Quotables
"Transmission of documents via telephone wires is possible in principle, but the apparatus required is so expensive that it will never become a practical proposition."
Dennis Gabor, British physicist
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7891089 | Printed board with component mounting pin A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface moun... | 02/22/2011 |
| 7818878 | Integrated circuit device mounting with folded substrate and interposer In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Othe... | 10/26/2010 |
| 7418772 | Method for manufacturing a surface acoustic wave In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode ... | 09/02/2008 |
| 7401405 | Method of fabricating inkjet nozzles having associated ink priming features A method of fabricating a plurality of inkjet nozzles on a substrate, each nozzle comprising a nozzle chamber having a roof spaced apart from said substrate and sidewalls extending from said roof to said substrate, said chamber having an entrance for receiving ink f... | 07/22/2008 |
| 7392583 | Securing solid-matrix panels for cutting using a tooling fixture Tooling fixtures and methods are described for securing a solid-matrix panel for cutting. In one embodiment, a tooling fixture includes a first clamping system and a second clamping system. The first clamping system receives a solid-matrix panel of PCBs and secures ... | 07/01/2008 |
| 7383630 | Method for making a circuit plate A method for making a circuit plate includes: forming first holes in an insulating layer; forming a conductive layer on the insulating layer such that a portion of the conductive layer fills the first holes; grinding the conductive layer such that the portion of the... | 06/10/2008 |
| 7383628 | Cable duct punch tool and method Disclosed is a punch tool which is used to create apertures at any desired location in a raceway duct. The punch tool has two opposed jaws. A first jaw has an angularly-truncated tubular blade. The other jaw has a tube-shaped blade receiving device which receives th... | 06/10/2008 |
| 7370396 | Method for manufacturing an electronic component An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material layer on an opposite side of the substrate; and a second electrode a... | 05/13/2008 |
| 7353592 | Method of fabricating an RF substrate with selected electrical properties Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is... | 04/08/2008 |
| 7340831 | Method for making liquid discharge head A method for making a liquid discharge head including liquid discharge openings, a liquid channel having pressure chambers communicating with the liquid discharge openings, and piezoelectric elements corresponding to the pressure chambers and arranged in the form of... | 03/11/2008 |
| 7322104 | Method for producing an ink jet head An ink jet head includes a substrate having a flow path construction member constructing a plurality of discharge ports for discharging ink and a plurality of ink flow paths corresponding thereto, and a plurality of energy generating elements corresponding to the pl... | 01/29/2008 |
| 7304371 | Lead frame having a lead with a non-uniform width A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width t... | 12/04/2007 |
| 7299529 | Film bulk acoustic resonator (FBAR) process using single-step resonator layer deposition A process comprising, in a vacuum, depositing a bottom electrode layer and a piezoelectric layer over a cavity in a substrate, the cavity being filled with a sacrificial material, patterning and etching the piezoelectric layer and the bottom electrode layer to expos... | 11/27/2007 |
| 7288722 | Packaging structure and packaging method of electronic components An electronic part mounting structure includes a printed circuit board, a plurality of electronic parts mounted on the printed circuit board, a folded portion of the printed circuit board bent and layered between the electronic parts, through holes formed in both si... | 10/30/2007 |
| 7288739 | Method of forming an opening or cavity in a substrate for receiving an electronic component A method of forming an opening or cavity in a substrate, for receiving an electronic component, consists of or includes providing a patterned opaque masking layer on or adjacent a first major surface of the substrate, the masking layer having an opening overlying th... | 10/30/2007 |
| 7269897 | Manufacturing process of a stacked semiconductor device A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the s... | 09/18/2007 |
| 7260888 | Fabricating method of keypad assembly A keypad assembly including a substrate, a metal layer, a patterned light-shielding layer, a light-transparent material layer and a keypad circuit module is provided. Said substrate has a first surface and a second surface and the metal layer is disposed on the firs... | 08/28/2007 |
| 7259450 | Double-packaged multi-chip semiconductor module A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then r... | 08/21/2007 |
| 7254888 | Method for manufacturing graphite-base heat sinks A method of fabricating a heat sink includes preparing a surface of a graphite-based substrate and removing particulate matter generated from the preparation of the surface of the substrate. A metal-based coating is applied at the surface of the prepared substrate. ... | 08/14/2007 |
