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| Number | Title | Issue Date |
| 8108990 | Method for manufacturing printed circuit board A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between th... | 02/07/2012 |
| 8091218 | Method of manufacturing a rigid printed wiring board Provided is a bending rigid printed wiring board which facilitate the mounting of electric parts (realization of a high producibility and high assemblability substrate circuit) and enables spaces to be saved and which can be easily manufactured. That is, prov... | 01/10/2012 |
| 8056220 | Printed circuit board and manufacturing method thereof A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both elect... | 11/15/2011 |
| 7921550 | Process of fabricating circuit structure A process for forming a circuit structure includes providing a first composite-layer structure at first. A second composite-layer structure is then provided. The first composite-layer structure, a second dielectric layer and the second composite-layer structure are ... | 04/12/2011 |
| 7877866 | Flexible circuit electrode array and method of manufacturing the same A method of manufacturing a flexible circuit electrode array that provides excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes. A layer of polymer is laid down. A layer of metal is applied to ... | 02/01/2011 |
| 7856705 | System and method for assembling and interconnecting functional components of an active implantable medical device A process for mechanical assembly and electrical interconnection of the functional components of an active implantable medical device. A first step involves preparing an interconnection flex circuit (20) that is able to be electrically and mechanically linked... | 12/28/2010 |
| 7832091 | Method for manufacturing conductive contact holder A method for manufacturing a conductive contact holder includes forming, from a conductive material, a substrate having a hollow portion to which a holder member for holding a plurality of conductive contacts can be fitted; fixing the substrate formed from the condu... | 11/16/2010 |
| 7802358 | Rigid-flexible printed circuit board manufacturing method for package on package A manufacturing method for rigid-flexible multi-layer printed circuit board including: a flexible substrate of which circuits are formed on both sides and which is bendable; a rigid substrate which is laminated on the flexible substrate and circuits are formed on bo... | 09/28/2010 |
| 7757389 | Method of manufacturing an ultrasonic probe For providing a flexible printed circuit board in which the distance between each of plural wiring patterns is a desired distance by cutting the flexible printed circuit board having plural wiring patterns, plural wiring patterns are formed so as to extend on the su... | 07/20/2010 |
| 7698811 | Method for manufacturing multilayer printed circuit boards using inner substrate An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. ... | 04/20/2010 |
| 7665206 | Printed circuit board and manufacturing method thereof A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such... | 02/23/2010 |
| 7421779 | Multilayer board manufacturing method A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive f... | 09/09/2008 |
| 7408785 | Structure for mounting electronic component on wiring board A structure for mounting an electronic component on a wiring board according to the invention includes a wiring board that is provided with wiring patterns, each having a land portion, and an electronic component that has a plurality of electrodes which are soldered... | 08/05/2008 |
| 7402254 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through... | 07/22/2008 |
| 7401405 | Method of fabricating inkjet nozzles having associated ink priming features A method of fabricating a plurality of inkjet nozzles on a substrate, each nozzle comprising a nozzle chamber having a roof spaced apart from said substrate and sidewalls extending from said roof to said substrate, said chamber having an entrance for receiving ink f... | 07/22/2008 |
| 7367826 | Compound connector for two different types of electronic packages Disclosed is a smart card connector for transmitting signals between a smart card and an external electronic system, wherein the smart card has contacts on one of two major surfaces thereof, the connector comprising: guiding structure defining a storage space having... | 05/06/2008 |
| 7356913 | Process for manufacturing a microsystem A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect thermal sensor. The sensor includes a deformable element attached, at... | 04/15/2008 |
| 7356921 | Method for forming a conductive layer pattern A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets o... | 04/15/2008 |
| 7353591 | Method of manufacturing coreless substrate A method for manufacturing coreless substrates is provided herein. The method first provides a base whose top and bottom sides are covered with metal layers respectively that are detachable from the base. From the two metal layers, the method then develops the bump-... | 04/08/2008 |
| 7350296 | Method of fabricating a printed circuit board including an embedded passive component Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating l... | 04/01/2008 |
| 7350297 | Method of manufacturing a wiring substrate A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece h... | 04/01/2008 |
