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...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Number | Title | Issue Date |
| 8166645 | Method for providing near-hermetically coated, thermally protected integrated circuit assemblies The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes adding ... | 05/01/2012 |
| 8156644 | Method for manufacturing a printed circuit board having conformal EMI shield An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes th... | 04/17/2012 |
| 8117742 | Fabrication method of semiconductor integrated circuit device A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By... | 02/21/2012 |
| 8065793 | Method of encapsulating an electronic component An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure whic... | 11/29/2011 |
| 8051557 | Substrate with multi-layer interconnection structure and method of manufacturing the same The invention provides a substrate with multi-layer interconnection structure, which includes a substrate and a multi-layer interconnection structure formed on the substrate. The multi-layer interconnection structure is adhered to the substrate in partial areas. The... | 11/08/2011 |
| 8020289 | Method of producing electronic device A method of producing an electronic device includes a molding of a first casing to seal a first face of a circuit board and electronic parts mounted on the first face. The producing method further includes a mounting of electronic parts on a second face of the circu... | 09/20/2011 |
| 7971350 | Method of providing a RF shield of an electronic device A shielding assembly is configured to provide electromagnetic shielding and environmental protection to one or more electronic components coupled to a substrate. The shielding assembly includes a non-conductive mold compound layer, such as a dielectric epoxy. The mo... | 07/05/2011 |
| 7971351 | Method of manufacturing a semiconductor device The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural ... | 07/05/2011 |
| 7941916 | Manufacturing method for memory card A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads ar... | 05/17/2011 |
| 7934312 | Production method of an electronic circuit device An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection an... | 05/03/2011 |
| 7934313 | Package structure fabrication method A fabrication method of a package structure includes: preparing a metal plate having first and second surfaces and defined with an active region; forming a wiring layer with conductive traces and first electrical contact pads on the first surface; forming third elec... | 05/03/2011 |
| 7877868 | Method of fabricating circuit configuration member A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an a... | 02/01/2011 |
| 7836586 | Thin foil semiconductor package The present invention relates to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. One such arrangement involves a foil carrier structure, which includes a foil adhered to a carrier having cavities. Som... | 11/23/2010 |
| 7765687 | Method for mechanical packaging of electronics Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the c... | 08/03/2010 |
| 7712211 | Method for packaging circuits and packaged circuits A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contac... | 05/11/2010 |
| 7694415 | Method of manufacturing component-embedded printed wiring board The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top... | 04/13/2010 |
| 7681308 | Fabrication method of semiconductor integrated circuit device A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By... | 03/23/2010 |
| 7631422 | Method of manufacturing wiring substrate having terminated buses A terminal resistor is provided at the end of a bus formed on a wiring substrate. An insulator having a large dielectric loss angle is provided in the vicinity of the terminal resistor to absorb high frequency electromagnetic waves in the vicinity. This arrangement ... | 12/15/2009 |
| 7584537 | Method for making a microcircuit card A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) ... | 09/08/2009 |
| 7520052 | Method of manufacturing a semiconductor device The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural ... | 04/21/2009 |
| 7516543 | Method for manufacturing semiconductor component with a media channel A semiconductor component includes a media channel and at least the following components: a semiconductor chip on a wiring substrate, electric connecting elements disposed between the semiconductor chip and the wiring substrate, and a plastic housing mass that embed... | 04/14/2009 |
| 7487586 | Process for producing semiconductor device A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device comprising a substrate having bumps formed thereon, comprises covering th... | 02/10/2009 |
| 7478474 | Method of manufacturing shielded electronic circuit units A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is provided on a top surface of a sealing resin portion for burying an elect... | 01/20/2009 |
| 7467464 | Method of manufacturing a memory card A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and... | 12/23/2008 |
| 7426780 | Method of manufacturing a power module A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placi... | 09/23/2008 |
| 7421781 | Method of forming a module component having a plurality of penetration holes According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip com... | 09/09/2008 |
| 7420128 | Electronic component embedded substrate and method for manufacturing the same An electronic component embedded substrate and a method for manufacturing the substrate are disclosed. The electronic component embedded substrate includes a substrate main body and an electronic component embedded in the substrate main body. The center plane of the... | 09/02/2008 |
| 7413482 | Method for forming a connector assembly for use with an implantable medical device A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as ... | 08/19/2008 |
| 7392581 | Method for manufacturing a magnetic element A plate member includes a frame portion (51) provided in a state of coupling both one end portion and other end portion and mounting terminal portions (44) protruding from the one end portion and the other end portion of said frame portion (51) ... | 07/01/2008 |
| 7389570 | Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1(b)), a conductor layer is formed on an electrode non-forming surface of the piezoelectric substrate 2 (FIG. 1(c)). After formi... | 06/24/2008 |
| 7389581 | Method of forming compliant contact structures A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the sub... | 06/24/2008 |
| 7377031 | Fabrication method of semiconductor integrated circuit device A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By... | 05/27/2008 |
| 7370402 | Method for producing stator packs for long-stator linear motors of magnetic levitation railways A method for producing stator packs for long-stator linear motors of magnetic levitation vehicles is described. At first steel sheets are stacked to form a sheet stack, cross members are inserted into grooves of the sheet stack and the sheet stack and the cross memb... | 05/13/2008 |
| 7370406 | Method of manufacturing a thin film structure A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion. The insulating layer is present under the extending part. A method of ... | 05/13/2008 |
| 7372133 | Microelectronic package having a stiffening element and method of making same A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact l... | 05/13/2008 |
| 7368795 | Image sensor module with passive component An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second... | 05/06/2008 |
| 7368323 | Semiconductor device and manufacturing method thereof A semiconductor device is provided which includes a first semiconductor chip, a substrate onto which the first semiconductor chip is flip-chip bonded and on which a concave is formed along one side of the first semiconductor chip which is flip-chip bonded, a second ... | 05/06/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7360294 | Method of assembling an inductive proximity sensor A method of assembling an inductive proximity sensor maintains inductive coil wound bobbins in fixed relation to an inductive core within a housing. The method includes configuring two inductive coil wound bobbins with an integral ledge cantilevered from an inside s... | 04/22/2008 |
| 7359206 | Radio frequency isolation system and cover assembly for vacuum electron device A self-guiding cover assembly for a vacuum electron device (VED) enclosure (704, 1316) has a cover (1002, 1302), a pair of guide plates, and a pair of guide elements (1304, 1306). The cover has at least one electrical connector (1314) dis... | 04/15/2008 |
