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"I hate what they've done to my child...I would never let my own children watch it. "
Vladimir Zworykin, television pioneer ; Talking about an invention in which he played a critical role.
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| Number | Title | Issue Date |
| 8096049 | Method of manufacturing a multilayer wiring board First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer board... | 01/17/2012 |
| 8065796 | Method and apparatus for using flex circuit technology to create an electrode A method of creating an active electrode that may include providing a flex circuit having an electrode made of a first material and providing a first mask over the flex circuit, the first mask having an offset region and an opening that exposes the electrode. The me... | 11/29/2011 |
| 8037597 | Manufacturing method of tape carrier for TAB Positioning marks are formed on both sides of each printing block on a tape carrier for TAB. A long-sized circuit board is transported by a roll-to-roll system in screen printing. When an optical sensor detects a positioning mark, transportation of the long-sized ci... | 10/18/2011 |
| 7882627 | Method of manufacturing a multilayer wiring board First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer board... | 02/08/2011 |
| 7402758 | Telescoping blind via in three-layer core A multilayer PCB including at least one carrier, wherein the at least one carrier comprises a pseudo three-layer core. Each three-layer core includes a first metal layer, a first dielectric layer, an internal bridge layer, a second dielectric layer, and a second met... | 07/22/2008 |
| 7389581 | Method of forming compliant contact structures A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 06/24/2008 |
| 7387740 | Method of manufacturing metal cover with blind holes therein An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; ste... | 06/17/2008 |
| 7361847 | Capacitance laminate and printed circuit board apparatus and method A method is for fabricating an embedded capacitance printed circuit board assembly (400, 1100). The embedded capacitance printed circuit board assembly includes two embedded capacitance structures (110). Each capacitance structure (110) includes... | 04/22/2008 |
| 7334324 | Method of manufacturing multilayer wiring board A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polya... | 02/26/2008 |
| 7316063 | Methods of fabricating substrates including at least one conductive via A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by mask... | 01/08/2008 |
| 7309447 | Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.... | 12/18/2007 |
| 7299547 | Method for manufacturing tape wiring board A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing proces... | 11/27/2007 |
| 7291278 | Electrode forming method An electrode forming method with an excellent yield, includes: (a) forming an adhesion preventing member having a predetermined pattern on a base member: (b) forming a conductive layer on the base member and the adhesion preventing member; and (c) forming an electro... | 11/06/2007 |
| 7269898 | Method for making an edge intensive antifuse An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate having a plurality of longitudinal members arranged substantially parallel... | 09/18/2007 |
| 7266888 | Method for fabricating a warpage-preventive circuit board A and method for fabricating a warpage-preventive circuit board is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a plurality of discontinuous dummy circuit regions are disposed on the surface... | 09/11/2007 |
| 7261828 | Bumping process A method of forming a plurality of bumps over a wafer mainly comprises providing the wafer having a plurality of bonding pads formed thereon, forming an under bump metallurgy (UBM) layer over the bonding pads wherein the UBM layer includes an adhesive layer, for exa... | 08/28/2007 |
| 7255802 | Tape substrate and method for fabricating the same A method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; coating a solder resist on the formed copper foil pattern, at a region other than the connecting area; plating a barrier layer on the c... | 08/14/2007 |
| 7229856 | Method of manufacturing electronic part packaging structure A method of manufacturing an electronic part packaging structure including a step of mounting an electronic part, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a s... | 06/12/2007 |
| 7216423 | Manufacturing process for smaller active areas in flat panel X-ray detectors The present invention relates to a method for forming an active area or flat panel in an X-ray detector device. The method comprises forming at least one flat form factor panel in a first size on a substrate of a second size and extending at least one contact of the... | 05/15/2007 |
| 7210224 | Method for forming an antifuse An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate having a plurality of longitudinal members arranged substantially parallel... | 05/01/2007 |
| 7188411 | Process for forming portions of a compound material inside a cavity A process for forming portions of a compound material within an electronic circuit includes the formation of a cavity having at least one opening facing onto an access surface. The cavity furthermore has an internal wall with at least one region made of an initial m... | 03/13/2007 |
