Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 8186047 | Method of mounting electronic component The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suc... | 05/29/2012 |
| 8074351 | Part mounting device and part mounting method A panel is mounted on the stage while the one end electrode of the FPC (flexible board) is mounted on the mounting part of one surface of the panel and the other surface of the panel is facing upward. A mounting method includes bending the other end side of the flex... | 12/13/2011 |
| 7918017 | Electronic component taking out apparatus A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic compon... | 04/05/2011 |
| 7793412 | Component-embedded board fabrication method A component-embedded board fabrication method includes detecting, before the board is covered with a first insulating layer, the actual position of a first electronic component formed on a surface of the board, calculating a displacement between the design position ... | 09/14/2010 |
| 7752748 | Method for detecting condition of nozzle member A method for detecting a condition of a nozzle member of a multi-nozzle type component mounting head, in which it is determined that a nozzle is pressed against a load cell when the difference between a measured vertical position of the nozzle and a reference positi... | 07/13/2010 |
| 7748112 | Component mounting apparatus and component mounting method A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height p... | 07/06/2010 |
| 7707713 | Component-embedded circuit board fabrication method A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of the board, calculating a displacement between the design position of... | 05/04/2010 |
| 7617597 | Component placing method A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable... | 11/17/2009 |
| 7614144 | Component mounting apparatus The present invention is intended to realize a hold posture inspection of a plurality of components sucked by a plurality of nozzle rows provided on a head with a single scanning operation, thereby reducing the time for the hold posture inspection and improving the ... | 11/10/2009 |
| 7594319 | Electronic-component alignment method A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving table, and also a second electronic component having two alignment mark... | 09/29/2009 |
| 7581313 | Component mounting method and mounter The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (105); a recognition unit (108) including a shutter camera... | 09/01/2009 |
| 7458147 | Method for determining whether a component holder is defective The present invention provides a device and a method for determining whether or not a component holder is good, which enable detecting component holders that are to affect correct component recognition and further enable preventing interferences between constituent ... | 12/02/2008 |
| 7441329 | Fabrication process circuit board with embedded passive component A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the condu... | 10/28/2008 |
| 7437038 | Z-axis alignment of an optoelectronic component using a spacer tool A method of forming an optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. The package includes a mounting surface, and an optical component positioned on the mounting surface at a predeterm... | 10/14/2008 |
| 7433038 | Alignment of substrates for bonding An alignment apparatus for a substrate bonding system is provided with a first optical arm arranged to direct onto a detector radiation from a first alignment mark on a first substrate, and a second optical arm arranged to direct onto the detector radiation from a s... | 10/07/2008 |
| 7409761 | Electronic component mounting apparatus and method of mounting electronic components In an electronic component mounting process for mounting electronic components (6) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual ... | 08/12/2008 |
| 7383621 | Method of producing a piezoelectric ceramic A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such as a composite perovskite compound, having a higher dielectric constan... | 06/10/2008 |
| 7368324 | Method of manufacturing self-supporting contacting structures A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently ... | 05/06/2008 |
| 7367117 | Electronic component mounting apparatus and electronic component mounting method The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed according to component library data stored in a RAM. According to “normalâ... | 05/06/2008 |
| 7363702 | Working system for circuit substrate A working system for a circuit substrate enabling a control of stopping the substrate without inconvenience. A PWB detector 308 held by a Y-axis slide 252 of an XY robot 266 moving a component mounting head, has reflection type photoelectric sen... | 04/29/2008 |
| 7365006 | Semiconductor package and substrate having multi-level vias fabrication method A semiconductor package and substrate having multi-level plated vias provide a high density blind via solution at low incremental cost. Via are half-plated atop a circuit pattern and then a second via half is added to complete the via after isolation of elements of ... | 04/29/2008 |
| 7356918 | Component mounting method An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis dire... | 04/15/2008 |
| 7356919 | Component mounting method A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary membe... | 04/15/2008 |
| 7356176 | Mounting-error inspecting method and substrate inspecting apparatus using the method When a component is replaced or replenished in a predetermined feeder, mounters 3A and 3B refer to mount data in accordance with the feeder number for the feeder and read out the mounting position of the replaced or replenished component. The mounting ... | 04/08/2008 |
| 7353594 | Component mounting method When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition ... | 04/08/2008 |
| 7352001 | Method of editing a semiconductor die Resistance and capacitance are added to a prototype die to fix or identify performance issues with the integrated circuit formed in the die by forming a thin piece of silicon on the top surface of the die. For resistance, vias are formed to regions on the metal trac... | 04/01/2008 |
| 7337533 | Device for mounting component An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved. There is provided a control means for controll... | 03/04/2008 |
| 7337939 | Bonding apparatus A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus i... | 03/04/2008 |
| 7325459 | Identifying unit for working machine and pressure apparatus A working machines includes an identifying unit. A force sensor detachably supports a working head in the identifying unit. A controller circuit is designed to identify the working head based on the load detected at the force sensor. When the working head is replace... | 02/05/2008 |
| 7324685 | Inspection systems and methods In one embodiment, a system comprises logic configured to identify a tip of a pin that has been press fit into a circuit board, logic configured to measure characteristics that pertain to a flat end surface and a chamfered surface of the identified pin tip, logic co... | 01/29/2008 |
| 7315766 | Component mounting apparatus and component mounting method In component mounting for executing a component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operational program for executing the component holding and pickup operation is received in ... | 01/01/2008 |
| 7313862 | Method of mounting components on a PCB A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land not covered with the resist. The board recognition mark is defined by... | 01/01/2008 |
| 7314777 | Chip packaging systems and methods An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more ... | 01/01/2008 |
| 7299539 | Apparatus for mounting components on substrate An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this ju... | 11/27/2007 |
| 7299546 | Method for manufacturing an electronic module An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also ... | 11/27/2007 |
| 7299545 | Alignment method and mounting method using the alignment method Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a st... | 11/27/2007 |
| 7296343 | Electronic component mounting apparatus An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detec... | 11/20/2007 |
| 7290327 | Component mounting apparatus employing temperature maintenance of positioning accuracy A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operati... | 11/06/2007 |
| 7290331 | Component mounting apparatus and component mounting method In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting s... | 11/06/2007 |
| 7287315 | Apparatus for measuring slider mounting position in magnetic head, and magnetic head manufacturing system using the measurement apparatus The present invention provides a measurement apparatus for obtaining a suitable position on a suspension where a more miniature magnetic head slider is to be mounted to the suspension, the apparatus including a front camera having a photographing optical axis within... | 10/30/2007 |
