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| Number | Title | Issue Date |
| 8186043 | Method of manufacturing a circuit board A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one b... | 05/29/2012 |
| 8186042 | Manufacturing method of a printed board assembly The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of c... | 05/29/2012 |
| 8166642 | Stripline flex circuit The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius ... | 05/01/2012 |
| 8166643 | Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device A method of manufacturing a circuit apparatus includes forming a plurality of pierced holes in a metal substrate. A first wiring layer is formed on one side of the metal substrate via a first insulating layer, and a second wiring layer is formed on the other side of... | 05/01/2012 |
| 8136237 | Method of interconnecting electronic wafers The invention relates to a method of interconnecting electronic components of a first wafer (T1) with electronic components of a second wafer (T2), each wafer having metallized vias (1) which pass through the wafer in the thickness direction. Th... | 03/20/2012 |
| 8127438 | Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus A method of manufacturing a wiring substrate includes the steps of bonding a first substrate, which includes a pixel area and a drive area located around the pixel area, and is provided with a protruding section formed in the pixel area, to a second substrate on whi... | 03/06/2012 |
| 8112880 | Method for manufacturing multilayer printed circuit boards A method for manufacturing a printed circuit board (PCB) includes: providing a first PCB substrate, a second PCB substrate and an adhesive layer, the first PCB substrate having a first main portion and a first unwanted portion divided by a first imaginary boundary, ... | 02/14/2012 |
| 8108991 | Method and device for connecting a wiring board Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply p... | 02/07/2012 |
| 8099865 | Method for manufacturing a circuit board having an embedded component therein A method for manufacturing a circuit board includes the following steps. First, a core layer is provided, wherein the core layer includes a first dielectric layer, and first and second metallic layers. A through hole is formed in the core layer. The core layer is di... | 01/24/2012 |
| 8091219 | Method for establishing a high speed mezzanine connection A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the s... | 01/10/2012 |
| 8069557 | Method of manufacturing circuit forming board In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first she... | 12/06/2011 |
| 8056221 | Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes. ... | 11/15/2011 |
| 8046910 | Method for manufacturing a surface mounted crystal device A method of manufacturing a surface mounted (crystal) device comprising: the steps of providing an aggregated sheet material having a plurality of container main bodies lengthwise and crosswise, accommodating at least a crystal piece inside the concavities of the pl... | 11/01/2011 |
| 8042265 | Method for manufacturing multilayer flexible printed circuit board A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the firs... | 10/25/2011 |
| 8033011 | Method for mounting a thinned semiconductor wafer on a carrier substrate A method for mounting a thinned semiconductor wafer on a carrier substrate for further processing is disclosed. The method consists of a series of steps, which is based on providing a frame with a double-side tape to mount the thinned wafer on the carrier substrate.... | 10/11/2011 |
| 8028403 | Method for forming laminated multiple substrates The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The sol... | 10/04/2011 |
| 8028402 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating... | 10/04/2011 |
| 8015700 | Method of fabricating wiring board and method of fabricating semiconductor device A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board... | 09/13/2011 |
| 8001681 | Assembly identification by mounting configuration The present disclosure provides a method for identification of an electronic assembly, when used multiple times in a larger system, to change its location status in a system based on its mounting configuration. The mounting configuration dictates the identification ... | 08/23/2011 |
| 7992290 | Method of making a flexible printed circuit board An exemplary method of making an FPC includes forming a substrate comprising metal foil layers interleaved with intervening layers by: (a) laminating intervening layers with metal foil layers; (b) adhering a covering film to outermost surfaces of the substrate; (c) ... | 08/09/2011 |
| 7987586 | Method for manufacturing printed circuit board having different thicknesses in different areas A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a se... | 08/02/2011 |
| 7975377 | Wafer scale heat slug system A wafer scale heat slug system is presented providing dicing an integrated circuit from a semiconductor wafer, forming a heat slug blank equivalent in size to the semiconductor wafer, dicing the heat slug blank to produce a heat slug equivalent in size to the integr... | 07/12/2011 |
| 7975378 | Method of manufacturing high speed printed circuit board interconnects Described are methods for fabricating high speed metallic electrical interconnects for printed wiring board for high speed transmission of a data signal across an interconnect in a systems. The trench under electrical signal line is made using the separate dielectri... | 07/12/2011 |
| 7963029 | Holding/convey jig and holding/convey method A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive patter... | 06/21/2011 |
| 7937827 | Multilayer substrate manufacturing method A method for producing a multilayer substrate includes stacking a first substrate, the first substrate having a circuit pattern; stacking a connector, the connector coupling onto said first substrate, the connector having a ring structure, the ring structure having ... | 05/10/2011 |
| 7930820 | Method for structural enhancement of compression system board connections A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached ... | 04/26/2011 |
| 7926172 | Embedded circuit board and process thereof An embedded circuit board including a glass fiber layer, two dielectric layers, and two circuit layers is provided. The glass fiber layer has a first surface and a second surface corresponding to the first surface. The dielectric layers are disposed on the first sur... | 04/19/2011 |
| 7908743 | Method for forming an electrical connection Embodiments of the present invention provide a method of forming an electrical connection on a device. In one embodiment, the electrical connection is attached to the device via an adhesive having electrically conductive particles disposed therein. In one embodiment... | 03/22/2011 |
| 7908744 | Method for fabricating printed circuit board having capacitance components A method of fabricating a printed circuit board having capacitance components, including: providing a core board having first and second surfaces with first and second wiring layers provided thereon, respectively, and electrically connected, a second dielectric laye... | 03/22/2011 |
| 7874065 | Process for making a multilayer circuit board A process for making a multi-layered circuit board having electrical current traces includes providing a substrate having a 1st layer of conductive material to form a ground plane, plurality of metallic 1st traces on a 2nd side of th... | 01/25/2011 |
| 7870663 | Method for manufacturing multilayer wiring board Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the i... | 01/18/2011 |
| 7856706 | Methods of manufacturing printed circuit boards with stacked micro vias A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first ... | 12/28/2010 |
| 7845070 | Manufacturing method of ink jet head A manufacturing method of an ink jet head has: a step of forming a flow path hole on each of first plates to be flow path plates; a step of laminating one or plurality of said flow path plates on which said flow path hole is formed and a second plate to be a nozzle ... | 12/07/2010 |
| 7832092 | Method of manufacturing a printed wiring board lead frame package A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer... | 11/16/2010 |
| 7827679 | Thermal management circuit board and methods of producing the same A thermal management circuit board comprises a heat sink, at least one insulating layer and at least one electronic circuit. The heat sink comprises a heat conducting material having tooling holes disposed therethrough and raised portions disposed on at least one su... | 11/09/2010 |
| 7823274 | Method of making multilayered circuitized substrate assembly A method of making a multilayered circuitized substrate assembly which includes bonding at least two circuitized substrates each including at least one layer of high temperature dielectric material, one of these layers in turn including at least one thru-hole therei... | 11/02/2010 |
| 7818877 | Formation method of metal layer on resin layer A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 Ī¼m or less is provided. According to the prese... | 10/26/2010 |
| 7810232 | Method of manufacturing a circuit board A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer ... | 10/12/2010 |
| 7805834 | Method for fabricating three-dimensional all organic interconnect structures The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single si... | 10/05/2010 |
| 7802359 | Electronic assembly manufacturing method A method is described for manufacturing electronic assemblies (52). Electronic die (36) held in a plastic matrix (43) form a partially completed panel (35) of electronic assemblies (52). The panel (35) is adhesively mounted ... | 09/28/2010 |
