | 06/13/2006 |
| 7032307 | Method for fabricating a probe pin for testing electrical characteristics of an apparatus A probe pin for testing electric characteristics of a semiconductor device comprises a silicon pin core (3, 23, 33), and a conductive film (4, 24, 34) covering the entire surface, including the bottom face, of the pin core. The bottom face of the probe... | 04/25/2006 |
| 7027859 | Electrotransport delivery device having improved safety and reduced abuse potential An electrotransport device (20) for delivering one or more therapeutic agents through the skin includes electrodes (30,32) for contacting the skin (34), at least one electrode containing the agent, a power source (22) for generating elect... | 04/11/2006 |
| 7011553 | Cable connector having a retainer which serves to hold a cable, to protect a connecting portion, and to prevent undesirable releasing of a contact In a connector to be connected to a cable having a core wire, a retainer is fitted into a rear portion of an insulator holding a contact. The core wire is crimped by a wire crimping barrel formed to the contact. The cable is clamped in cooperation with the retainer ... | 03/14/2006 |
| 7007370 | Self-assembled electrical networks Techniques for self assembly of macro-scale objects, optionally defining electrical circuitry, are described, as well as articles formed by self assembly. Components can be joined, during self-assembly by minimization of free energy, capillary attraction, or a combi... | 03/07/2006 |
| 7003868 | Coated stainless-steel/copper weld for electroplating cathode A copper welding rod is used in an arc-welding operation to form a bead that joins a copper starter sheet and a stainless steel hanger bar. The amperage level of the arc-welding equipment is set to generate heat at the weld site which is above the melting point of c... | 02/28/2006 |
| 7000315 | Method of making photolithographically-patterned out-of-plane coil structures An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coi... | 02/21/2006 |
| 6955285 | Apparatus for aligning and dispensing solder columns in an array An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent co... | 10/18/2005 |
| 6938338 | Method of making an electronic contact Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged... | 09/06/2005 |
| 6920689 | Method for making a socket to perform testing on integrated circuits A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavitie... | 07/26/2005 |
| 6880226 | Method for limiting movement in electrical contactors A method for restricting travel of a moving contact in a lighting contactor is provided. The lighting contactor includes the moving contact and a contact carrier. The method includes the steps of providing a spacer, and a biasing member and positioning the biasing m... | 04/19/2005 |
| 6857184 | Connecting method of pins and tin balls of an electric connector A connecting method for pins and tin balls of an electric connector. Pins of the electric connector elastically resist against tin balls so as to position the pins. The lower ends of the pins store elastic energy due to the elastically resisting contact. During weld... | 02/22/2005 |
| 6792679 | Method of producing electrical connecting elements A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 o... | 09/21/2004 |
| 6763585 | Method for producing micro bump A resist pattern in accordance with a predetermined pattern is formed on a substrate. Next, a bump resist mixed with a micro metallic powder is made thicker than the resist pattern and formed on the substrate formed with the resist pattern. Continuously, the bump re... | 07/20/2004 |
| 6684499 | Method for fabricating a spring structure Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask... | 02/03/2004 |
| 6652688 | Process for producing semiconductor wafer with adhesive film A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a predetermined arrangement, which comprises: determining a particular... | 11/25/2003 |
| 6647621 | Electrical resistance reduction method for thermosetting conductive epoxy contacts in integrated lead suspensions A method for efficiently producing low resistance electrical contacts between stainless steel and conductive layers in integrated lead suspensions and components. The method includes applying an amount of current for a period of time which is effective to... | 11/18/2003 |
