Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 8166646 | Method for connecting two objects electrically A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a l... | 05/01/2012 |
| 8146246 | Method of manufacturing a wired circuit board A method of manufacturing a wired circuit board, including: forming an insulating layer in a pattern thereby forming second through holes penetrating the insulating layer in a thickness direction thereof; and after forming the insulating layer, forming, on the insul... | 04/03/2012 |
| 8141241 | Method of manufacturing a printed circuit board having metal bumps A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier lay... | 03/27/2012 |
| 8091222 | Method for forming an adapter apparatus using curable material An adapter apparatus and methods for using in providing such adapter apparatus include providing a substrate having a plurality of openings defined therethrough. A plurality of conductive elements are mounted within corresponding openings thereof using a curable mat... | 01/10/2012 |
| 8091221 | Method of fabricating circuit board A method of fabricating a circuit board includes the following steps. First, a patterned metal board is provided. The patterned metal board includes a patterned circuit having at least a pad. Next, a dielectric layer is formed on the patterned metal board to cover t... | 01/10/2012 |
| 8028405 | Device and method for fitting printed circuit boards with contact pins A device for fitting printed circuit boards (5) with contact pins (7), comprising at least one insertion device (1) for inserting at least one contact pin (7) into a printed circuit board (5), at least one measuring device (3 | 10/04/2011 |
| 8020290 | Processes for IC fabrication The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete com... | 09/20/2011 |
| 8015703 | Method of manufacturing a wired circuit board A method of manufacturing a wired circuit board including a metal supporting board. An insulating layer is formed on the metal supporting board in a pattern in which concave portions are formed. A conductive pattern in a pattern having terminals for connecting with ... | 09/13/2011 |
| 8011089 | Method of repairing segmented contactor A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled ... | 09/06/2011 |
| 8011088 | Method for securing a circuit board to a socket The present invention provides a securing device for securing a card to a socket within a computer is provided where the card and the socket are coupled. The device includes a unitary base member comprising a foundation portion dimensioned to receive a stationary so... | 09/06/2011 |
| 7975379 | Method of making a land-grid-array (LGA) interposer LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating su... | 07/12/2011 |
| 7908746 | Method of removing a backplane from an electrical enclosure An electrical enclosure that includes a sidewall, a back and a top, defining an interior. The top of the enclosure is adapted to open and provide access to the interior. The enclosure includes a backplane mounted to the interior of the enclosure. The backplane has a... | 03/22/2011 |
| 7891090 | Method for manufacturing an interposer A method for manufacturing an interposer including a body and a plurality of probes connected to said body is disclosed. The method includes a step of manufacturing said body including the sub-steps of preparing a first substrate having one surface side and the othe... | 02/22/2011 |
| 7877869 | Lead body-to-connector transition zone A medical electrical lead includes a lead body and a connector terminal. A conductor extends from the lead body to the connector terminal along a helical path through a transition zone. ... | 02/01/2011 |
| 7793414 | Methods for forming connection structures for microelectronic devices Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive p... | 09/14/2010 |
| 7761983 | Method of assembling a wafer probe The present invention relates to a method of assembling a probe for testing of integrated circuits or other microelectronic devices. ... | 07/27/2010 |
| 7726014 | Manufacturing unit of position controller First, a position control mechanism having a fixed part and a movable part, and a driver that changes position of the movable part relative to the fixed part is prepared. Next, a manufacturing unit having first and second holders and a coupler that couples the first... | 06/01/2010 |
| 7716824 | Method of manufacturing a probe card An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support p... | 05/18/2010 |
| 7707714 | Method for producing a microcoil Production of microscopic and nanoscopic coils, by rolling up conductor layers during the removal of auxiliary layers from a substrate. By removing the auxiliary layer from the substrate, for example by virtue of a sacrificial layer situated in between being selecti... | 05/04/2010 |
| 7685704 | Method for manufacturing bump of probe card A method for manufacturing a bump of a probe card is disclosed. In accordance with the present invention, the bump has a high aspect ratio, a high elasticity, a high durability suitable for testing a high speed device. The bump is formed using a sacrificial substrat... | 03/30/2010 |
| 7669319 | Method for fabricating a flexible display A substrate transferring method and a method for fabricating a flexible display by using the same are disclosed. The method for transferring a substrate includes providing a glass substrate with a recess formed thereon, aligning a flexible substrate on the glass sub... | 03/02/2010 |
| 7578057 | Method of fabricating segmented contactor A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled ... | 08/25/2009 |
| 7555834 | Method of manufacturing an interconnection device Methods of manufacture of interconnection devices that include using a non-forming process to manufacture a plurality of compression contacts, each compression contact including a cantilevered beam portion that is tapered along its length, and disposing each of the ... | 07/07/2009 |
| 7530164 | Wafer-level underfill process making use of sacrificial contact pad protective material A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circui... | 05/12/2009 |
| 7530165 | Method of making an elevated height electrical connector An electrical connector includes first and second connector bodies which are arranged to first be positioned together, and then separated once electrical contacts have been inserted in at least one of the first and second connector bodies. During, after, or both dur... | 05/12/2009 |
| 7523547 | Method for attaching a flexible structure to a device and a device having a flexible structure Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first s... | 04/28/2009 |
| 7430797 | Method for making an electrical component An method for manufacturing an electrical component comprises providing a base body of a ceramic material with at least two contact regions with terminal elements secured thereto. The base body is immersed into a solution that contains a fluid that wets the base bod... | 10/07/2008 |
| 7426117 | Chip on a board An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC d... | 09/16/2008 |
| 7421778 | Method of making an electronic assembly According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of ... | 09/09/2008 |
| 7412767 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 08/19/2008 |
| 7409762 | Method for fabricating an interconnect for semiconductor components A method for fabricating an interconnect for testing a semiconductor component includes the steps of providing a substrate, and forming interconnect contacts on the substrate configured to electrically engage component contacts on the component. The interconnect con... | 08/12/2008 |
| 7401402 | Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as contact points for insulation displacement contacts. Each contact poin... | 07/22/2008 |
| 7395598 | Face plate securement method A method for installing an electrical fixture such as a power switch or power receptacle. The method may include the steps of selecting an assembly comprising an a face plate, an electrical fixture, and at least one anchor, connecting a conductor to the electrical f... | 07/08/2008 |
| 7383632 | Method for fabricating a connector A method for fabricating an electrical connector made up of an array of metallic contacts that act as conductive carriers, each attached to a flexible insulating sheet in one of an array of openings provided in the flexible sheet. The metallic contacts have portions... | 06/10/2008 |
| 7380322 | Device for insertion of contacts into connector insulator cavities A contact insertion device comprises an arrangement of elements the like of independent linear multi axis actuator providing positioning and fixation for electrical connection element and cylindrical elongated electrical conductor article having a wire electrically ... | 06/03/2008 |
| 7372286 | Modular probe card A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circu... | 05/13/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7365553 | Probe card assembly A probe card assembly has a probe contractor substrate having a plurality of probe contractor tips thereon and a probe card wiring board with an interposer disposed between the two. Support posts contacting the probe contractor substrate are vertically adjustable un... | 04/29/2008 |
| 7363688 | Land grid array structures and methods for engineering change A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to... | 04/29/2008 |
| 7356920 | Micro-machined structure production using encapsulation Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structur... | 04/15/2008 |
