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| Number | Title | Issue Date |
| 8146247 | Method for packaging a sensor unit A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step t... | 04/03/2012 |
| 8065795 | Multi-layer circuit assembly and process for preparing the same Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via... | 11/29/2011 |
| 8046913 | Manufacturing method of circle type terminal used in driving motor of hybrid vehicle The present invention relates to a manufacturing method of circle type terminal for driving motor of hybrid vehicle, comprising: assembling a terminal assembly having a plurality of bus-rings; accommodating the terminal assembly into an insert jig; coupling the inse... | 11/01/2011 |
| 8042267 | Method for producing microsystems The invention relates to a method for producing microsystems comprising microelectronic components that are inserted into cavities created during the layered construction of a base body consisting of a photocurable material, said components being situated adjacent t... | 10/25/2011 |
| 7987590 | Method for manufacturing an electronic part An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin hav... | 08/02/2011 |
| 7958630 | Method for producing a device connector A device connector producing method includes a primary molding step of forming a primary molded body (20) formed with pilot holes (24), a terminal press-fitting step of press-fitting intermediate terminals (11) into the pilot holes (24) t... | 06/14/2011 |
| 7895742 | Method for manufacturing tape wiring board A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process... | 03/01/2011 |
| 7861407 | Busbar structure, method of producing the busbar structure, and electric motor having the busbar structure A method of producing a busbar structure includes a busbar arranging step for arranging a plurality of the busbars at predetermined positions in a cavity which is formed between a fixed mold and a movable mold which can be clamped and opened with respect to the fixe... | 01/04/2011 |
| 7784178 | Higher performance barrier materials for containers of environmentally sensitive semiconductor fabrication devices Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain o... | 08/31/2010 |
| 7676918 | Method for forming a molded circuit board A method for forming a molded circuit board is provided. The method includes the steps of forming a circuit having a first section and a second section on a conductive substrate, the first section and the second section being coplanar; then deforming the conductive ... | 03/16/2010 |
| 7603770 | Method of overmolding an electronic assembly having an insert-molded vertical mount connector header An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving... | 10/20/2009 |
| 7421781 | Method of forming a module component having a plurality of penetration holes According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip com... | 09/09/2008 |
| 7383630 | Method for making a circuit plate A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the first holes; grinding the conductive layer such that the portion of the... | 06/10/2008 |
| 7380338 | Circuit board and manufacturing method thereof A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one protrusion-positioning region. At least a part of the protrusion is disposed on the ... | 06/03/2008 |
| 7371975 | Electronic packages and components thereof formed by substrate-imprinting A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may b... | 05/13/2008 |
| 7367120 | Method for producing a solid-state imaging device A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external t... | 05/06/2008 |
| 7351369 | Molded twist-on wire connector A wire connector wherein the wire engaging core and electrically insulated housing are molded with an exterior surface of a molded wire engaging core used as a mold surface as the electrically insulated housing is molded around the wire engaging core to provide a wi... | 04/01/2008 |
| 7351660 | Process for producing high performance interconnects A method for fabricating high performance vertical and horizontal electrical connections in a three dimensional semiconductor structure. A dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control. Th... | 04/01/2008 |
| 7343675 | Method of constructing a structural circuit A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be ... | 03/18/2008 |
| 7334324 | Method of manufacturing multilayer wiring board A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polya... | 02/26/2008 |
| 7334326 | Method for making an integrated circuit substrate having embedded passive components A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures f... | 02/26/2008 |
| 7334630 | Closed-loop microchannel cooling system Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated r... | 02/26/2008 |
| 7320771 | Method of making a ribbed part out of thermoplastic material covered in a conductive foil, and a ribbed part The invention relates to a method of making a part (2) of thermoplastic material covered on the surface by an electrically conductive foil (4) of thickness less than 0.1 mm, the part also including a rib (6), and the method comprising a step of ... | 01/22/2008 |
| 7308752 | Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis direction, and tracking servo coils for moving the moveable unit containi... | 12/18/2007 |
| 7293355 | Apparatus and method for making circuitized substrates in a continuous manner Apparatus and method for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circu... | 11/13/2007 |
| 7294529 | Method for embedding a component in a base This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it... | 11/13/2007 |
| 7291278 | Electrode forming method An electrode forming method with an excellent yield, includes: (a) forming an adhesion preventing member having a predetermined pattern on a base member: (b) forming a conductive layer on the base member and the adhesion preventing member; and (c) forming an electro... | 11/06/2007 |
| 7289326 | Direct contact cooling liquid embedded package for a central processor unit A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CP... | 10/30/2007 |
| 7287318 | Biosensor A biosensor is provided that comprises a plate element with a pre-determined reaction zone and a recess positioned adjacent to the reaction zone. The biosensor also comprises a reagent that is positioned on the reaction zone. In preferred embodiments, the recess cir... | 10/30/2007 |
| 7282394 | Printed circuit board including embedded chips and method of fabricating the same using plating A method of fabricating a printed circuit board (PCB) including embedded chips, composed of forming a hollow portion for chip insertion through a substrate, inserting the chip into the hollow portion, fixing the chip to the substrate by use of a plating process to f... | 10/16/2007 |
| 7275309 | Method of manufacturing electrical resistance heating element A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point... | 10/02/2007 |
| 7264758 | Method for producing an electrical connector An electrical connector and a method for producing the same are described. A metallic wire is provided. The metallic is folded into a predetermined shape by upper and lower formation devices. One of the formation devices is replaced by a mold, and an insulative mate... | 09/04/2007 |
| 7265978 | Control apparatus having fluid passage for cooling purpose A control apparatus includes a body, a fixation plate and a control circuit arrangement. The body includes first and second fluid passages, which conduct fluid. The fixation plate is installed to the body on one side of the body and includes a third fluid passage, w... | 09/04/2007 |
| 7262079 | Consolidated flip chip BGA assembly process and apparatus A flip chip packaging technique and associated apparatus that consolidates many or all of the steps in a conventional flip chip packaging process results in substantially decreased packaging time, e.g., only one to two hours, complexity, e.g., requiring fewer pieces... | 08/28/2007 |
| 7260890 | Methods for fabricating three-dimensional all organic interconnect structures The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-ax... | 08/28/2007 |
| 7257883 | Method and apparatus for manufacturing an electric heater In the manufacture of an electric heater, means (24, 26) is provided for feeding and guiding a ribbon heating element (14) progressively into overlying edgewise relationship with a base (2). Means (6, 8) is provided for supporting the bas... | 08/21/2007 |
| 7253091 | Process for assembling three-dimensional systems on a chip and structure thus obtained A method for assembling an electronic system with a plurality of layers. Recesses in formed in one or more dielectric layers and electronic components are positioned within the recesses. One or more layers containing the components are placed on a host substrate con... | 08/07/2007 |
| 7246421 | Method for manufacturing surface acoustic wave device A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of co... | 07/24/2007 |
| 7232207 | Ink jet head An ink jet head having a head chip with drive walls made of piezoelectric elements and channel portions alternately arranged in parallel; a top-side and a bottom-side base plates each formed to be longer than the channel portions and fixed on an upper and lower surf... | 06/19/2007 |
| 7228623 | Process for fabricating a multi layer circuit assembly Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via... | 06/12/2007 |