| 7254890 | Method of making a microfluid ejection head structure A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel mate... | 08/14/2007 |
| 7251872 | Method for forming a chip package A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads available in a confined space while maintaining the minimum separation necess... | 08/07/2007 |
| 7246431 | Methods of making microelectronic packages including folded substrates A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate. ... | 07/24/2007 |
| 7240427 | Pin contact and method and apparatus for its manufacture A pin contact for pressing into electrical engagement with a plated section in a hole in a circuit board. The contact includes a deformable portion for engaging the plated section with a feed-through portion and a terminal portion at opposite ends thereof. An end pa... | 07/10/2007 |
| 7240433 | Method of fabricating a thermal inkjet head having a symmetrical heater A method for fabricating a thermal inkjet head equipped with a symmetrical heater and the head fabricated by the method are provided. The method incorporates two thick photoresist deposition processes and a nickel electroplating process. The first thick photoresist ... | 07/10/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7237319 | Method of manufacturing a plane coil First, a sheet member which is being unwound and conveyed from a winding body, and in which a conductive film is stuck on a support sheet, is stamped in such a shape that a coil portion, a frame portion defined around the coil portion, and a joining portion connecti... | 07/03/2007 |
| 7228622 | Electronic device carrier and manufacture tape A method and machine-readable medium are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part r... | 06/12/2007 |
| 7223316 | Method for manufacturing electronic component A method for manufacturing an electronic component includes the steps of inserting tabs of a cover into through holes formed in a circuit board having mounting elements on the front surface thereof, disposing a print mask having openings at positions corresponding t... | 05/29/2007 |
| 7217999 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from ... | 05/15/2007 |
| 7207107 | Method and device for through-hole plating of substrates and printed circuit boards A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a c... | 04/24/2007 |
| 7200924 | Method of packaging electronic parts A method of fabricating electronic parts includes the steps of: mounting electronic elements in regular cavities that are two-dimensionally arranged on a baseboard on which dummy cavities are provided so as to surround the regular cavities, and covering a top of the... | 04/10/2007 |
| 7185425 | Method for connecting printed circuit boards By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame is attached to the first printed circuit board. By cutting off a fra... | 03/06/2007 |
| 7183646 | Semiconductor chip carrier affording a high-density external interface A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adja... | 02/27/2007 |
| 7181834 | Method of fabricating an RF substrate with selected electrical properties Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is... | 02/27/2007 |
| 7178230 | Method of manufacturing a metal housing of an electrical connector An electrical connector having a seamless metal housing and a method for manufacturing the same. The electrical connector includes a plastic base and a metal housing. The housing shields a connection portion of the plastic base and is integrally formed with a top su... | 02/20/2007 |
| 7171739 | Method of manufacturing an on-chip transformer balun A method of manufacturing an on-chip transformer balun includes creating, on a semiconductor substrate, a primary winding having at least one substantially symmetrical primary turn on a first dielectric layer and at least one metal bridge on a second layer. A second... | 02/06/2007 |
| 7152289 | Method for forming bulk resonators silicon <110> substrate A method for forming a device on a substrate of silicon includes forming a first conductive layer onto the substrate, and forming a piezoelectric layer on the first portion of a first conductive layer. A second electrode is formed on the piezoelectric layer, a... | 12/26/2006 |
| 7146695 | Method for manufacturing a surface acoustic wave device with a piezoelectric substrate A surface acoustic wave device has superior electrical power resistance that is obtained by improving stress migration resistance of electrodes. In order to form at least one electrode, for example, on a θ rotation Y-cut (θ=36° to 42°) LiTaO3 piezoele... | 12/12/2006 |
| 7143487 | Method of manufacturing the matrix type ultrasonic probe A matrix type ultrasonic probe is disclosed, which has a backing material, and a plurality of piezoelectric elements having upper and lower face electrodes, respectively, and arrayed in two-dimensional directions on the backing material. The ultrasonic probe further... | 12/05/2006 |
| 7143504 | Method of manufacturing a display structure A method of manufacturing a display structure includes the steps of arranging at least a display area, an extension area, and an IC mounting area on a display substrate, connecting a flexible tape substrate to the extension area of the display substrate, separating ... | 12/05/2006 |
