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| Number | Title | Issue Date |
| 8186051 | Method for fabricating package substrate and die spacer layers having a ceramic backbone Methods for fabricating a layer or layers for use in package substrates and die spacers are described. In one implementation the layer or layers are fabricated to include a plurality of ceramic wells lying within a plane and separated by metallic via with recesses w... | 05/29/2012 |
| 8171627 | Method of forming an electronic device A process of forming an electronic device including forming a first ultraviolet (“UV”) blocking layer over a conductive feature, wherein the first UV blocking layer lies within 90 nm of the conductive structure; forming a first insulating layer over the first UV... | 05/08/2012 |
| 8171628 | Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate A photosensitive conductive film 10 according to the invention includes a support film 1, a conductive layer 2 containing conductive fiber formed on the support film 1, and a photosensitive resin layer 3 formed on the conductive la... | 05/08/2012 |
| 8151455 | Printed circuit board and method of manufacturing the same A method of manufacturing a printed circuit board is provided. The method includes preliminarily forming a plurality of test pattern layers for detecting the depth of an inner layer in a multilayer printed circuit board such that at least a part of a lower test patt... | 04/10/2012 |
| 8141242 | Method of fabricating gold finger of circuit board A method for fabricating a gold finger of a circuit board is provided. First, a circuit board having a board edge for cutting is provided. Next, a copper conducting wire pattern is formed on the circuit board. The copper conducting wire pattern includes a plurality ... | 03/27/2012 |
| 8112883 | Method and apparatus for manufacturing electronic circuit board A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the... | 02/14/2012 |
| 8074352 | Method of manufacturing printed circuit board A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil ... | 12/13/2011 |
| 8065794 | Printed wiring board and its manufacturing method The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be c... | 11/29/2011 |
| 8046912 | Method of making a connection component with posts and pads A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of... | 11/01/2011 |
| 7971354 | Method of manufacturing a multilayer printed wiring board A multilayer printed wiring board manufacturing method including forming conductor posts, which are of substantially uniform thickness and with which the top surfaces are protected by a resist, on a conductor pattern disposed on an upper surface of a build-up layer ... | 07/05/2011 |
| 7966722 | Planarization method in the fabrication of a circuit Planarization methods for maintaining planar surfaces in the fabrication of such devices as BAW devices and capacitors on a planar or planarized substrate are described. In accordance with the method, a metal layer is deposited and patterned, and an oxide layer is d... | 06/28/2011 |
| 7937834 | Method of fabricating capacitive ultrasonic transducers A capacitive ultrasonic transducer includes a first electrode, an insulating layer formed on the first electrode, at least one support frame formed on the insulating layer, and a second electrode formed space apart from the first electrode, wherein the first electro... | 05/10/2011 |
| 7937833 | Method of manufacturing circuit board A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking a... | 05/10/2011 |
| 7930822 | Method and device for manufacturing a conductive member for non-contact type data carrier A conductive member for a non-contact type data carrier such as a wireless tag is simply and cheaply manufactured. A method for manufacturing a conductive member for a non-contact type data carrier comprises: a printing process during which, while a base material ( | 04/26/2011 |
| 7905012 | Method for manufacturing electronic components A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut ex... | 03/15/2011 |
| 7900350 | Method of manufacturing a wiring board A circuit element comprises a wiring board; the wiring board comprises a substrate and a wiring formed on the substrate, and a lid joined on the substrate containing a part of the wiring with a binder and making a sealed space above the substrate, wherein if a spot ... | 03/08/2011 |
| 7895741 | Method of producing a wired circuit board A method of producing a wired circuit board includes preparing a metal supporting board, forming a metal foil on the metal supporting board, forming an insulating layer on the metal foil to expose an unneeded portion of the metal foil, etching the unneeded portion u... | 03/01/2011 |
| 7870665 | Method of manufacturing a conductor circuit, and a coil sheet and laminated coil A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or m... | 01/18/2011 |
| 7856708 | Process for forming at least a portion of a package or an envelope bearing a printed indicia A process for forming a portion of a package or envelope bearing printed indicia, a label bearing printed indicia or a sheet bearing printed indicia includes providing a substrate which constitutes a portion of the package, label or sheet to a printing apparatus, an... | 12/28/2010 |
