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| Number | Title | Issue Date |
| 8186045 | Multilayer printed circuit board and multilayer printed circuit board manufacturing method A method of manufacturing a multilayer printed circuit board, including providing a substrate, embedding an electronic component having a die pad on a surface of the component into the substrate such that the component has the surface and pad exposed from a surface ... | 05/29/2012 |
| 8186046 | Method for manufacturing a multilayer printed wiring board for providing an electronic component therein A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction ... | 05/29/2012 |
| 8181337 | Electronic component mounting method A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so ... | 05/22/2012 |
| 8171624 | Method and system for preparing wireless communication chips for later processing A method of preparing wireless communication chips for later processing includes receiving a carrier tape that is carrying a wireless communication chip positioned inside a container on the carrier tape and beneath a protective adhesive. The protective adhesive is s... | 05/08/2012 |
| 8156640 | Substantially continuous layer of embedded transient protection for printed circuit boards The protection of sensitive components on printed circuit boards by using planar transient protection material in one or more layers of a printed circuit board stackup is disclosed. ... | 04/17/2012 |
| 8156641 | Interconnection method for tightly packed arrays with flex circuit Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials. ... | 04/17/2012 |
| 8146244 | Method of manufacturing a handheld computing device A method of manufacturing a handheld computing device that includes an electronic component assembly including at least one user interface component and an enclosure. The enclosure is a tube that is extruded. The extruded tube defines an internal lumen between open ... | 04/03/2012 |
| 8146243 | Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board A method of manufacturing a device-incorporated substrate as well as a printed circuit board. A transfer sheet is formed having a structure that includes two layers, a metal base material and a dissolvee metal layer and a conductor pattern is formed on the dissolvee... | 04/03/2012 |
| 8136238 | Methods for manufacturing semiconductor devices A method is provided to control the height of bump electrodes and increase a clearance between edge sections of a semiconductor chip and lead terminals of a tape substrate. By pushing up on a tape substrate by a bonding stage, and applying suction to the tape substr... | 03/20/2012 |
| 8132318 | Metal substrate having electronic devices formed thereon A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate 10 | 03/13/2012 |
| 8132319 | Circuit connecting method The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection. The circuit connecting method comprises a step... | 03/13/2012 |
| 8127439 | Method of manufacturing electronic component device A recessed portion is formed in a predetermined position in a heat-spreading component. A thermoplastic resin serving as a thermal interface material (TIM) is stored in the recessed portion. Meanwhile, a large number of filamentous thermo-conductive elements serving... | 03/06/2012 |
| 8122597 | Method for fabricating light emitting diode signboard The present disclosure relates to a method and apparatus for fabricating an LED signboard, through which an LED signboard is fabricated by printing a circuit pattern with a conductive ink. The method includes generating a design, forming a circuit pattern by printin... | 02/28/2012 |
| 8122594 | Method of manufacturing a deflectable electrophysiological catheter A method of manufacturing a deflectable electrophysiological catheter includes constructing a shaft having a distal end and at least one lumen. The method further includes inserting a component into the lumen, and processing at least a portion of the distal end to r... | 02/28/2012 |
| 8122596 | System of fabricating a flexible electrode array An image is captured or otherwise converted into a signal in an artificial vision system. The signal is transmitted to the retina utilizing an implant. The implant consists of a polymer substrate made of a compliant material such as poly(dimethylsiloxane) or PDMS. T... | 02/28/2012 |
| 8122595 | Electronic parts mounting device A paste supply unit that is located in a side opposed to an electronic parts supply table 6 with a mounting table 8 sandwiched between them to supply a paste to a board 24 includes a transfer head 5 that transfers the paste to the board | 02/28/2012 |
| 8117741 | Method for manufacturing a radiation imaging panel comprising imaging tiles An automatic or semiautomatic method of assembly of radiation digital imaging tiles to form a one or two dimensional imaging panel whereby the imaging tiles are provided with alignment mark(s), inherent or specific, and a mother board or substrate is also provide wi... | 02/21/2012 |
| 8112882 | Method for producing a structure A method for producing a structure includes bonding two substrates facing one another by crushing a closed peripheral sealing strip located between the two substrates, the closed peripheral sealing strip delineating a closed cavity between the substrates. A microsys... | 02/14/2012 |
| 8108993 | Method of manufacturing wiring substrate, and method of manufacturing semiconductor device A method of manufacturing a wiring substrate is disclosed. The method includes: (a) preparing a supporting substrate including a main body and a through electrode penetrating the main body, wherein the supporting substrate includes a first surface and a second surfa... | 02/07/2012 |