| 7342490 | Radio frequency identification static discharge protection Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously ac... | 03/11/2008 |
| 7340830 | Method of manufacturing LED light string A method of manufacturing LED light string includes the steps of forming an LED light body from multiple serially connected printed circuit boards, fixing the LED light body to a base, and connecting a light-transmissible shell to the light body to form a cluster la... | 03/11/2008 |
| 7342498 | Radio frequency identification (RFID) tag and manufacturing method thereof An RFID tag includes a dielectric member, an antenna pattern formed on and around a surface of the dielectric member, and an IC chip that is electrically connected to the antenna pattern by means of two chip pads. ... | 03/11/2008 |
| 7340828 | Method for producing metal/ceramic bonding circuit board There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a c... | 03/11/2008 |
| 7334324 | Method of manufacturing multilayer wiring board A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polya... | 02/26/2008 |
| 7334320 | Method of making an electronic fuse with improved ESD tolerance Tolerance to ESD is increased in an electronic fuse by providing at least one non-conductive region adjacent to a conductive region on the surface of an insulator. Such an arrangement reduces the thermal stresses imposed on the insulator in high current applications... | 02/26/2008 |
| 7334496 | Gearshift device for controlling the gear selection of a motor vehicle gearbox A shifting device is provided for controlling the gear selection of a motor vehicle transmission with a housing, with a gearshift lever, which is arranged within a recess of the housing and can be pivoted in at least one vertical plane. A cover plate follows the piv... | 02/26/2008 |
| 7325299 | Method of making a circuitized substrate A method of making a circuitized substrate. A conductive layer having a substantially planar upper surface is formed on and in direct mechanical contact with an upper surface of a substrate. A portion of the conductive layer is removed to form an interim side wall i... | 02/05/2008 |
| 7324861 | Numerical control system and method for laser cutting SMT stencil A numerical control system for laser cutting an SMT stencil includes a mechanical control portion (2) and a laser control portion (3). The mechanical control portion includes a first main control system (21), a first host computer isolation inte... | 01/29/2008 |
| 7319276 | Substrate for pre-soldering material and fabrication method thereof A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such... | 01/15/2008 |
| 7313863 | Method to form a cavity having inner walls of varying slope An improved mold, for use in the formation of a perpendicular magnetic write head, is described, together with a process for its manufacture. Conventional alumina is replaced by tantalum in the yoke portion of the mold. When both the tantalum and the alumina areas a... | 01/01/2008 |
| 7309256 | Flat flexible cable assembly with integrally-formed sealing members A flat flexible cable assembly includes a flat flexible cable having one or more substantially rectangular conductors encompassed within an insulating sheath. An overmold encapsulates and is secured to a portion of the flat flexible cable in an area in which the ins... | 12/18/2007 |
| 7299547 | Method for manufacturing tape wiring board A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing proces... | 11/27/2007 |
| 7294919 | Device having a complaint element pressed between substrates A device comprises a first substrate, a second substrate and a compliant element. The compliant element is composed of a first, compliant material between the first substrate and the second substrate and has a side surface coated at least in part with a layer of a s... | 11/13/2007 |
| 7293353 | Method of fabricating rigid flexible printed circuit board Disclosed is a method of fabricating rigid flexible PCBs. In the method, a self-detachable adhesive tape is used to separate a wafer and a substrate from each other in the course of conventionally fabricating a semiconductor wafer, is employed to avoid inherent prob... | 11/13/2007 |
| 7291842 | Photoconductor imagers with sandwich structure An image acquisition device 30 includes a photoconductor 48 to convert an electromagnetic radiation into electrical signals, a first layer 36 or 37 coupled to the photoconductor 48. The first layer 36 or 37 includes a... | 11/06/2007 |
| 7291795 | Flexible printed circuits with many tiny holes A switch or circuit board having a first conductive area on a first side of the board, a second conductive area on a second side of the board, several tiny holes running through the board from the first side to the second side, and a conductive material substantiall... | 11/06/2007 |
| 7292148 | Method of variable position strap mounting for RFID transponder A method of coupling an RFID chip to an antenna includes the steps of, iteratively until a test criterion is met, positioning an RFID chip relative to an antenna and testing the RFID chip and antenna. Once the test criterion is met, the RFID chip is coupled with the... | 11/06/2007 |
| 7282787 | Laminated multiple substrates The present invention is for laminated and interconnected multiple substrates forming a multilayer package or other circuit component. A solder bump may be situated on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed... | 10/16/2007 |
