Famous Patents
3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 7730612 | Method of manufacturing component-embedded printed circuit board A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked... | 06/08/2010 |
| 7647695 | Method of matching harnesses of conductors with apertures in connectors An OCR system for matching wire harnesses and connectors facilitates precise registration of wire number strings, uses geometric modeling for character recognition, and restricts searches by region and character to ensure speed and accuracy. A string location algori... | 01/19/2010 |
| 7621042 | Method for mounting electronic components on a substrate A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic components which are inserted and positioned in the positioning holes... | 11/24/2009 |
| 7568284 | Components insertion method In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer chuck so that the device portion is placed at a component insertion pos... | 08/04/2009 |
| 7480988 | Method and apparatus for providing hermetic electrical feedthrough A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≦40 mils. More particularly, the method yields an apparatus including a hermetic electrical feedthrough which is both biocompatible and electroche... | 01/27/2009 |
| 7458148 | Joint connector and method assembling the same A joint connector includes a plurality of connection terminals, each of the connection terminals including a contact portion, a housing fixing portion and a press-fitting portion, a connector housing that includes a plurality of terminal fixing portions for fixing t... | 12/02/2008 |
| 7383628 | Cable duct punch tool and method Disclosed is a punch tool which is used to create apertures at any desired location in a raceway duct. The punch tool has two opposed jaws. A first jaw has an angularly-truncated tubular blade. The other jaw has a tube-shaped blade receiving device which receives th... | 06/10/2008 |
| 7377028 | Electrical connector insertion and removal tool A connector insertion and removal tool for an electrical system including a circuit board and at least one electrical connector therefor includes a first portion configured for coupling to a first surface of the circuit board, and a second portion configured for cou... | 05/27/2008 |
| 7369334 | Optical device with alignment compensation An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to... | 05/06/2008 |
| 7362586 | Electronic component with shielding case and method of manufacturing the same Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves a... | 04/22/2008 |
| 7358836 | Shield, and printed circuit board and electrical apparatus employing the same A shield is provided for a circuit breaker including a printed circuit board (PCB). The PCB is a generally planar member with a plurality of electrical components each having a corresponding shape. The shield includes at least one resilient sheet member at least par... | 04/15/2008 |
| 7354697 | Process for producing wiring circuit board The invention provides a process for producing a wiring circuit board, which comprises the steps of: (A) forming a conductor layer of a predetermined pattern on an insulating layer; (B) forming a photosensitive solder resist layer on the insulating layer and the pat... | 04/08/2008 |
| 7328506 | Method for forming a plated microvia interconnect A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element included in the surface. An opening formed in the EDL exposes the conductiv... | 02/12/2008 |
| 7325299 | Method of making a circuitized substrate A method of making a circuitized substrate. A conductive layer having a substantially planar upper surface is formed on and in direct mechanical contact with an upper surface of a substrate. A portion of the conductive layer is removed to form an interim side wall i... | 02/05/2008 |
| 7312404 | Conductive contamination reliability solution for assembling substrates A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads ... | 12/25/2007 |
| 7311241 | Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowin... | 12/25/2007 |
| 7310212 | Connector A connector includes a base board having at least four contacts provided on each of two opposite sides thereof. The contacts on the second side of the base board are arranged in the reverse order relative to the contacts on the first side of the base board, and some... | 12/18/2007 |
| 7309916 | Semiconductor package and method for its manufacture A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one or more decoupling capacitors. The semiconductor chip is in direct c... | 12/18/2007 |
| 7292448 | Circuit substrate A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second land portions located at a predetermined interval on one surface and a ... | 11/06/2007 |
| 7290330 | Coupling invertible and pluggable module to a circuit board A system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circ... | 11/06/2007 |
| 7290333 | Manufacturing method of a multilayer printed wiring board A conductive film has a plurality of clearances (openings) and a plurality of auxiliary clearances. The plurality of clearances and the plurality of auxiliary clearances are formed to have such numerical apertures and locations that generate no bias in the distribut... | 11/06/2007 |
| 7291922 | Substrate with many via contact means disposed therein A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavit... | 11/06/2007 |
| 7284321 | Method for testing a chip with a package and for mounting the package on a board A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted ... | 10/23/2007 |
| 7284941 | Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least pa... | 10/23/2007 |
| 7282824 | Press-fitting method and rectifying device having press-fitted member In a rectifying device for a vehicular AC generator, a rectifying element is press-fitted in a positive-side radiation plate. The radiation plate is prepared in a predetermined shape and an engaging hole is punched in the radiation plate. Four grooves are formed in ... | 10/16/2007 |
| 7265561 | Device burn in utilizing voltage control According to the present invention, a method of controlling the burning in of at least one I/C device in a burn in tool is provided. For high power device, the tool has a heat sink positioned to contact each device being burned in, and has a socket for mounting each... | 09/04/2007 |
| 7263770 | Electrical connector Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in ... | 09/04/2007 |
| 7254890 | Method of making a microfluid ejection head structure A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel mate... | 08/14/2007 |
| 7254882 | Sealing method for through hole formed in metal housing The present invention provides a method for sealing a metal housing member. A housing through hole is formed in a housing member for a lead wire sealing device. The housing member is provided with a housing through hole formed on the metal housing member and penetra... | 08/14/2007 |
| 7253637 | Arc fault circuit interrupter system In order to determine whether arcing is present in an electrical circuit, a sensor signal corresponding to current in said electrical circuit is processed. The sensor signal is filtered to determine the presence of noise in a predetermined frequency range and produc... | 08/07/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7240425 | Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board What is provided is a multi-layer PCB having a plurality of stacked dielectric layers, a conductor disposed on at least one of the plurality of dielectric layers, and a non-conductive via extending through at least a portion of the plurality of dielectric layers to ... | 07/10/2007 |
| 7225530 | Connector press A connector press provides for learning a specified connector pressed position, adjusting a force based threshold, and simultaneously pressing multiple connector types into a circuit board. The force based threshold may be adjusted via a slider bar on a user interfa... | 06/05/2007 |
| 7223316 | Method for manufacturing electronic component A method for manufacturing an electronic component includes the steps of inserting tabs of a cover into through holes formed in a circuit board having mounting elements on the front surface thereof, disposing a print mask having openings at positions corresponding t... | 05/29/2007 |
| 7219418 | Method to prevent damage to probe card Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe need... | 05/22/2007 |
| 7216419 | Method of manufacturing a high-frequency coil device In a high-frequency coil device having small dispersion in coil inductance and suitable for use in GHz band and a method of manufacturing the high-frequency coil device, a spirally-shaped fine-pitch coil is embedded in the surface of a polyimide layer as a dielectri... | 05/15/2007 |
| 7210222 | Power supply control method The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to... | 05/01/2007 |
| 7208938 | Test tray for handler A test tray includes a rectangular shaped frame and a plurality of transport modules to receive a plurality of semiconductor devices. A precise location-determining unit mounted on both sides of the frame to precisely determines and fixes the test tray location. Acc... | 04/24/2007 |
| 7204018 | Technique for reducing via capacitance A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a se... | 04/17/2007 |
| 7196459 | Light emitting assembly with heat dissipating support A light emitting assembly includes a metal substrate for dissipating heat from the assembly. The metal substrate includes an electrically insulating layer or coating on at least one side. Circuit traces are applied to the electrically insulating layer using either t... | 03/27/2007 |
