Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Number | Title | Issue Date |
| 8166644 | Method for manufacturing an active socket for facilitating proximity communication One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite t... | 05/01/2012 |
| 8156642 | Component mounting method A component mounting method in which a component can be mounted with high mounting accuracy even onto a board that is long in a transportation direction in a component mounter, includes: calculating a first amount of correction for a component mounting position by r... | 04/17/2012 |
| 8020287 | Changing method for separation facilitation head in chip mounting apparatus In a chip mounting apparatus, a structure is employed that a separation facilitation head keeping part is provided for detachably keeping a plurality kinds of separation facilitation heads in a wafer ring holding part and a chip separation facilitation unit is allow... | 09/20/2011 |
| 8020288 | Method for producing an electronic subassembly In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a... | 09/20/2011 |
| 8006376 | Method for assembly of an LED light The method for assembly of an LED lighting device comprising an LED module and a reflective and/or refractive optical unit and provided particularly as a reading or seat light for use in a vehicle such as, e.g., an airplane, a train or a bus, comprises the following... | 08/30/2011 |
| 7950145 | Component mounting apparatus and method for determining component holding members For determining the types of component holding members equipped to a plurality of holding-member equipping sections, a detection sensor having a detection optical axis in a direction intersecting with the arrayed direction of the respective holding-member equipping ... | 05/31/2011 |
| 7845072 | Method and apparatus for adjusting a multi-substrate probe structure A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjust... | 12/07/2010 |
| 7823276 | Parts mounting method The present invention provides a printed circuit board that can suppress the positional displacement of parts mounted thereon. The printed circuit board includes resist formed on the surface of the printed circuit board, lands for receiving respective parts to be mo... | 11/02/2010 |
| 7721424 | Electronic component mounting method The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suc... | 05/25/2010 |
| 7716823 | Bonding an interconnect to a circuit device and related devices This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate. ... | 05/18/2010 |
| 7665207 | Method of making a multi-chip electronic package having laminate carrier A method of making a multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurali... | 02/23/2010 |
| 7657997 | Reference position determining method In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displac... | 02/09/2010 |
| 7584536 | Process for precise alignment of packaging caps on a substrate The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packagi... | 09/08/2009 |
| 7571539 | Component verification method and apparatus A component verification method for a mounter (100) that is capable of performing component verification with less labor. The method includes a position specification step (S12A) of specifying a placement position in the mounter (100) where a co... | 08/11/2009 |
| 7513036 | Method of controlling contact load in electronic component mounting apparatus A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S | 04/07/2009 |
| 7478473 | Method of manufacturing an IC card The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a se... | 01/20/2009 |
| 7415759 | Method and apparatus for mounting semiconductor chips A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is support... | 08/26/2008 |
| 7401405 | Method of fabricating inkjet nozzles having associated ink priming features A method of fabricating a plurality of inkjet nozzles on a substrate, each nozzle comprising a nozzle chamber having a roof spaced apart from said substrate and sidewalls extending from said roof to said substrate, said chamber having an entrance for receiving ink f... | 07/22/2008 |
| 7368033 | Security tag and system for fabricating a tag including an integrated surface processing system A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered... | 05/06/2008 |
| 7367117 | Electronic component mounting apparatus and electronic component mounting method The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed according to component library data stored in a RAM. According to “normalâ... | 05/06/2008 |
| 7367115 | Component mounting apparatus A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from ends of the supporting base and face each other in a Y direction. Th... | 05/06/2008 |
| 7369334 | Optical device with alignment compensation An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to... | 05/06/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7362562 | Electronic unit of radio system and method of producing the same The invention relates to a method of producing an electronic unit of a radio system automatically, an electronic unit of a radio system and an electronic component. The method of producing an electronic unit of a radio system automatically comprises mounting (802... | 04/22/2008 |
| 7361843 | AC coupling of power plane sections using improved capacitance stitching material An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil layer of the printed circuit board to components on the printed circui... | 04/22/2008 |
| 7359590 | Semiconductor device integrated with optoelectronic components A semiconductor device integrated with optoelectronic components includes a carrier board with at least two openings; a first and a second optoelectronic component disposed in the openings respectively, each of them having an active surface and an opposite non-activ... | 04/15/2008 |
| 7356919 | Component mounting method A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary membe... | 04/15/2008 |
| 7353589 | Component mounting apparatus A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a hea... | 04/08/2008 |
| 7353593 | Method for assembling micro structures A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved u... | 04/08/2008 |
| 7353594 | Component mounting method When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition ... | 04/08/2008 |
| 7353599 | Fiducial markings for quality verification of high density circuit board connectors Methods for qualifying the accuracy of a circuit board may include providing a printing mask pattern for first and second sides of the circuit board with a first sequence of spaced indicia parallel to a first edge of the printed circuit board, and a second sequence ... | 04/08/2008 |
| 7337534 | SMD chip handling apparatus The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander form... | 03/04/2008 |
| 7335571 | Method of making a semiconductor device having an opening in a solder mask A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semic... | 02/26/2008 |
| 7331105 | Method for placing components by means of at least one component placement unit Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup position and a component placement position located on a substrate. In a... | 02/19/2008 |
| 7330773 | Multiple insertion head The invention relates to a multiple insertion head for mounting components onto substrates, the insertion head including a carrier which is arranged in such a way that it can rotate about a rotational axis and is provided with many receiving tools that are arranged ... | 02/12/2008 |
| 7325459 | Identifying unit for working machine and pressure apparatus A working machines includes an identifying unit. A force sensor detachably supports a working head in the identifying unit. A controller circuit is designed to identify the working head based on the load detected at the force sensor. When the working head is replace... | 02/05/2008 |
| 7319304 | Shunt connection to a PCB of an energy management system employed in an automotive vehicle A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the... | 01/15/2008 |
| 7316061 | Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed thereon. Then, a porous layer is formed on the metal layer. A barrier la... | 01/08/2008 |
| 7315454 | Semiconductor memory module A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one external area of the printed circuit board. The semiconductor memory chip... | 01/01/2008 |
| 7313859 | Method for optimizing placement order by placement apparatuses that place electronic components on circuit board An optimization apparatus capable of efficiently placing an electronic component. An optimization unit (203) determines a first assignment to the placement apparatus and calculates a first placement time required for placing all the electronic components assi... | 01/01/2008 |
