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| Number | Title | Issue Date |
| 7845074 | Method for manufacturing electronic parts module The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive ... | 12/07/2010 |
| 7841081 | Method for manufacturing electronic parts module The manufacturing method for an electronic parts module includes forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first and the second land parts, positioning a terminal of the active element on the s... | 11/30/2010 |
| 7823280 | Method for manufacturing connector of electronic clutch for compressor The present invention relates to a connector of an electromagnetic clutch for a compressor and a manufacturing method thereof. The method includes the steps of arranging a leading end of a lead wire 62 or 72 of at least one discharge device 60 o... | 11/02/2010 |
| 7739791 | Method of producing an overmolded electronic module with a flexible circuit pigtail A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastom... | 06/22/2010 |
| 7387740 | Method of manufacturing metal cover with blind holes therein An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; ste... | 06/17/2008 |
| 7362491 | Heated glass panels and methods for making electrical contact with electro-conductive films A heated glass panel assembly according to one embodiment of the invention may include a substrate having an electro-conductive film provided thereon. A conductor is positioned in contact with the electro-conductive film. A resilient material is positioned in contac... | 04/22/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7361975 | Semiconductor integrated circuit having reduced cross-talk noise A semiconductor integrated circuit, includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction of the shielded wire line. ... | 04/22/2008 |
| 7357886 | Singular molded and co-molded electronic's packaging pre-forms Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded co... | 04/15/2008 |
| 7334324 | Method of manufacturing multilayer wiring board A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polya... | 02/26/2008 |
| 7308752 | Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis direction, and tracking servo coils for moving the moveable unit containi... | 12/18/2007 |
| 7299535 | Methods for making data storage media and the resultant media Methods for forming data storage media and the media formed thereby are disclosed herein. In one embodiment, the method for forming a data storage media, comprises: injection molding a substrate comprising surface features, wherein said surface features have greater... | 11/27/2007 |
| 7296345 | Method for manufacturing a memory device A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then... | 11/20/2007 |
| 7294533 | Mold compound cap in a flip chip multi-matrix array package and process of making same A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is al... | 11/13/2007 |
| 7285739 | Waterproof structure for switch pins A waterproof structure for switch pins includes a pin exposed outside a switch to be connected to an electric wire. The pin and the electric wire are covered by a waterproof insulation material through an injection forming process to become an integrated manner. The... | 10/23/2007 |
| 7279366 | Method for assembling semiconductor die packages with standard ball grid array footprint Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of electrical connection pads is located within the recess. A semiconductor die ... | 10/09/2007 |
| 7266882 | Method of manufacturing a miniaturized three- dimensional electric component Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at least one master structure, e.g. via a mould structure, in at least one p... | 09/11/2007 |
| 7263770 | Electrical connector Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in ... | 09/04/2007 |
| 7258819 | Voltage variable substrate material The present invention provides an improved voltage variable material (“VVM”). More specifically, the present invention provides an improved printed circuit board substrate, an improved device having circuit protection an improved data communications cable having... | 08/21/2007 |
| 7251877 | Method of manufacturing a sensor assembly for a magnetic flowmeter A sensor assembly for a magnetic flowmeter is provided that is cost-effective to manufacture, while incorporating an effective seal against leakage and enabling precise positioning of electrodes. The sensor assembly includes an electrode assembly and a plastic housi... | 08/07/2007 |
| 7234229 | Method and apparatus for manufacturing motor coil The present invention provides a process and an apparatus for the preparation of a motor coil by which a longitudinally wound motor coil, so called, can be easily prepared. First, a molded product 10 comprising a column part 11, and a fin part 12 | 06/26/2007 |
| 7234237 | Method for producing a protective cover for a device In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device an... | 06/26/2007 |
| 7230214 | Metal sheathed heater using splice connection assembly with heat shrinkable tubing, and method of use A metal sheathed heater utilizes splice connections that connects ends of a heater cable with ends of a lead wire. Each splice connection has a connector that connects core wires of the lead wires and heater cable together. Heat shrinkable tubing surrounds the conne... | 06/12/2007 |
| 7219416 | Method of manufacturing a magnetic element The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 Ω·cm. W... | 05/22/2007 |
| 7216420 | Method of manufacturing print head A print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the proje... | 05/15/2007 |
| 7207109 | Method for producing ink jet head A method for producing an ink jet head including, on a substrate, a piezoelectric element for discharging an ink from a discharge port, and an ink flow path communicating with the discharge port so as to correspond to the piezoelectric element, the method comprising... | 04/24/2007 |
| 7204017 | Manufacturing method of a modularized leadframe A manufacturing method of a modularized leadframe, using a first mold set to contact and hold the upper surface of rows of multiple block leads, using a second mold set to contact and hold at least one selected surface of the lower surface of leads, the second mold ... | 04/17/2007 |
| 7199460 | Semiconductor device and method of manufacturing the same A semiconductor device capable of reducing its size and increasing the number of chips on a wafer, and a method of manufacturing the same are provided. When manufacturing a semiconductor device, an uppermost layer as a dedicated layer for pads are formed above a lay... | 04/03/2007 |
| 7198969 | Semiconductor chip assemblies, methods of making same and components for same Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensa... | 04/03/2007 |
| 7191515 | Method for manufacturing an interconnected circuit board assembly An electrical assembly (200, FIG. 2) is formed from two, interconnected circuit boards (202, 204). Conductive spacers (240) and a conductive material (260) are placed between complementary bond pads (218, 232) on the circuit... | 03/20/2007 |
| 7193161 | SiP module with a single sided lid A single-lid flash memory card and methods of manufacturing same are disclosed. The single-sided lid flash memory card may be formed from a semiconductor package having two or more tapered, stepped or otherwise shaped edges capable of securing a single-sided lid the... | 03/20/2007 |
| 7192807 | Wafer level package and fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 03/20/2007 |
| 7178235 | Method of manufacturing an optoelectronic package A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enab... | 02/20/2007 |
| 7157671 | Flat capacitor for an implantable medical device One aspect provides a capacitor having a first stack of capacitive elements a second stack of capacitive elements, wherein the first and second stacks are enclosed in separate compartments of a capacitor case that electrically isolate the electrolytes of each stack ... | 01/02/2007 |
| 7154739 | Flat capacitor having an active case A capacitor comprising an aluminum case; a capacitor stack mounted within the aluminum case, the capacitor stack comprising one or more anodes and one or more cathodes, one of the one or more anodes and one or more anodes attached to the aluminum case; wherein the c... | 12/26/2006 |
| 7150390 | Flip chip dip coating encapsulant A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip e... | 12/19/2006 |
| 7126217 | Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support In a semiconductor flip-chip package having a semiconductor die 104 as part of a substrate assembly, a lid 110 (or lid assembly) and substrate 102 are supported to prevent tilting and teetering of the lid. The lid and substrate do not adhere, so... | 10/24/2006 |
| 7112252 | Assembly method for semiconductor die and lead frame A LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the le... | 09/26/2006 |
| 7094619 | Method of fabricating a light emitting device A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor light-emitting element of the upper end of another lead, and an envelope... | 08/22/2006 |
| 7091581 | Integrated circuit package and process for fabricating the same A process for fabricating an integrated circuit package includes: selectively etching a leadframe strip to define a die attach pad and at least one row of contact pads; mounting a semiconductor die to one side of the leadframe strip, on the die attach pad; wire bond... | 08/15/2006 |
