Quotables
"Transmission of documents via telephone wires is possible in principle, but the apparatus required is so expensive that it will never become a practical proposition."
Dennis Gabor, British physicist
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8186053 | Circuit board and method of manufacturing the same A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion ... | 05/29/2012 |
| 8186054 | Method of fabricating board having high density core layer and structure thereof Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-dens... | 05/29/2012 |
| 8186052 | Method of producing substrate The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been fille... | 05/29/2012 |
| 8181341 | Method of forming a multilayer printed wiring board having a bulged via A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of ... | 05/22/2012 |
| 8181342 | Method for manufacturing a coreless packaging substrate Disclosed are a coreless packaging substrate and a manufacturing method thereof. The substrate includes a built-up structure and a first wiring layer. The built-up structure has a first outside and an opposite second outside, and includes one or more second dielectr... | 05/22/2012 |
| 8176628 | Protruding post substrate package structure and method In accordance with one embodiment, a method of forming a protruding post substrate package includes applying a dielectric layer to a carrier. Via apertures are formed in the dielectric layer. Carrier cavities are formed in the carrier using the dielectric layer as a... | 05/15/2012 |
| 8166653 | Method of manufacturing printed circuit board having embedded resistors A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electro... | 05/01/2012 |
| 8166652 | Method of making a circuit structure of a circuit board A circuit structure of a circuit board includes a dielectric layer, a number of first circuits, and a number of second circuits. The dielectric layer has a surface and an intaglio pattern. The first circuits are disposed on the surface of the dielectric layer. The s... | 05/01/2012 |
| 8166650 | Method of manufacturing a printed circuit board A method of manufacturing a printed circuit board (PCB) includes of disposing thermal transfer vias and electrical vias through the PCB. The method further includes filling holes of the vias with a solder mask. The thermal transfer vias are filled to about 70% of ca... | 05/01/2012 |
| 8166651 | Through wafer vias with dishing correction methods A method of forming a through wafer via including forming the through wafer via (TWV) into a substrate and through a first dielectric layer over the substrate; planarizing the first dielectric layer using a chemical mechanical polish before forming a second dielectr... | 05/01/2012 |
| 8161639 | Method for fabricating an interlayer conducting structure of an embedded circuitry A method for fabricating an interlayer conducting structure of an embedded circuitry is disclosed. In accordance with the method for fabricating an interlayer conducting structure of an embedded circuitry of the present invention, there is no laser conformal mask fo... | 04/24/2012 |
| 8161635 | Methods for forming a single cap via in pad of substrate Novel methods are provided that results in the formation of single-cap VIPs in a substrate are described herein. As a result, fine pitch trace patterns may be formed on the substrate. The methods may include initially providing a substrate having a first and a secon... | 04/24/2012 |
| 8161637 | Manufacturing method for printed wiring board A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming... | 04/24/2012 |
| 8161636 | Circuit board and method of manufacturing the same A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a c... | 04/24/2012 |
| 8161638 | Manufacturing method of circuit structure A manufacturing method of circuit structure is described as follows. Firstly, a composite dielectric layer, a circuit board and an insulating layer disposed therebetween are provided. The composite dielectric layer includes a non-platable dielectric layer and a plat... | 04/24/2012 |
| 8156647 | Method for manufacturing a multilayer printed wiring board A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative... | 04/17/2012 |
| 8156646 | Method for manufacturing printed wiring board A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesivenes... | 04/17/2012 |
| 8156645 | Method of manufacturing a multilayer printed wiring board with copper wrap plated hole Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias o... | 04/17/2012 |
| 8151456 | Method of producing substrate The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and develop... | 04/10/2012 |
| 8141244 | Insulating material and printed circuit board having the same An insulating material, a printed circuit board that utilizes the insulating material, and a method of manufacturing the printed circuit board. The method includes perforating at least one through-hole corresponding with the at least one, which is in correspondence ... | 03/27/2012 |
| 8141243 | Method of manufacturing circuit board A method of manufacturing a circuit board including forming a plurality of first holes in a semiconductor substrate, each of the first holes being opened toward a front surface of the semiconductor substrate, filling a bottom side of the plurality of first holes wit... | 03/27/2012 |
| 8136240 | Method of forming a substrate having a plurality of insulator layers A mechanism is disclosed for providing horizontally split vias in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend compl... | 03/20/2012 |
| 8117744 | Process for forming an isolated electrically conductive contact through a metal package A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom su... | 02/21/2012 |
| 8112885 | Method for forming copper interconnection structures A method for forming a copper interconnection structure includes the steps of forming an opening in an insulating layer, forming a copper alloy layer including a metal element on an inner surface of the opening, and conducting a heat treatment on the copper alloy la... | 02/14/2012 |
| 8112884 | Method for providing an efficient thermal transfer through a printed circuit board A method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrou... | 02/14/2012 |
| 8104171 | Method of fabricating multi-layered substrate The present invention directs to fabrication methods of single-sided or double-sided multi-layered substrate by providing a lamination structure having at least a core structure and first and second laminate structures stacked over both surfaces of the core structur... | 01/31/2012 |
| 8104172 | Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer Embodiments of buffer coatings for semiconductor and integrated circuit manufacturing are presented herein. ... | 01/31/2012 |
| 8091223 | Method for manufacturing board with built-in electronic elements A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conducti... | 01/10/2012 |
| 8079142 | Printed circuit board manufacturing method A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer i... | 12/20/2011 |
| 8069560 | Method of manufacturing multilayer wiring board A manufacturing method of a multilayer wiring board that includes a core board, a wiring layer, and an electrically insulating layer that are stacked on the core board. The manufacturing method forms a plurality of through holes in a core member, a thermal expansion... | 12/06/2011 |
| 8065798 | Method of manufacturing printed circuit board A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating ma... | 11/29/2011 |
| 8065797 | Fabricating method for printed circuit board A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit patte... | 11/29/2011 |
| 8051559 | Method of manufacturing a multi-layer board A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming ... | 11/08/2011 |
| 8051560 | Method of fabricating a solder pad structure A method for fabricating a solder pad structure. A circuit board having thereon at least one copper pad is provided. A solder resist is formed on the circuit board and covers the copper pad. A solder resist opening, which exposes a portion of the copper pad, is form... | 11/08/2011 |
| 8046914 | Method for manufacturing multilayer printed circuit board A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes... | 11/01/2011 |
| 8033016 | Method for manufacturing an electrode and electrode component mounted body A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a tr... | 10/11/2011 |
| 8033015 | Printed wiring board and method of suppressing power supply noise thereof Disclosed is a printed wiring board having signal layers each interposed between a power supply layer and a ground layer, wherein the signal layer includes at least one of a wiring region for a ground potential and a wiring region for a power supply potential. ... | 10/11/2011 |
| 8028407 | Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads A method of producing substrate 3 having feedthrough electrodes for an inkjet head, including: a step of forming grooves in the substrate 1 in the same pitch as that of the inkjet head; a step of setting conductive member 101 in the grooves; a s... | 10/04/2011 |
| 8024858 | Method of manufacturing printed wiring board with built-in electronic component A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based... | 09/27/2011 |
| 8020292 | Methods of manufacturing printed circuit boards Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including a... | 09/20/2011 |