| 7856709 | Method for high-frequency tuning an electrical device The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as contact points for insulation displacement contacts. Each contact poin... | 12/28/2010 |
| 7849594 | Manufacturing method for integrating passive component within substrate A manufacturing method for integrating a passive component within a substrate is disclosed. The manufacturing method comprises the steps of: providing a circuit layer, wherein a positioning blind hole is formed in the circuit layer; forming a conductive material in ... | 12/14/2010 |
| 7836588 | Method for fabricating an electronic device The invention provides an article and process for producing electronic devices. More particularly the invention relates to an article and process for fabricating patterns of electrically conductive materials on non-electrically conductive substrates by laser ablatio... | 11/23/2010 |
| 7832096 | Method for producing an organic substrate with integral thermal dissipation channels A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-... | 11/16/2010 |
| 7757393 | Capacitive microaccelerometers and fabrication methods Disclosed are moveable microstructures comprising in-plane capacitive microaccelerometers, with submicro-gravity resolution (17 pF/g). The microstructures are fabricated in thick (>100 μm) silicon-on-insulator (SOI) substr... | 07/20/2010 |
| 7752750 | Method of forming wiring Resist films 19 for liftoff are formed on an insulating layer 12 corresponding to a wiring formation region A so as to expose the insulating layer 12 corresponding to formation positions of first seed layers 14 and thereafter, metal films... | 07/13/2010 |
| 7739790 | Electron-emitting device manufacturing method, electron source manufacturing method, image-forming apparatus manufacturing method, and information displaying and playing apparatus manufacturing method Provided is an electron-emitting device using a carbon fiber as an electronic member. A carbon fiber through which a cathode electrode and a control electrode are short-circuited is removed to obtain an electron-emitting device having a uniform electron emission cha... | 06/22/2010 |
| 7703203 | Method of making an electrical circuit A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to y... | 04/27/2010 |
| 7653991 | Method for manufacturing printed circuit board having embedded component A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump ... | 02/02/2010 |
| 7640660 | Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin compo... | 01/05/2010 |
| 7596862 | Method of making a circuitized substrate A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall... | 10/06/2009 |
| 7523549 | Dimensionally stabilized flexible circuit fabrication method and product A method of fabricating a flexible circuit interconnect comprising a conductive pattern on a flexible substrate comprising layers of different components having different coefficients of thermal expansion, including exposing the flexible substrate sequentially to di... | 04/28/2009 |
| 7520053 | Method for manufacturing a bump-attached wiring circuit board An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed ... | 04/21/2009 |
| 7503111 | Method for increasing wiring channels/density under dense via fields A method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the method, the power/ground lines for the circuit board are designed to be provided in an orthogonal or diagonal pattern. The land grid array (LGA)/ball... | 03/17/2009 |
| 7469941 | Method of producing a wiring board A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal... | 12/30/2008 |
| 7441316 | Method for manufacturing electronic apparatus A method for manufacturing an electronic apparatus comprises forming a quartz crystal tuning fork resonator having a fundamental mode of vibration and a second overtone mode of vibration each comprised of a flexural mode of an inverse phase, a series resistance R | 10/28/2008 |
| 7437813 | Probe repair methods A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the pro... | 10/21/2008 |
| 7434310 | Process to reform a plastic packaged integrated circuit die A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a ... | 10/14/2008 |
| 7434311 | Printed wiring board manufacturing method This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through hol... | 10/14/2008 |
| 7428776 | Method of manufacturing a magnetic head A method of manufacturing a thin-film coil in which a first coil and a second coil each having a desired number of winding are electrically connected in series and the second coil is formed between winding portions of the first coil on substantially the same plane, ... | 09/30/2008 |
| 7421767 | Method for manufacturing a piezoelectric vibration device Manufacturing a piezoelectric vibration device, includes: forming a bonding electrode on a part of a piezoelectric substrate to which a cover makes contact; forming a part defining a through hole to the cover so that a profile of an edge of an opening of the through... | 09/09/2008 |
