Pillow with retractable umbrella
A pillow assembly having a supporting assembly and a retractable umbrella assembly that is easily transportable and allows a user to support his/her head while covering their face from sunlight.
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| Number | Title | Issue Date |
| 8171630 | Method of producing a land grid array interposer A method of producing a land grid array (LGA) interposer structure includes mounting at least one interposer on a first surface of an electrically insulating carrier plane. The interposer selectively having a hemi-toroidal, conical, dome-shaped conic section, genera... | 05/08/2012 |
| 8141247 | Method of a package on package packaging A method of manufacture of an integrated circuit package-on-package system includes providing a base package and providing solder caps on the top of the base package configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the bas... | 03/27/2012 |
| 8136242 | Method of producing a land grid array interposer utilizing metal-on-elastomer A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse... | 03/20/2012 |
| 8104173 | Method for manufacturing a series of electric terminals A series of electric terminals in which each member of the series has an identical receptacle portion at one end and a unique cable attachment portion at an opposite end is manufactured by forming a generic strip of partially formed terminals having a receptacle por... | 01/31/2012 |
| 8091225 | Method of manufacturing probe with printed tip The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the tes... | 01/10/2012 |
| 8087166 | Method for making an axial magnetic field vacuum fault interrupter An improved vacuum interrupter is made. The vacuum interrupter includes a ring-shaped structure placed between a contact support structure and an electrical contact associated with the contact support structure. A resistivity of the ring-shaped structure is higher t... | 01/03/2012 |
| 8069561 | Method for manufacturing a metal-ceramic substrate A method for manufacturing a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material. The metal-ceramic substrate includes a base substrate made of an aluminum-nitride or silicon-nitri... | 12/06/2011 |
| 8011092 | Methods of providing semiconductor components within sockets The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be ... | 09/06/2011 |
| RE42637 | Probe card The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plat... | 08/23/2011 |
| 7946033 | Method and apparatus for manufacturing a lead terminal A method of manufacturing a lead terminal for an accumulator by plastic deformation on a cold-working apparatus that has a shaping station (2) and at least one deformation station (30. 40, 50, 60, 80) by shaping, at the shaping station, a slug (7 | 05/24/2011 |
| 7936176 | Method for providing alignment of a probe A method for aligning a probe relative to a supporting substrate defining a first planar surface, an edge, and a first crystal plane includes the steps of masking the surface of the substrate to define an exposed area on the first surface at the edge; and etching, u... | 05/03/2011 |
| 7761985 | Method of manufacturing a medical lead A method of manufacturing a segmented electrode assembly. An electrically conducting tube is coupled to an electrically insulating material. The tube is generally cylindrical and hollow and defines one or more gaps at a first axial position. The tube also includes o... | 07/27/2010 |
| 7730615 | Micro-machined structure production using encapsulation Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structur... | 06/08/2010 |
| 7721428 | Method for making an electrode assembly An electrode assembly for use in a vacuum interrupter is made by joining a first side of a substantially disk-shaped structure to an end of a substantially cylindrical coil segment, and joining an electrical contact to a second side of the disk-shaped structure. The... | 05/25/2010 |
| 7721429 | Method for manufacturing a probe A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial la... | 05/25/2010 |
| 7685708 | Multipoint nanoprobe method of making A nanoprobe includes a substrate having a layer, which forms a projected portion. A plurality of conductive lines is adhered to the projected portion and the lines extend beyond an end of the projected portion by a distance to form contact points, wherein the lines ... | 03/30/2010 |
| 7658001 | Electrical connector for disk drive suspension assembly and method of non-contact solder attachment of same A method for electrically connecting disk drive suspension assembly elements including positioning a first component having a first terminal with an edge adjacent to a second component having a second terminal and applying solder to form a solder joint over the edge... | 02/09/2010 |
| 7637009 | Approach for fabricating probe elements for probe card assemblies using a reusable substrate An approach is provided for fabricating probe elements for probe card assemblies. Embodiments of the invention include using a reusable substrate, a reusable substrate with layered probe elements and a reusable substrate with a passive layer made of a material that ... | 12/29/2009 |
| 7597590 | Electromagnetic interference (EMI) collar and method for use with a pluggable optical transceiver module An EMI collar is provided that is configured to be secured about a housing of a pluggable optical transceiver module. The configuration of the EMI collar and the method by which the collar is attached to the housing of the transceiver module ensures that the collar ... | 10/06/2009 |
| 7533462 | Method of constructing a membrane probe A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is ha... | 05/19/2009 |
| 7437819 | Method for making under water connector A method for sealing an electrical connector having a transition end and a cable. A protective coating is applied to the transition end of the connector. The connector, transition end and cable are positioned within halves of a mold. An annular resilient seal is pos... | 10/21/2008 |
| 7421778 | Method of making an electronic assembly According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of ... | 09/09/2008 |
| 7412767 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 08/19/2008 |
| 7400155 | Membrane probing system A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is ha... | 07/15/2008 |
| 7400514 | Non-rigid conductor link measurement sensor and method for the production thereof The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed ... | 07/15/2008 |
| 7396265 | Feedthrough for electrical connectors A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least... | 07/08/2008 |
| 7389581 | Method of forming compliant contact structures A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 06/24/2008 |
| 7383632 | Method for fabricating a connector A method for fabricating an electrical connector made up of an array of metallic contacts that act as conductive carriers, each attached to a flexible insulating sheet in one of an array of openings provided in the flexible sheet. The metallic contacts have portions... | 06/10/2008 |
| 7373717 | Method of manufacturing a self-sustaining center-anchor microelectromechanical switch Provided is a manufacturing method of self-sustaining center-anchor microelectromechanical switch driven by an electrostatic force used for controlling a signal transmission in an electronic system, which can suppress deformation of a movement plane generated during... | 05/20/2008 |
| 7370414 | Methods for manufacturing lead frame connectors for optical transceiver modules Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon... | 05/13/2008 |
| 7370413 | Method of making an electrical connector An electrical connector has a hard base part forming at least one rearwardly and forwardly open seat and formed with a transverse passage extending across the seat generally at the rear seat end, a respective contact in the seat having a front end and a rear end, a ... | 05/13/2008 |
| 7367120 | Method for producing a solid-state imaging device A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external t... | 05/06/2008 |
| 7367121 | Electrical wiring method An electrical box is mounted on a wall stud, and a wiring panel is installed within the electrical box so as to partition the interior of the electrical box into a user inaccessible wiring compartment and a user accessible module compartment. A protective cover is a... | 05/06/2008 |
| 7367119 | Method for forming a reinforced tip for a probe storage device Systems and methods in accordance with the present invention can include a tip contactable with a media. In an embodiment, the tip comprises a substantially hollow structure formed of a metal. The tip can be formed by depositing a first metal layer over silicon ther... | 05/06/2008 |
| 7368924 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated... | 05/06/2008 |
| 7364458 | Electrical connector An electrical connector includes an insulated body and a plurality of conductive terminals. A plurality of terminals accommodating holes disposed inside the insulated body for receiving the conductive terminals therein. There is a metal shielding layer arranged on t... | 04/29/2008 |
| 7364945 | Method of mounting an integrated circuit package in an encapsulant cavity An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity. ... | 04/29/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7356920 | Micro-machined structure production using encapsulation Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structur... | 04/15/2008 |
| 7354800 | Method of fabricating a stacked integrated circuit package system An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit, attaching a substrate electrical connector between the core substrate a... | 04/08/2008 |