Celebrity Inventors
Comic actor Danny Kaye received patent D166,807 for the co-design of "Blowout Toy or the Like". It's similar to one of those toys that unravels when you blow into at a birthday party except Kaye's has three blowouts going in different directions, not just one.
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| Number | Title | Issue Date |
| 8375571 | Component assembly for surface mounting A component assembly (10) used for picking and placing the component assembly includes a component (14-30) having a geometry incapable of being picked and placed or having a geometry that is unstable when placed through a reflow oven. The assemb... | 02/19/2013 |
| 8341827 | Device for placing a component on a substrate A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device t... | 01/01/2013 |
| 8327529 | Assembly tool system An assembly tool is provided. The assembly tool comprises a body, a first vacuum channel defined within the body, and a first locating pin attached to the body. The first locating pin has a shaft portion arranged within a surrounding portion of the body. The first l... | 12/11/2012 |
| 8276265 | Electronic component mounting machine and electronic component loading head A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing t... | 10/02/2012 |
| 8262146 | Handling tools for components, in particular eletronic components A handling tool for electronic components includes a holding opening, to which a vacuum pressure may be applied and at which components to be handled are able to be held via vacuum pressure. At least one counter support, which outwardly projects beyond the opening p... | 09/11/2012 |
| 8205325 | Device for applying an electronic component The invention relates to a device for applying an electronic component having terminal faces, to a substrate, also having terminal faces, wherein the component is removed from a feeding device by means of an application device. An application device subsequently pos... | 06/26/2012 |
| 8127435 | Electronic component mounting apparatus The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting s... | 03/06/2012 |
| 8112875 | Vacuum suction nozzle for component mounting apparatus A vacuum suction nozzle operable to reduce or eliminate electronic component blow off and electrostatic damage is disclosed. The vacuum suction nozzle comprises a ceramic body with a first surface at a side opposite to a second surface of the ceramic body. The ceram... | 02/14/2012 |
| 8091216 | Electronic parts mounting apparatus and electronic parts mounting method An electric parts mounting apparatus includes rotary type multi-nozzle mounting heads. Each of the mounting heads has a plurality of suction nozzles disposed in a radial manner on a rotor mechanism, which rotates around a rotation shaft. A parts mount mechanism is c... | 01/10/2012 |
| 8020283 | High-speed RFID circuit placement device A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a... | 09/20/2011 |
| 7971346 | Applicator for electrical or electronic components Stock having printed circuits thereon is conveyed in a transport plane by a conveying device, and electronic components carried by a transfer belt are transferred to the stock under pressure exerted by the belt. The electronic components are transferred to the belt ... | 07/05/2011 |
| 7950140 | Connection device for electric components A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4 | 05/31/2011 |
| 7886427 | Component mounting head A suction-and-holding face for a component in a suction nozzle is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the component in suction and holding has the characteristics of a semiconductor. Thus, d... | 02/15/2011 |
| 7849588 | Electronic component mounting apparatus with setting device setting measurement positions for printed board An electronic component mounting apparatus includes a component feeding device that supplies an electronic component to a pickup position, a suction nozzle that picks up the electronic component supplied to the pickup position and mounts the picked up electronic com... | 12/14/2010 |
| 7841073 | Electronic component mounting apparatus The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting s... | 11/30/2010 |
| 7805832 | Transfer apparatus for transferring a component of integrated circuitry The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a ... | 10/05/2010 |
| 7793408 | Apparatus for transferring semiconductor chip The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of th... | 09/14/2010 |
| 7752742 | Infrared camera packaging Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gas... | 07/13/2010 |
| 7650688 | Bonding tool for mounting semiconductor chips A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank... | 01/26/2010 |
| 7637004 | Electronic device manufacturing method and supporter A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the suppo... | 12/29/2009 |
| 7603766 | Electronic-component holding apparatus and mounting system An electronic-component holding apparatus and an electronic-component mounting system each of which assures that a nozzle head holding a plurality of suction nozzles is easily attached to, and detached from, a head holding member, are provided. A suction surface of ... | 10/20/2009 |
| 7603767 | Workpiece picking and placing method A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure befo... | 10/20/2009 |
| 7581310 | Electronic component mounting apparatus The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the ... | 09/01/2009 |
| 7546678 | Electronic component mounting apparatus This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where th... | 06/16/2009 |
| 7546679 | High speed valve assembly Apparatus and associated systems or methods include a linear machine with an elongate, axially-slidable core member (i.e., shaft). In one embodiment, the shaft includes at least one radial aperture to provide fluid (e.g., air) communication from an interior volume o... | 06/16/2009 |
| 7526860 | Method of manufacturing nozzle plate, liquid ejection head, and image forming apparatus comprising liquid ejection head The method of manufacturing a nozzle plate, comprises the steps of: providing a liquid-repelling film on a first surface of a nozzle plate having a nozzle for ejecting liquid; then performing semi-curing of the liquid-repelling film; then providing a mask having a m... | 05/05/2009 |
| 7437818 | Component mounting method A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from... | 10/21/2008 |
| 7430798 | Electronic component attaching tool An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching... | 10/07/2008 |
| 7426781 | Placement unit for mounting electric components onto substrates A placement unit for mounting electric components onto substrates has means for moving perpendicularly to the substrate, a housing, a built-in, rotatable holder for the components, and a rotary drive for the holder mounted within the housing. The holder is connected... | 09/23/2008 |
| 7406759 | Releasing method and releasing apparatus of work having adhesive tape In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the h... | 08/05/2008 |
| 7401401 | Mounting head of electronic component mounting apparatus The invention is directed to reduction of torque by reduction of an outside diameter of a mounting head. A cylindrical cam rotation motor is provided under a nozzle rotation motor. A first rotation axis member as a rotor of the nozzle rotation motor is provided alon... | 07/22/2008 |
| 7392582 | Socket and/or adapter device, and an apparatus and process for loading a socket and/or adapter device with a corresponding semi-conductor component The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as a mechanism for loading a socket and/or adapter device with a corresp... | 07/01/2008 |
| 7373718 | Test device for a heat dissipating fan A test device for a heat dissipating fan, which is suitable for testing if the fan wheel is secured to the housing firmly, includes a support post, a transverse slide unit, which is disposed at the top of the support post and provides a transverse slide seat, a vert... | 05/20/2008 |
| 7367252 | Integrated circuit package separators An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond... | 05/06/2008 |
| 7367115 | Component mounting apparatus A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from ends of the supporting base and face each other in a Y direction. Th... | 05/06/2008 |
| 7367601 | Substrate transfer apparatus and substrate transfer method The present invention provides a substrate carrying apparatus capable of surely carrying a substrate with electronic parts mounted thereon, at low costs without causing the electronic parts to fall off the substrate, and without damaging the substrate. A substrate c... | 05/06/2008 |
| 7363702 | Working system for circuit substrate A working system for a circuit substrate enabling a control of stopping the substrate without inconvenience. A PWB detector 308 held by a Y-axis slide 252 of an XY robot 266 moving a component mounting head, has reflection type photoelectric sen... | 04/29/2008 |
| 7353596 | Component mounting method In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so ... | 04/08/2008 |
| 7354085 | Method of mounting component on circuit formation object A suction nozzle (21) has an outer nozzle member (30), a nozzle body (40), and an urging member (50) for urging the nozzle body (40) in a direction away from the outer nozzle member (30). The suction nozzle (21) also ... | 04/08/2008 |
| 7353589 | Component mounting apparatus A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a hea... | 04/08/2008 |
