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| Number | Title | Issue Date |
| 8091217 | Contact element, contact unit, method for producing a contact unit, and method for placing into operation for fine-pitch parts A contact element for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connected to each other by a separat... | 01/10/2012 |
| 8028401 | Method of fabricating a conducting crossover structure for a power inductor A method of fabricating a conducting crossover structure for a power inductor comprises stamping a first lead frame to define a first terminal and a second terminal; stamping a second lead frame to define a first terminal and a second terminal; and locating an insul... | 10/04/2011 |
| 7891087 | Method of connecting a bus bar to a capacitor Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated ... | 02/22/2011 |
| 7861406 | Method of forming CMOS transistors with dual-metal silicide formed through the contact openings Methods and associated structures of forming a microelectronic device are described. Those methods may include amorphizing at least one contact area of a source/drain region of a transistor structure by implanting through at least one contact opening, forming a firs... | 01/04/2011 |
| 7788800 | Method for fabricating a leadframe A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (402) and a plurality of lead segments (403). Covering the base metal are, consecutively, a nickel layer (3... | 09/07/2010 |
| 7425470 | Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at lea... | 09/16/2008 |
| 7405467 | Power module package structure A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips... | 07/29/2008 |
| 7370414 | Methods for manufacturing lead frame connectors for optical transceiver modules Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon... | 05/13/2008 |
| 7367119 | Method for forming a reinforced tip for a probe storage device Systems and methods in accordance with the present invention can include a tip contactable with a media. In an embodiment, the tip comprises a substantially hollow structure formed of a metal. The tip can be formed by depositing a first metal layer over silicon ther... | 05/06/2008 |
| 7367120 | Method for producing a solid-state imaging device A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external t... | 05/06/2008 |
| 7367108 | Method of bonding flying leads A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality o... | 05/06/2008 |
| 7363704 | RFID tag and method of manufacturing RFID tag A method of manufacturing an RFID tag includes forming through-holes on a sheet to embed a plurality of electronic components, such as IC chips; forming a substrate by sticking a bottom plate sheet to the sheet, and forming recesses; embedding the electronic compone... | 04/29/2008 |
| 7364947 | Method for cutting lead terminal of package type electronic component In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while lea... | 04/29/2008 |
| 7364784 | Thin semiconductor package having stackable lead frame and method of manufacturing the same Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of... | 04/29/2008 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabri... | 04/22/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7356894 | Method of producing a micro-actuator In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the sec... | 04/15/2008 |
| 7357294 | Method for mounting a semiconductor package onto PCB A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed... | 04/15/2008 |
| 7357886 | Singular molded and co-molded electronic's packaging pre-forms Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded co... | 04/15/2008 |
| 7354804 | Method for fabricating lead frame and method of fabricating semiconductor device using the same A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower su... | 04/08/2008 |
| 7350293 | Low profile ball-grid array package for high power A low-profile, high power ball grid array, or land grid array, device including a plastic tape having first and second surfaces, a portion of the first surface covered with an adhesive layer. First and second openings are stamped through the tape and adhesive layer,... | 04/01/2008 |
| 7351918 | Surface-mount base for electronic element A surface-mount base for an electronic element includes: an insulative supporting member having a through hole; a plurality of lead terminals each having an element connecting terminal, a lead portion and a mounting terminal, the lead terminals being mounted to the ... | 04/01/2008 |
| 7346976 | Method for manufacturing a suspension for disc drive The method for manufacturing a suspension for disc drive includes a process for manufacturing a semi-finished suspension product integrally including a base plate, a rigid body portion of a load beam, and a pair of connecting portions connecting the base plate and t... | 03/25/2008 |
| 7348662 | Composite multi-layer substrate and module using the substrate A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and... | 03/25/2008 |
| 7343439 | Removable modules with external I/O flexibility via an integral second-level removable slot The functionality provided to electronic devices by application specific removable modules is enhanced by viewing the removable modules as first-level removable modules and providing them with at least one second-level removable slot for selectively nesting second-l... | 03/11/2008 |
| 7339797 | Chip mount, methods of making same and methods for mounting chips thereon The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in ele... | 03/04/2008 |
| 7339262 | Tape circuit substrate and semiconductor apparatus employing the same A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply vol... | 03/04/2008 |
| 7338889 | Method of improving copper interconnects of semiconductor devices for bonding An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described whe... | 03/04/2008 |
| 7339280 | Semiconductor package with lead frame as chip carrier and method for fabricating the same A semiconductor package with a lead frame as a chip carrier and a method for fabricating the same are provided. The lead frame includes a die pad and a plurality of leads properly spaced apart from the die pad, each lead being composed of an inner lead portion and a... | 03/04/2008 |
| 7337088 | Intelligent measurement modular semiconductor parametric test system An intelligent measurement modular semiconductor parametric test system comprises an engine control module. The engine control module is operable to communicate with a user via a user interface, and is further operable to communicate with and to control the state of... | 02/26/2008 |
| 7335006 | In-mould labelling An In-Mould Labelling process comprising: clamping a label within a mould void of an injection moulding tool; and injecting material into the mould void while the label is clamped. An In-Mould Labelling process comprising: placing a label between a first mould void ... | 02/26/2008 |
| 7332783 | Semiconductor device with a photoelectric converting portion and a light-shading means The semiconductor device according to this invention is characterized by a package structure of a semiconductor substrate 100 equipped with a photoelectric converting portion, wherein a light-shading means 104 is arranged in an area corresponding to at... | 02/19/2008 |
| 7329949 | Packaged microelectronic devices and methods for packaging microelectronic devices Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second ... | 02/12/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7321160 | Multi-part lead frame A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame ... | 01/22/2008 |
| 7318757 | Leadframe assembly staggering for electrical connectors An electrical connector may include a connector housing and a plurality of identical leadframe assemblies received in the connector housing. Each of the leadframe assemblies may define a leadframe mating sequence. The leadframe assemblies may be arranged relative to... | 01/15/2008 |
| 7316060 | System for populating a circuit board with semiconductor chips A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three dimensional array of chips. The system includes a chip carrier pallet th... | 01/08/2008 |
| 7312101 | Packaged microelectronic devices and methods for packaging microelectronic devices Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second ... | 12/25/2007 |
| 7312105 | Leadframe of a leadless flip-chip package and method for manufacturing the same A leadframe of a leadless flip-chip package includes a plurality of inner leads, a non-conductive ink layer and a solder mask layer. The inner leads have a plurality of bump-connecting terminals, a plurality of outer terminals and a plurality of redistribution lead ... | 12/25/2007 |
| 7312106 | Method for encapsulating a chip having a sensitive surface Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to k... | 12/25/2007 |
