Famous Patents
British merchant Peter Durand invented the tin can in 1810.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8141240 | Manufacturing method for micro-SD flash memory card A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows ... | 03/27/2012 |
| 8028404 | Multi-function module An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out... | 10/04/2011 |
| 7874068 | Production method for electronic chip component A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and dr... | 01/25/2011 |
| 7676914 | Methods for sensor having capacitor on chip In an exemplary embodiment, a method for a magnetic sensor includes forming a first conductive layer over a substrate containing circuitry, forming a dielectric layer over the first conductive layer, forming a second conductive layer over the dielectric layer such t... | 03/16/2010 |
| 7437038 | Z-axis alignment of an optoelectronic component using a spacer tool A method of forming an optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predeterm... | 10/14/2008 |
| 7353593 | Method for assembling micro structures A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved u... | 04/08/2008 |
| 7353594 | Component mounting method When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition ... | 04/08/2008 |
| 7299545 | Alignment method and mounting method using the alignment method Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a st... | 11/27/2007 |
| 7288437 | Conductive pattern producing method and its applications An improved method of forming an electrode pattern on a substrate is described. The substrate is coated with a first conductive film and subjected to baking. On the first conductive film is then overlied a second conductive film which mends possible fissures of the ... | 10/30/2007 |
| 7281323 | Method for mounting electronic components A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorb... | 10/16/2007 |
| 7278203 | Random-period chip transfer apparatus A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of t... | 10/09/2007 |
| 7269897 | Manufacturing process of a stacked semiconductor device A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the s... | 09/18/2007 |
| 7265980 | Frame of a heat sink for a CPU in a computer A frame of a heat sink for a CPU in a computer includes a quadrilateral frame member and four stop plates. One of two opposite sides of the quadrilateral frame member has an opening block step with a length being equal to the width of the heat sink and the bottom of... | 09/04/2007 |
| 7239519 | Electronic device with uniform heat-dissipation An electronic device with uniform heat-dissipation is disclosed. The electronic device comprises a housing, a circuit board, and a metal shielding. The housing has concavities at inner sides thereof, and the circuit board is disposed within the housing. The metal sh... | 07/03/2007 |
| 7222413 | Board transferring apparatus including identifying devices, and component mounting apparatus including the board transferring apparatus The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object... | 05/29/2007 |
| 7222414 | Component transfer systems A system for transferring electrical components. The system may comprise a plurality of electrical components. Each of the components may include leads and a physically asymmetric fiducial marker that structurally alters a physical appearance of the components. The ... | 05/29/2007 |
| 7220922 | Electronic component, component mounting equipment, and component mounting method Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another s... | 05/22/2007 |
| 7210222 | Power supply control method The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to... | 05/01/2007 |
| 7211901 | Self-coplanarity bumping shape for flip chip A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the... | 05/01/2007 |
| 7212408 | Multi-slot socket for mounting integrated circuits on circuit board An apparatus includes a socket and a dynamic random access memory (DRAM) module installed in the socket. ... | 05/01/2007 |
| 7200925 | Component mounting method Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first com... | 04/10/2007 |
| 7198693 | Microelectronic device having a plurality of stacked dies and methods for manufacturing such microelectronic assemblies Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die... | 04/03/2007 |
| 7188409 | Method for rejecting component during a placement cycle The present invention features a method wherein a component in a multi-head component placement machine is rejected during the placement cycle. A component is imaged and the image processed using an automated vision system. The image processing determines whether th... | 03/13/2007 |
| 7181833 | Method of mounting an electronic part The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up ... | 02/27/2007 |
| 7159305 | Electronic component mounting apparatus An electronic component mounting apparatus is configured to adjust a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for compon... | 01/09/2007 |
| 7149481 | Card-type wireless communication device There is provided a PC card-type wireless LAN card including a metal cover in which lowering of throughput of data transmission is prevented. In a card-type wireless communication device (wireless LAN card) in which a printed board assembly including an antenna, an ... | 12/12/2006 |
| 7137194 | Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management iss... | 11/21/2006 |
| 7120996 | Component mounting apparatus having component supply tables provided on opposite sides of a component transfer path There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arra... | 10/17/2006 |
| 7114248 | Method of handling an electrical component A method of handling an electrical component is disclosed. The method includes initiating a first engagement between the electrical component and a conveyor, initiating a second engagement between a tool and the electrical component without altering the first engage... | 10/03/2006 |
| 7107671 | Method of processing a strip of lead frames A method of processing a strip of lead frames is disclosed. The method includes engaging the strip with a lead frame advancement system, advancing the strip to a tooling member, and performing a tooling operation on the strip. ... | 09/19/2006 |
| 7096572 | Device for fitting substrates with electric components The inventive device comprises a positioning device (4) for a fitting head (14). The positioning device is anchored on a support (3), which is detachably fastened to a supporting body (2) of the inventive device. A control device (17 | 08/29/2006 |
| 7095614 | Electronic module assembly Methods of engaging an electronic module interconnected to a circuit board to a heat sink using clamping assemblies that maintain integrities of an interconnection grid array and the electronic module. A loading block having a plurality of legs is positioned at a ba... | 08/22/2006 |
| 7082680 | Mounting method of electronic components Mounting methods of electronic components in which the electronic components are mounted on plural printed circuit boards are disclosed. An exemplary method includes: supplying a printed circuit board on a first conveyor; transferring the printed circuit board to th... | 08/01/2006 |
| 7069648 | Component mounting method Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first com... | 07/04/2006 |
| 7061774 | Computer board with dual shield housing and heat sink expansion zone apparatuses A compact computer system board 10 comprises dual on PCB expansion zones 11, 12, expansion connectors 113, 123 which can be connected to expansion boards. Once a expansion board is connected to the expansion connector 113 (123) in ... | 06/13/2006 |
| 7047632 | Method of mounting electronic components An electronic component mounting apparatus removes an electronic component supplied to a part feeder in face-up status and mounts it to a board. A flip-chip supplied from a first holding table is removed and flipped over by a take-out head and then delivered to a mo... | 05/23/2006 |
| 7043820 | Electric-component mounting system An electric-component mounting system including a substrate-holding device for holding at least one circuit substrate, at least one first mounting unit and at least one second mounting unit, each of which has at least one mounting head each operable to receive a sel... | 05/16/2006 |
| 7036213 | Device and method for mounting parts A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a... | 05/02/2006 |
| 7032299 | Apparatus for mounting electronic parts An apparatus for mounting electronic parts and a method of mounting electronic parts capable of effectively performing image capturing at the time of position recognition of the electronic parts. In the apparatus, when images of electronic parts are taken for positi... | 04/25/2006 |
| 7020956 | Method and apparatus for feeding components, and method and apparatus for mounting components An occurrence of component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a sp... | 04/04/2006 |