| 7181836 | Method for making an electrode structure An electronic device such as a sensor or a NEMS. The electronic device comprises at least one substrate; a plurality of electrodes disposed on the substrate; and at least one nano-wire growing from an edge of a first electrode to an edge of a second electrode. A met... | 02/27/2007 |
| 7178233 | Process for producing a collapsed filled via hole A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this or... | 02/20/2007 |
| 7170756 | Trimming electrical parameters in a power supply switching regulator electrical circuit Electrical circuit trimming methods. In one aspect of the invention, a trimming method includes assembling one or more components of an electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more componen... | 01/30/2007 |
| 7155819 | System for making a conductive circuit on a substantially non-conductive substrate A method for forming a conductive circuit on a substantially non-conductive substrate includes indenting a major surface of a substrate with a plurality of features, plating the major surface and the indentations formed with a conductive layer, and removing a portio... | 01/02/2007 |
| 7154048 | Common electrode wire for plating A common electrode line for plating is used for forming conductive patterns of a plurality of circuit substrates on a main substrate. The main substrate has a cut line for dividing one and the other circuit substrates and a plurality of through holes formed on the o... | 12/26/2006 |
| 7151385 | Contact probe, method of manufacturing the contact probe, and device and method for inspection A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the res... | 12/19/2006 |
| 7134198 | Method for manufacturing electric element built-in module with sealed electric element A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring pattern, sealing the electric element with a thermosetting resin comp... | 11/14/2006 |
| 7131188 | Process for implementing conductive tracing layout in touch panel The touch panel comprises two conductive substrates arranged in parallel and secured to each other with a gap existing between the conductive substrates The process for implementing a conductive tracing layout in a touch panel includes steps of forming a first condu... | 11/07/2006 |
| 7103971 | Process for manufacturing a circuit board A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes t... | 09/12/2006 |
| 7102467 | Method for adjusting the frequency of a MEMS resonator There are many inventions described and illustrated herein. These inventions are directed to a method of fabricating a microelectromechanical resonator having an output frequency that may be adjusted, tuned, set, defined and/or selected whether before and/or after f... | 09/05/2006 |
| 7072735 | Control system for utilizing active material elements in a molding system Method and apparatus for controlling an injection molding machine having a first surface and a second surface includes a piezo-ceramic sensor configured to be disposed between the first surface and a second surface. The piezo-ceramic sensor is configured to sense a ... | 07/04/2006 |
| 7045088 | Measuring tool, encoder and producing method of encoder Components of a measuring tool such as a main beam (11) and a slider (12) of a caliper gauge (1) are formed by a synthetic resin containing carbon nanofiber and an electro-conductive electrode (15) is formed on the surface of the main bea... | 05/16/2006 |
| 7020540 | Temperature control A method and apparatus are disclosed for controlling temperature of a plant comprising plural temperature control zones, wherein an effective control parameter for a first zone for which a signal representing measured temperature is available is produced according t... | 03/28/2006 |
| 6974775 | Method and apparatus for making an imprinted conductive circuit using semi-additive plating A method and apparatus for making an imprinted conductive circuit using semi-additive plating. A plurality of indented channels is formed on the substrate. The surface is coated with a conductive layer. Portions of the surface other than the indented channels are co... | 12/13/2005 |
| 6951798 | Method of bonding a stack of layers by electromagnetic induction heating A method of bonding multiple layers is provided. The method includes the steps of stacking the multiple layers on top of each other and volumetrically heating the stack of multiple layers to a predetermined temperature. It is preferred that the stack is heated by el... | 10/04/2005 |
| 6941650 | Method for manufacturing dielectric laminated device By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the firs... | 09/13/2005 |
| 6938332 | Method for manufacturing multilayer ceramic substrates A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, ... | 09/06/2005 |
| 6938336 | Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top and bottom of the board, printing the resin using a mask having an ope... | 09/06/2005 |
| 6913952 | Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages The invention encompasses methods of preparing interposers for utilization in semiconductor packages. The invention includes a method in which an interposer substrate having a surface and a conductive layer extending over the surface is provided. Pads are formed on ... | 07/05/2005 |
