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"I hate what they've done to my child...I would never let my own children watch it. "
Vladimir Zworykin, television pioneer ; Talking about an invention in which he played a critical role.
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| Number | Title | Issue Date |
| 8171625 | Method of providing low footprint optical interconnect Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to ... | 05/08/2012 |
| 8156643 | Semiconductor device A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a copper contact pad that faces away from the carrier, extending a cop... | 04/17/2012 |
| 8146245 | Method for assembling a wafer level test probe card A method for assembling a probe card for wafer level testing of a plurality of semiconductor devices simultaneously is disclosed. The probe card may include a circuit board including wafer level testing circuitry, a partially flexible silicon substrate, a plurality ... | 04/03/2012 |
| 8122598 | Multilayer printed wiring board and component mounting method thereof A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third an... | 02/28/2012 |
| 8087163 | Method of manufacturing a contact arrangement between a microelectronic component and a carrier The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by this method, whereby thermal energy required... | 01/03/2012 |
| 8069559 | Method of assembling an insulated metal substrate An insulated metal substrate laminate includes a metal substrate, a dielectric layer disposed upon the metal substrate, wherein the dielectric layer comprises a thermoplastic film having a thickness of less than or equal to 10 micrometers, a thermal resistance of le... | 12/06/2011 |
| 8046911 | Method for mounting electronic component on substrate and method for forming solder surface A method for mounting an electronic component on a substrate includes: forming an Au bump (24) on a surface of an electrode (20) of a substrate (10); placing an Sn-based solder sheet (26) on the Au bump; subjecting the Sn-based solder she... | 11/01/2011 |
| 8001682 | Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same A high-efficiency production method for a power module substrate with reduced line width of a conductive pattern provides an insulation substrate suitable for realizing a large current and a high voltage of a power module. According to the method, a brazing sheet is... | 08/23/2011 |
| 7966721 | Electronic component mounting method and electronic component mounting device In order to mount an electronic component, a connection terminal of the electronic component is bonded to electrodes of a substrate. This is done by using solder paste which mixes solder particles in a thermosetting adhesive. The solder paste is supplied to the elec... | 06/28/2011 |
| 7958629 | Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components A method for making an electronic module with an integrated electromagnetic shield uses surface mount shield wall components. At least one electronic component and two or more of the shield wall components are mounted on a surface of a circuit board panel using a pi... | 06/14/2011 |
| 7918018 | Method of fabricating a semiconductor device In a method and apparatus for fabricating a semiconductor device having a flexible tape substrate, a hole is punched in the flexible tape substrate. The flexible tape substrate includes a metal layer attached to a polyimide layer without an adhesive there between. A... | 04/05/2011 |
| 7900349 | Method of fabricating an electronic device An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal patt... | 03/08/2011 |
| 7886432 | Electric components connecting method A method for connecting a first terminal array 6 provided in a connection portion 5 of a first electric component and a second terminal array 8 provided in a connection portion 7 of a second electric component to each other in such a mann... | 02/15/2011 |
| 7841079 | Electronic component mounting system and electronic component mounting method In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position ... | 11/30/2010 |
| 7793413 | Method of mounting electronic components An electronic component mounting method for mounting a electronic component on a board, in which an Au bump provided at an electronic component is joined to a joining terminal formed on a board by using solder made of Sn or solder containing Sn and the electronic co... | 09/14/2010 |
| 7757392 | Method of producing an electronic component An electronic component has at least one first vertical semiconductor power device with a first side and a second side opposing the first side. One side is attached to an electrically conductive surface by a diffusion solder bond and the opposing side is attached to... | 07/20/2010 |
| 7757391 | Method for applying viscous medium on a substrate A method of applying viscous medium on a substrate that is arranged for mounting of components includes providing the substrate arranged for mounting of electronic components thereon and screen printing predetermined amounts of a viscous medium on predetermined posi... | 07/20/2010 |
| 7752749 | Electronic component mounting method and electronic component mounting device One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal ar... | 07/13/2010 |
| 7748113 | Electronic component mounting method An electronic component mounting apparatus includes a mounting device adapted such that the applying unit applies adhesive to a substrate located in a predetermined site, a mounting unit mounts an LSI onto the application of the adhesive, subsequently the applying u... | 07/06/2010 |
| 7703199 | Method to accommodate increase in volume expansion during solder reflow Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of th... | 04/27/2010 |
| 7685703 | Method of making an essentially monolithic capacitor A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance, a printed circuit board having the capacitor mounted thereon, and a method of making. Sheets of green-state ceramic dielectric material and glass/metal compo... | 03/30/2010 |
| 7681307 | Soldering a flexible circuit Techniques are provided for controlling solder flow in applications where a flexible circuit is soldered to a microelectromechanical structure. A metal layer is formed on a substrate. A solder mask is formed on the metal layer such that portions of the metal layer a... | 03/23/2010 |
| 7676915 | Process for manufacturing an LED lamp with integrated heat sink A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a hea... | 03/16/2010 |
| 7676916 | Electronic component mounting system and electronic component mounting method In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each oth... | 03/16/2010 |
| 7673386 | Flip-chip component production method The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and t... | 03/09/2010 |
| 7657998 | Method of making a resin-packaged protection circuit module for rechargeable batteries A protection circuit module for rechargeable batteries includes a substrate, electronic components mounted on the obverse surface of the substrate for forming a protection circuit for rechargeable batteries, a housing mounted on the obverse surface of the substrate ... | 02/09/2010 |
| 7650693 | Method of assembling electronic components of an electronic system, and system thus obtained An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the... | 01/26/2010 |
| 7607222 | Method of manufacturing an electronic component package An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first carrier board; stacking an insulation layer on the first carrier board a... | 10/27/2009 |
| 7591069 | Methods of bonding solder balls to bond pads on a substrate, and bonding frames Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are with... | 09/22/2009 |
| 7578056 | Method of coating contacts on a surface of a flip chip A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically condu... | 08/25/2009 |
| 7546682 | Methods for repairing circuit board having defective pre-soldering bump A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micr... | 06/16/2009 |
| 7506436 | Methods for making conforming shielded form for electronic component assemblies The present invention provides a method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of: (a) metalizing a sheet of a thermoformable polymer with an admixture of a conductive... | 03/24/2009 |
| 7500308 | Method of detaching electronic component from printed circuit board A printed circuit board unit includes an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole. The through hole may be designed to form a constriction in a solder bump. The solder bump is received on an i... | 03/10/2009 |
| 7493690 | Method of attaching electronic components to printed circuit board and attachment structure thereof In a method of attaching an electronic component to a printed circuit board by a plurality of screws that are inserted into corresponding through holes cut in the board from a surface of the board and then screwed into corresponding screw holes formed in the compone... | 02/24/2009 |
| 7490403 | Soldering method In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated ... | 02/17/2009 |
| 7484293 | Semiconductor package and manufacturing method therefor A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board 12,... | 02/03/2009 |
| 7480989 | Method for manufacturing pressure detector A method for manufacturing a pressure detector includes the steps of: preparing a first member including a sensing portion, a second member including a pressure receiving diaphragm, and a pressure transmission member; inserting the pressure transmission member betwe... | 01/27/2009 |
| 7472477 | Method for manufacturing a socket that compensates for differing coefficients of thermal expansion The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided. The surface mounted contacts are a plurality of conductive metal pad... | 01/06/2009 |
| 7434309 | Method and apparatus for supporting a circuit component having solder column interconnects using an external support A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package an... | 10/14/2008 |
| 7428777 | Method of making a heatsink device A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided includ... | 09/30/2008 |
