Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 8186044 | Method of manufacturing small volume in vitro analyte sensors A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffus... | 05/29/2012 |
| 8171622 | Flexible printed circuit and method for manufacturing the same Disclosed is a flexible printed circuit, comprising a substrate, and a silver foil and a reinforcement plate attached on said substrate in order, wherein there is an ink layer between said silver foil and said reinforcement plate. According to the invention, by prin... | 05/08/2012 |
| 8171623 | Method of manufacturing a printed circuit board A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include... | 05/08/2012 |
| 8112881 | Method for manufacturing multilayer wiring board A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the coppe... | 02/14/2012 |
| 8108992 | Method of making a microwave field director structure having V-shaped vane doublets A method of making a self-supporting field director structure for use in heating an article in a microwave oven comprises in any operative order, the steps of folding a first and a second elongated vane blank along a central fold line to form at least two V-shaped v... | 02/07/2012 |
| 8091220 | Methods of making small volume in vitro analyte sensors A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffus... | 01/10/2012 |
| 8087162 | Methods of making small volume in vitro analyte sensors A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffus... | 01/03/2012 |
| 8074349 | Magnetic hold-down for foil substrate processing A method for forming an electronic circuit disposes a plurality of magnets onto a flux plate to form a magnetic platen. A substrate package is formed using the magnetic platen and, stacked against the magnetic platen, a non-magnetic carrier and a substrate layer, wi... | 12/13/2011 |
| 8065792 | Method for packaging circuits A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contac... | 11/29/2011 |
| 8015701 | Method of manufacturing a flexible printed circuit assembly A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive laye... | 09/13/2011 |
| 7992292 | Method for manufacturing a touch panel A method for manufacturing a touch panel for acquiring a plurality of touch panels in one machining process comprises the steps of: sticking a rectangular transparent film to a back liner as to be formed with an upper material piece; each upper electrode unit of the... | 08/09/2011 |
| 7992291 | Method of manufacturing a circuit board A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming reg... | 08/09/2011 |
| 7937828 | Method of manufacturing wiring board A method of manufacturing a wiring board including an insulating layer where a semiconductor chip is embedded includes: forming, on a supporting board, the insulating layer where the semiconductor chip is embedded and a wiring connected to the semiconductor chip; re... | 05/10/2011 |
| 7900347 | Method of making a compliant interconnect assembly An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical... | 03/08/2011 |
| 7886429 | Method for producing a measuring transducer A method is provided for producing a measuring transducer in order to transform at least one physical variable into at least one electric variable. A plurality of planar, insulating and conductive layers are respectively structured according to predefineable models ... | 02/15/2011 |
| 7874066 | Method of manufacturing a device-incorporated substrate A device-incorporated substrate and a method of manufacturing a device-incorporated substrate, as well as a printed circuit board and a method of manufacturing a printed circuit board in which a fine-pitch conductor pattern can be formed on an insulating layer with ... | 01/25/2011 |
| 7866035 | Water-cooled photovoltaic receiver and assembly method Embodiments in accordance with the present invention relate to the design and manufacturing of inexpensive photovoltaic or thermal receivers for cost-effective solar energy conversion of concentrated light. Particular embodiments in accordance with the present inven... | 01/11/2011 |
| 7841075 | Methods for integration of thin-film capacitors into the build-up layers of a PWB Provided herein are devices comprising a printed wiring board that comprise, singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. Provided are methods of incorporating the singulated capacitors into the build-up layers of a printed ... | 11/30/2010 |
| 7832093 | Method of creating an electro-mechanical energy conversion device There are provided methods for creating energy conversion devices based on the giant flexoelectric effect in non-calamitic liquid crystals. By preparing a substance comprising at least one type of non-calamitic liquid crystal molecules and stabilizing the substance ... | 11/16/2010 |
| 7827680 | Electroplating process of electroplating an elecrically conductive sustrate An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a const... | 11/09/2010 |
| 7765686 | Multilayer wiring structure and method of manufacturing the same A method of manufacturing a multilayer wiring structure is disclosed. The method comprises a step of forming a via post on a first metal wiring element, a step of printing an interlayer insulation film on the first metal wiring element, with use of a screen mask hav... | 08/03/2010 |
| 7730610 | Method of mounting electronic circuit constituting member and relevant mounting apparatus A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least o... | 06/08/2010 |
| 7721423 | Method of manufacturing alloy circuit board A method of manufacturing an alloy circuit board including an alloy circuit made of an alloy of first metal particles and second metal particles includes forming a first circuit layer, by printing ink containing first metal particles on a board; stacking a second ci... | 05/25/2010 |
| 7681306 | Method of forming an assembly to house one or more micro components Formation of a structure with through-holes includes attaching two sub-structures to one another. The resulting structure may be used in a sub-assembly for various types of micro components and may serve as a lid or base of a housing that encapsulates one or more mi... | 03/23/2010 |
| 7637006 | Beam assembly method for large area array multi-beam DUT probe cards A method for fabricating beams for a probe card includes dividing a large beam panel into smaller sub-panels before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of beams to test several devices under test. Th... | 12/29/2009 |
| 7631421 | Method for fixing printed circuit board on a display panel A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film cover... | 12/15/2009 |
| 7581311 | Method for manufacturing a dielectric element A method for manufacturing a dielectric element including the steps of: preparing a lower electrode; forming a dielectric on the lower electrode to fabricate a first laminated structure; annealing the first laminated structure; forming an upper electrode on a dielec... | 09/01/2009 |
| 7581312 | Method for manufacturing multilayer flexible printed circuit board A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating... | 09/01/2009 |
| 7487585 | Method of manufacturing a metal-ceramic circuit board A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member for an electronic circuit. A method of manufacturing a metal-cerami... | 02/10/2009 |
| 7441329 | Fabrication process circuit board with embedded passive component A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the condu... | 10/28/2008 |
| 7435352 | Method of forming solder resist pattern A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printe... | 10/14/2008 |
| 7421775 | Method of manufacturing antenna for RFID tag A method of easily and inexpensively manufacturing an antenna for an RFID tag by forming the antenna using magnets of a pattern corresponding to a shape of the antenna is provided. One example method includes a) placing a substrate above a level of a fluid containin... | 09/09/2008 |
| 7421777 | Method of manufacturing multilayer wiring substrate using temporary metal support layer The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further redu... | 09/09/2008 |
| 7421779 | Multilayer board manufacturing method A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive f... | 09/09/2008 |
| 7418776 | Method of manufacturing an antenna The present invention relates to a method for producing an antenna comprising a conductive wire, formed by a wire, made of a conductive material, whose path has a helical shape. In accordance with the invention, such a method is characterized in that a print is form... | 09/02/2008 |
| 7406761 | Method of manufacturing vibrating micromechanical structures A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and a... | 08/05/2008 |
| 7406756 | Method for manufacturing a piezoelectric resonator A method for manufacturing a piezoelectric resonator is provided including: forming a resonator element having a plate-like base and a plurality of arms extending laterally from the base on a substrate made of crystal; emitting laser light for irradiating one surfac... | 08/05/2008 |
| 7404250 | Method for fabricating a printed circuit board having a coaxial via A method of fabricating a printed circuit board having a coaxial via, includes. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through ... | 07/29/2008 |
| 7401402 | Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as contact points for insulation displacement contacts. Each contact poin... | 07/22/2008 |
| 7397666 | Wedge lock Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis. ... | 07/08/2008 |
