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Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
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| Number | Title | Issue Date |
| 8161634 | Method of fabricating a printed circuit board A method of fabricating a printed circuit, which involves forming a bump on a first metal layer; laminating an insulating layer on the bump so that the bumps passes through the insulating layer; placing a second metal layer on the insulating layer and then conductin... | 04/24/2012 |
| 7841080 | Multi-chip packaging using an interposer with through-vias One embodiment relates to forming a plurality of vias extending partially through a body, the vias including sidewalls defined by the body. An insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed... | 11/30/2010 |
| 7578058 | Production method of a multilayer ceramic substrate A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the cavity to form a multilayer body, pressing the multilayer body and firing... | 08/25/2009 |
| 7442097 | Method for forming a terminal metal and terminal metal formed by the method A male contact portion, a female contact portion, a clamp portion where an electric wire is clamped for connection, a crimp portion where an electric wire is crimped and a piercing portion where an electric wire is pierced to be crimped are formed separately, whereb... | 10/28/2008 |
| 7430800 | Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring A mechanism for reducing the vertical cross-talk interference experienced in signal lines due to the inductive affects from signal lines in other signal planes of a multi-layer ceramic package is provided. With the apparatus and method, one or more vias in the multi... | 10/07/2008 |
| 7386934 | Double layer patterning and technique for milling patterns for a servo recording head Double photolithography is used to produce an under-layer of protective and filtering photoresist over a substrate that will have channels milled with a FIB. Secondary layers are applied with precision on top of the first layer in order to define the precise pattern... | 06/17/2008 |
| 7383621 | Method of producing a piezoelectric ceramic A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such as a composite perovskite compound, having a higher dielectric constan... | 06/10/2008 |
| 7368374 | Super high density module with integrated wafer level packages A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer level, and integrated circuit modules that include one or more packa... | 05/06/2008 |
| 7356911 | Method for producing an insulated wire A method for producing an insulated wire having a cross section of a desired shape, in which a conductor having a cross section of a desired shape is coated with an insulating film, which method comprises: supplying a raw conductor while passing through a rolling un... | 04/15/2008 |
| 7358445 | Circuit substrate and apparatus including the circuit substrate The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second sur... | 04/15/2008 |
| 7356917 | Method for manufacturing multi-layer printed circuit board A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface r... | 04/15/2008 |
| 7359214 | Backplane with routing to reduce layer count An electronic system having a backplane designed for efficient routing of signal traces. The system includes two or more daughter cards that are connected to multiple other daughter cards in the system. These daughter cards are mounted centrally to the backplane in ... | 04/15/2008 |
| 7346982 | Method of fabricating printed circuit board having thin core layer A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after t... | 03/25/2008 |
| 7340823 | Methods for forming head suspension assemblies Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material.... | 03/11/2008 |
| 7337535 | Hole plugging method for printed circuit boards, and hole plugging device A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board ... | 03/04/2008 |
| 7334325 | Apparatus and method for improving coupling across plane discontinuities on circuit boards The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the dis... | 02/26/2008 |
| 7334323 | Method of making mutilayered circuitized substrate assembly having sintered paste connections A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic c... | 02/26/2008 |
| 7328505 | Method for manufacturing multilayer circuit board A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes 24 | 02/12/2008 |
| 7316063 | Methods of fabricating substrates including at least one conductive via A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by mask... | 01/08/2008 |
| 7299547 | Method for manufacturing tape wiring board A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing proces... | 11/27/2007 |
| 7300182 | LED light sources for image projection systems In accordance with the invention a light source for an image projection system comprises one or more LEDs packaged for high temperature operation. Advantageously, the LED die are disposed on a package comprising a ceramic coated metal base including one or more unde... | 11/27/2007 |
| 7287321 | Multi-layer board manufacturing method Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are pi... | 10/30/2007 |
| 7275309 | Method of manufacturing electrical resistance heating element A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point... | 10/02/2007 |
| 7252408 | LED array package with internal feedback and control A packaged LED array for high temperature operation comprises a metal base, the metal base including an underlying thermal connection pad. One or more layers of ceramic overly the metal base. The array includes a plurality of LED dice, each LED die having electrodes... | 08/07/2007 |
| 7243424 | Production method for a multilayer ceramic substrate An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate comp... | 07/17/2007 |
| 7237335 | Method to service telecommunication box A method and apparatus are provided for servicing a telecommunication junction box. The method enables a reduced number of tools to be utilized to service a telecommunication junction box. ... | 07/03/2007 |
| 7231712 | Method of manufacturing a module A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes, respectively, and a resin filled in a space between the component and t... | 06/19/2007 |
| 7225536 | Precasting multi-layer PCB process A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recess... | 06/05/2007 |
| 7226653 | Printed circuit board and method for producing a printed circuit board A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Im... | 06/05/2007 |
| 7213334 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed board is manufactured by: (a) forming a polyimide precursor layer on a metal layer; (b) forming an upper circuit layer on the polyimide precursor layer by a semi-additive technique; and (c) imidating the polyimide precursor layer to f... | 05/08/2007 |
| 7200927 | Method for producing a wiring transfer sheet A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electri... | 04/10/2007 |
| 7197820 | Circuit board and its manufacturing method A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a... | 04/03/2007 |
| 7183640 | Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component ... | 02/27/2007 |
| 7176502 | Light emitting diodes packaged for high temperature operation In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal bas... | 02/13/2007 |
| 7174632 | Method of manufacturing a double-sided circuit board A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a co... | 02/13/2007 |
| 7176492 | Method for forming ceramic microstructures on a substrate using a mold and articles formed by the method A microstructured assembly including a barrier portions and land portions is described. The microstructures have alternating barrier portions and land portions that have barrier surfaces and land surfaces, respectively. Each barrier surface and land surface is conne... | 02/13/2007 |
| 7171746 | Process for applying conductor tracks to the surface of plastics moldings A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes. The process permits low-cost production of moldings from plastic with conductor tracks integrated on the... | 02/06/2007 |
| 7171748 | Method of manufacturing a liquid jet recording head Disclosed is a manufacturing method of a liquid jet recording head which includes a forming step of forming a recess portion between a flexible film wiring board and a recording element board, a providing step of providing in the recess portion an electrical connect... | 02/06/2007 |
| 7162794 | Manufacturing method for multilayer ceramic elements A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. ... | 01/16/2007 |
| 7159309 | Method of mounting electronic component on substrate without generation of voids in bonding material When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electr... | 01/09/2007 |