| 8096047 | Electronic component mounting apparatus An electronic component mounting apparatus 1 includes a substrate conveyance mechanism 14 for conveying substrates 13 and 13a; a first drawing head 4 for supplying the substrate 13 with paste at a mounting position; a... | 01/17/2012 |
| 8079140 | Component mounting condition determining method In a component mounter of so-called alternate mounting, a component mounting condition determining method of determining a component mounting condition that equalizes operating times of a plurality of mounting heads is used. The component mounting condition determin... | 12/20/2011 |
| 8074350 | Method of printing electronic circuits A method of printing electronic circuits uses pattern recognition to detect locations of interconnects on electronic components oriented on a substrate such that the interconnects face away from the substrate, the interconnects having ramps between the interconnects... | 12/13/2011 |
| 8069558 | Method for manufacturing substrate having built-in components A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on o... | 12/06/2011 |
| 8061021 | Method of replacing electrical components of a monitoring system The method of replacing the electrical components of a monitoring system. The method includes attaching a housing that contains a battery, sensor and other electronic components to a container. Next, a first lid that contains electronic components that are electrica... | 11/22/2011 |
| 8056222 | Laser-based technique for the transfer and embedding of electronic components and devices A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-m... | 11/15/2011 |
| 8042266 | Mounting apparatus and method to control mounting apparatus A mounting apparatus to mount electronic components on a board includes at least one component feeder in which electronic components of different types are disposed in series, and a mounting information supplier which supplies mounting information. The component fee... | 10/25/2011 |
| 8033012 | Method for fabricating a semiconductor test probe card space transformer A space transformer for a semiconductor test probe card and method of fabrication. The method may include depositing a first metal layer as a ground plane on a space transformer substrate having a plurality of first contact test pads defining a first pitch spacing, ... | 10/11/2011 |
| 8020285 | Method of adjusting at least one optional setting of a process characteristic of a component placement device, as well as a component placement device and an electronic key A method and a component placement device are provided for adjusting at least one optional setting of a process characteristic of the component placement device, which component placement device has at least one standard setting. The optional setting may be activate... | 09/20/2011 |
| 8020286 | Electronic component mounting system and electronic component mounting method One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deli... | 09/20/2011 |
| 8015702 | Metal substrate having electronic devices formed thereon A method of forming an electronic device on a metal substrate deposits a first seed layer of a first metal on at least one master surface with a roughness less than 400 nm. A supporting metal layer is bonded to the first seed layer to form the metal substrate 10 | 09/13/2011 |
| 8011087 | Method for assembling lens module with image sensor A method for assembling a lens module with an image sensor, includes providing a holder having first and second receiving spaces, disposing the image sensor in the second receiving space, locating lens barrel at a first position in the first receiving space, casting... | 09/06/2011 |
| 8011086 | Method of manufacturing a component-embedded printed circuit board A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the... | 09/06/2011 |
| 7996987 | Single footprint family of integrated power modules A system and method for producing a family of power modules having a common footprint that enables the customer to flexibly choose a power module size without incurring the costs of a relayout of a system design. In one embodiment, a board layout can be designed usi... | 08/16/2011 |
| 7992293 | Method of manufacturing a patterned conductive layer According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes applying a coating layer of electrically conductive transparent compounds onto a substrate; depositing in a... | 08/09/2011 |
| 7979982 | Imaging device, and method for manufacturing the same A vehicle-mounted camera (1) comprises a lower case (2) constituting a part of a case, an upper case (3) provided with lenses (3a, 3b) constituting the case integrally with the lower case (2), an imaging elemen... | 07/19/2011 |
| 7971348 | Method for manufacturing component-embedded substrate A component-embedded substrate includes a component embedded in an uncured resin layer of a second layer. After curing the resin layer, a hole passing through the second layer in the vertical direction is formed. The hole is filled with an electroconductive paste to... | 07/05/2011 |
| 7971349 | Bump bonding method In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness greater than a hardness of each of the first and second bumps. The f... | 07/05/2011 |
| 7971347 | Method of interconnecting workpieces Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed. ... | 07/05/2011 |
| 7966720 | Method of manufacturing an element substrate A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; applying a sol-gel solution including a material for an inorganic substrate to ... | 06/28/2011 |
| 7958626 | Embedded passive component network substrate fabrication method A method of forming an embedded passive component network substrate includes providing a first carrier with a first dielectric layer and patterning the first dielectric layer to form a first patterned dielectric layer including circuit pattern artifacts. A first etc... | 06/14/2011 |
