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"That the automobile has practically reached the limit of its development is suggested by the fact that during the past year no improvements of a radical nature have been introduced."
Scientific American ; Jan. 2 edition, 1909
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| Number | Title | Issue Date |
| 8186050 | Printed wiring board manufacturing method A method for recognizing alignment marks includes preparing a substrate having multiple alignment marks including alignment marks positioned adjacent to each other, and recognizing the alignment marks on the substrate by capturing images of the alignment marks using... | 05/29/2012 |
| 8186049 | Method of making a circuit structure A manufacturing method of a circuit structure is provided as follows. Firstly, a base conductive layer is formed on the carrier board and a first patterned plating-resistant layer having at least one trench for exposing a part of the base conductive layer is formed ... | 05/29/2012 |
| 8186048 | Conformal shielding process using process gases In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more co... | 05/29/2012 |
| 8181340 | External electrode forming method A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component ca... | 05/22/2012 |
| 8181338 | Method of making a multilayer composite A method for providing a multilayer composite includes the steps of providing a first composite comprising a film of a dielectric material with a front surface and an opposite rear surface, the front surface comprising a surface pattern; depositing an electrically c... | 05/22/2012 |
| 8181339 | Method of manufacturing a printed circuit board A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include forming a first protective layer over one surface of a core substrate, forming a first circuit pattern ov... | 05/22/2012 |
| 8176627 | Method of manufacturing wiring substrate and method of manufacturing electronic component device In a method of manufacturing a wiring substrate, first, a structure in which an underlying layer is arranged in a wiring forming area of a temporary substrate and a peelable multi-layer metal foil that is larger in size than the underlying layer is arranged on the u... | 05/15/2012 |
| 8171626 | Method for forming embedded circuit A method for forming an embedded circuit is disclosed. First, a substrate including a dielectric layer is provided. Second, the dielectric layer is entirely covered by a dummy layer. Then, the dummy layer is patterned and a trench is formed in the dielectric layer a... | 05/08/2012 |
| 8166647 | Method of manufacturing a printed circuit board A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; ... | 05/01/2012 |
| 8166648 | Method of manufacturing a wiring substrate There is provided a wiring substrate manufacturing method. The wiring substrate includes: a plurality of conductor patterns formed on a mounting surface on which an electronic component is to be mounted, wherein each of the conductor patterns is covered with a corre... | 05/01/2012 |
| 8161633 | Method of fabricating non-planar circuit board A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dime... | 04/24/2012 |
| 8132320 | Circuit board process A circuit board process is provided. In the circuit board process, a first substrate and a second substrate are stacked to form a cavity for accommodating chips. The top of the cavity is covered by a third metal layer that serves as a mask. The first substrate has a... | 03/13/2012 |
| 8127441 | Method of manufacturing ceramic/metal composite structure A method of manufacturing a ceramic/metal composite structure includes the steps of: providing a ceramic substrate; forming a metal interface layer on the ceramic substrate; placing a copper sheet on the metal interface layer; heating the ceramic substrate, the meta... | 03/06/2012 |
| 8127440 | Method of making bondable flexible printed circuit A method for producing a circuit assembly having a non-conductive substrate upon which printed conductors may be easily and selectively interconnected to another circuit assembly device, and/or apparatus. ... | 03/06/2012 |
| 8122599 | Method of manufacturing a printed circuit board (PCB) A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal l... | 02/28/2012 |
| 8117743 | Methods for fabricating current-carrying structures using voltage switchable dielectric materials A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference betwe... | 02/21/2012 |
| 8104170 | Charge plate fabrication technique A charge plate and a method for fabricating a charge plate for an ink jet printhead includes the steps of removing portions of conductive material from a dimensionally stable substrate with a coating of conductive material to form at least a first and second electro... | 01/31/2012 |
| 8099866 | Conductor-clad laminate, wiring circuit board, and processes for producing the same In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150° C. to thereby form an adhesive layer 2. S... | 01/24/2012 |
| 8096048 | Method for fabricating MEMS structure A method for fabricating a MEMS is described as follows. A substrate is provided, including a circuit region and a MEMS region separated from each other. A first metal interconnection structure is formed on the substrate in the circuit region, and simultaneously a f... | 01/17/2012 |
| 8061025 | Method of manufacturing heat radiation substrate having metal core A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with a... | 11/22/2011 |
| 8061024 | Method of fabricating a circuit board and semiconductor package. Provided are a circuit board, a semiconductor package including the circuit board, a method of fabricating the circuit board, and a method of fabricating the semiconductor package. The method of fabricating the circuit board includes: forming at least one pair of ro... | 11/22/2011 |
| 8061023 | Process of fabricating a semiconductor package A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. ... | 11/22/2011 |
| 8056223 | Method of producing a suspension board with circuit A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; a... | 11/15/2011 |
| 8051558 | Manufacturing method of the embedded passive device A manufacturing method for mainly embedding the passive device structure in the printed circuit board is presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source bran... | 11/08/2011 |
| 8037596 | Method for manufacturing a wiring board A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer coverin... | 10/18/2011 |
| 8033013 | Method of making rigid-flexible printed circuit board having a peelable mask The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conduct... | 10/11/2011 |
| 8033014 | Method of making a molded interconnect device The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned ci... | 10/11/2011 |
| 8028406 | Methods of fabricating coplanar waveguide structures Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially... | 10/04/2011 |
| 8024857 | Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same A substrate for a semiconductor package having a reinforcing member that prevents or minimizes distortions is presented. The substrate for the semiconductor package includes a substrate body, an insulation layer, and a reinforcing member. The substrate body has a fi... | 09/27/2011 |
| 8024856 | Method for manufacturing printed circuit board A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the... | 09/27/2011 |
| 8020291 | Method of manufacturing a printed wiring board The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer p... | 09/20/2011 |
| 8011090 | Method for forming and planarizing adjacent regions of an integrated circuit Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolida... | 09/06/2011 |
| 8006377 | Method for producing a printed wiring board The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer p... | 08/30/2011 |
| 8001684 | Method for manufacturing flexible printed circuit boards An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number ... | 08/23/2011 |
| 8001685 | Method for manufacturing probe card needles Disclosed are probe card needles manufactured using microfabrication technology, a method for manufacturing the probe card needles, and a probe card having the probe card needles. The probe needles are manufactured by forming, on a ceramic board, probe needle bases ... | 08/23/2011 |
| 7996988 | Method of making a plurality of calibration-adjusted sensors Methods of making sensors, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter elec... | 08/16/2011 |
| 7992294 | Method of manufacturing an interconnect device which forms a heat sink and electrical connections between a heat generating device and a power source An interconnect device is used to mate a heat generating device to a power source. Plated components are provided on the interconnect device to provide a heat sink function for the heat generating device when the heat generating device is connected to the interconne... | 08/09/2011 |
| 7987587 | Method of forming solid vias in a printed circuit board A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-... | 08/02/2011 |
| 7987589 | Multilayer three-dimensional circuit structure and manufacturing method thereof A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circu... | 08/02/2011 |
| 7987588 | Interposer for connecting plurality of chips and method for manufacturing the same The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The thr... | 08/02/2011 |
