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| Number | Title | Issue Date |
| 8141245 | Method of forming a circuit board with improved via design A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive she... | 03/27/2012 |
| 8087164 | Printed wiring board and a method of manufacturing a printed wiring board A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large aperture... | 01/03/2012 |
| 7752752 | Method of fabricating an embedded circuit pattern A method of fabricating a substrate includes forming a first conductive layer on a dielectric layer, forming a resist layer on the first conductive layer, and forming laser-ablated artifacts through the first resist layer, through the first conductive layer, and at ... | 07/13/2010 |
| 7712212 | Method for manufacturing printed wiring board A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at... | 05/11/2010 |
| 7404251 | Manufacture of printed circuit boards with stubless plated through-holes A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertica... | 07/29/2008 |
| 7389581 | Method of forming compliant contact structures A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 06/24/2008 |
| 7367120 | Method for producing a solid-state imaging device A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external t... | 05/06/2008 |
| 7363688 | Land grid array structures and methods for engineering change A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to... | 04/29/2008 |
| 7365436 | Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hol... | 04/29/2008 |
| 7361031 | Printed circuit board assembly and method of producing the same A printed circuit board assembly is formed by a press-fit connector attached to a printed circuit board. The press-fit connector includes a plurality of press-fit terminals and a housing. An overlapping resist part is formed on the printed circuit board. The overlap... | 04/22/2008 |
| 7356922 | Method of fabricating a rate gyroscope and accelerometer multisensor Three magnetic substrates are provided, the first substrate forms the rotor and the other two form the outer stator. A series of spaced concentric grooves and spaced spiral grooves are formed in the central region of both faces of the first substrate. A hole is plac... | 04/15/2008 |
| 7350297 | Method of manufacturing a wiring substrate A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece h... | 04/01/2008 |
| 7348496 | Circuit board with organic dielectric layer Embodiments of the present invention include forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate, using an electrocoating process to reduce loop inductance between the conductive la... | 03/25/2008 |
| 7340829 | Method for fabricating electrical connection structure of circuit board A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plura... | 03/11/2008 |
| 7337535 | Hole plugging method for printed circuit boards, and hole plugging device A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 03/04/2008 |
| 7316063 | Methods of fabricating substrates including at least one conductive via A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by mask... | 01/08/2008 |
| 7285727 | Flexible wiring boards for double-side connection A flexible wiring board for double side connection is capable of improving the reliability of connection to circuit boards and a manufacturing process thereof. The flexible wiring board for double-side connection includes a polyimide film having a through-hole at a ... | 10/23/2007 |
| 7284323 | Process of fabricating conductive column A fabrication process of a conductive column suitable for a fabrication of a circuit board. The circuit board comprises a dielectric layer. A first blind hole is formed in the dielectric layer from a second surface opposite to the first surface, wherein the blind en... | 10/23/2007 |
| 7281324 | Method of simultaneously fabricating circuit blocks A method of simultaneously fabricating a plurality of circuit blocks is presented. Each circuit block is configured for aligned positioning onto a housing of an individual electrical connector. The method includes simultaneously fabricating a plurality of circuits o... | 10/16/2007 |
| 7277297 | Device, apparatus, method and assembly for coupling an electrical component with a circuit board A device, apparatus and printed circuit board assembly for removably coupling an electrical component with a PCB are described, which provides adequate electromechanical capability, is relatively insensitive to related heating, component removability, replacability ... | 10/02/2007 |
| 7270861 | Laminated structurally elastic-like film web substrate The present invention relates to film web substrates and more particularly to such web substrates wherein the inherent elongation properties of a given web material are modified. An exemplary web material is formed from first and second precursor webs. A first side ... | 09/18/2007 |
| 7269899 | Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery A method for forming a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes. ... | 09/18/2007 |
| 7251885 | Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the board. When a laser beam is applied to form a throughhole in the board, a... | 08/07/2007 |
| 7213333 | Method for manufacturing mounting substrate and method for manufacturing circuit device Provided are a method for manufacturing a mounting substrate and a method for manufacturing a circuit device, both of which include the step of electroplating a number of electrodes. The method for manufacturing a mounting substrate includes the steps of: forming a ... | 05/08/2007 |
| 7207107 | Method and device for through-hole plating of substrates and printed circuit boards A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a c... | 04/24/2007 |
| 7199309 | Structure for repairing or modifying surface connections on circuit boards A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a h... | 04/03/2007 |
| 7188411 | Process for forming portions of a compound material inside a cavity A process for forming portions of a compound material within an electronic circuit includes the formation of a cavity having at least one opening facing onto an access surface. The cavity furthermore has an internal wall with at least one region made of an initial m... | 03/13/2007 |
| 7178233 | Process for producing a collapsed filled via hole A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this or... | 02/20/2007 |
| 7168164 | Methods for forming via shielding Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the condu... | 01/30/2007 |
| 7161789 | Ion chip The ion chip has an ionizing structure in intimate electrical and physical contact with a conductor. The ionizing structure is either a carbon fiber layer or ionizing needles or both. The conductor may be a bare metal wire, a metal plate or a metal layer on a base i... | 01/09/2007 |
| 7152318 | Method for manufacturing built-up printed circuit board with stacked type via-holes A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly... | 12/26/2006 |
| 7124504 | Method and device for connecting conductors A method and device for making multiple connections between electrical conductors surrounded by external insulators in overlapping flexible cables by ultrasonic welding. Overlapping conductors to be connected are arranged on a surface of a carrier disposed between a... | 10/24/2006 |
| 7114961 | Electrical connector on a flexible carrier A compliant, scalable, thermal-electrical-mechanical, flexible electrical connector. In one configuration, the flexible electrical connector comprises a flexible substrate, a first and second conductive layer, and a plating contiguously applied over the conductive l... | 10/03/2006 |
| 7107674 | Method for manufacturing a chip carrier A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of island-defining portions is arranged about each of the receiving zones. Rigid... | 09/19/2006 |
| 7090501 | Connector apparatus A connector system includes a circuit board having a plurality of holes extending therethrough. First and second connector bodies, each having a front wall, are positioned on first and second sides of the circuit board, respectively. The front walls of the connector... | 08/15/2006 |
| 7079373 | Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 66... | 07/18/2006 |
| 7069645 | Method for producing a circuit board A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removin... | 07/04/2006 |
| 7047630 | Method of making circuitized substrate assembly A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to ... | 05/23/2006 |
| 7044755 | Ground terminal and method for mounting a printed board mounted with a ground terminal to a chassis A ground terminal capable of being downsized and having good electrical connectability with a chassis. The ground terminal includes a ground terminal body formed into an annular shape as viewed in plan, and at least one connection portion formed integrally with the ... | 05/16/2006 |
| 7016200 | Module support for electrical/electronic components In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the metallic conductor uncovered by the insulation sheathing and conducti... | 03/21/2006 |
