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| Number | Title | Issue Date |
| 7882621 | Method for making chip resistor components A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a res... | 02/08/2011 |
| 7571536 | Method of making capacitive/resistive devices A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive devices conserves board surface real estat... | 08/11/2009 |
| 7520049 | Method for manufacturing a planar resistance heating element Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance heating element by etching an aluminum foil deposited on an insulating... | 04/21/2009 |
| 7355504 | Electrical devices An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a ma... | 04/08/2008 |
| 7350296 | Method of fabricating a printed circuit board including an embedded passive component Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating l... | 04/01/2008 |
| 7334318 | Method for fabricating a resistor A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method... | 02/26/2008 |
| 7305754 | Method of manufacturing chip resistor In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by... | 12/11/2007 |
| 7284317 | Method of producing printed circuit board with embedded resistor Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, there... | 10/23/2007 |
| 7281318 | Method of manufacturing a composite structural member having an integrated electrical circuit A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially b... | 10/16/2007 |
| 7278201 | Method of manufacturing a resistor A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of ab... | 10/09/2007 |
| 7278202 | Method for making overlay surface mount resistor A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween... | 10/09/2007 |
| 7275308 | Method for manufacturing a monolithic ink-jet printhead A method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejec... | 10/02/2007 |
| 7267879 | Coated article with silicon oxynitride adjacent glass A low-E coated article is provided, in certain example embodiments, with a layer including silicon oxynitride adjacent the glass substrate in order to improve chemical and/or mechanical durability of the coated article. In certain example embodiments, the coated art... | 09/11/2007 |
| 7264775 | Igniter assembly An igniter assembly for a pulsed flame photometric detector having a filament comprising a resistive heating wire between about 0.08 millimeter and about 0.40 millimeter in diameter wound into a coil having an inner diameter between about 0.40 millimeter and about 3... | 09/04/2007 |
| 7241975 | Igniter systems with associated lead frame Resistive igniter systems are provided that comprise a metal substrate with an associated resistive igniter element in electrical connection through braze applied to the metal substrate. Igniter systems of the invention can enable significantly simplified manufactur... | 07/10/2007 |
| 7237324 | Method for manufacturing chip resistor A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substr... | 07/03/2007 |
| 7230214 | Metal sheathed heater using splice connection assembly with heat shrinkable tubing, and method of use A metal sheathed heater utilizes splice connections that connects ends of a heater cable with ends of a lead wire. Each splice connection has a connector that connects core wires of the lead wires and heater cable together. Heat shrinkable tubing surrounds the conne... | 06/12/2007 |
| 7205878 | Over-current protection device and manufacturing method thereof An over-current protection device comprises at least one PTC component, at least one thermal dissipation layer, at least one adhesive layer and at least two isolation layers, wherein the PTC component is formed by interposing a PTC material between two electrode lay... | 04/17/2007 |
| 7200920 | Method for the implementation of electronic components in via-holes of a multi-layer multi-chip module The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electric... | 04/10/2007 |
| 7188404 | Method for fabricating a resistor An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrat... | 03/13/2007 |
| 7186356 | Analytical device A sensor for chemical species or biological species or radiation presenting to test fluid a polymer composition comprises polymer and conductive filler metal, alloy or reduced metal oxide and having a first level of electrical conductance when quiescent and being co... | 03/06/2007 |
| 7165316 | Methods for manufacturing resistors using a sacrificial layer An electrical resistor is made by providing a sacrificial layer and conductive pads disposed on a first surface of the sacrificial layer. An electrically resistive material is deposited over the pads and on the first surface of the sacrificial layer to form at least... | 01/23/2007 |
| 7165315 | Method for fabricating a resistor An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrat... | 01/23/2007 |
| 7164341 | Surface-mountable PTC thermistor and mounting method thereof A surface-mountable PTC thermistor element includes electrodes disposed on a top surface and a bottom surface of a thermistor element body, in which each of the electrodes is connected with a terminal respectively and each of the terminals is extended downward. An u... | 01/16/2007 |
| 7152291 | Method for forming plated terminations Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technolo... | 12/26/2006 |
| 7131187 | Method of making a heater element for a seat assembly A heating element that can be incorporated into a molded foam article closely adjacent to the outer cover sheet without showing any evidence that a heating element is encapsulated within the foam portion of the article and provides essentially the same relatively so... | 11/07/2006 |
| 7103965 | Method of making chip resistor The invention relates to a method of making a chip resistor using a material substrate for which are set a plurality of first cutting lines extending in a first direction and a plurality of second cutting lines extending in a second direction perpendicular to the fi... | 09/12/2006 |
| 7075407 | Temperature sensor A temperature sensor has lead lines made of an elastic material each attached to a corresponding one of electrodes on a temperature sensing element such as an NTC thermistor element. The lead lines may each have a non-straight part where they are bent or deformed in... | 07/11/2006 |
| 7069641 | Method for preparing composite materials of a positive temperature coefficient thermistor The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated materia... | 07/04/2006 |
| 7065861 | Method of producing a strain-sensitive resistor arrangement The invention relates to a strain-sensitive resistor, comprising a resistance layer arranged on a support element and an electromechanical transducer produced with this resistor. An increase in the electrical measured signal picked off across the resistor is ... | 06/27/2006 |
| 7053749 | Metal plate resistor A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main s... | 05/30/2006 |
| 7042330 | Low resistance value resistor The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed ... | 05/09/2006 |
| 7030728 | Layout and method to improve mixed-mode resistor performance A resistor layout and method of forming the resistor are described which achieves improved resistor characteristics, such as resistor stability and voltage coefficient of resistance. A resistor is formed from a conducting material such as doped silicon or polysilico... | 04/18/2006 |
| 6993828 | Method for manufacturing metal thin film resistor A metal resistor and a method for manufacturing the resistor are provided. A first insulation film is formed on a substrate, a photosensitive film is applied on the insulation film, and an insulation film pattern is formed by patterning the insulation film. After a ... | 02/07/2006 |
| 6935016 | Method for manufacturing a resistor An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrat... | 08/30/2005 |
| 6922131 | Electrical device An electrical device suitable for use in digital telecommunications applications is provided. The device includes a laminar PTC element composed of a conductive polymer composition sandwiched between two metal foil electrodes. A first insulating layer which is compo... | 07/26/2005 |
| 6910261 | Method of fabricating a colossal magneto-resistive detector using a thin film transfer method A method of fabricating a colossal magneto-resistive detector using a thin film transfer method includes the use of a perovskite oxide material as a substrate, and a rock salt structure material as a buffer layer, template layer, and release layer. Advantages associ... | 06/28/2005 |
| 6911605 | Flexible printed circuit In order to provide low-cost, long fatigue life flexible printed circuit, low profile electrolytic foil is used as copper foil for a circuit 3 of the flexible printed circuit 10. Crack which does not penetrate the copper foil should preferably be forme... | 06/28/2005 |
| 6906287 | Connector structure for bus bars in heatable vehicle window Opposing substrates of a vehicle window are laminated to one another using a polymer inclusive interlayer which has a notch or cut-out portion defined therein. Following lamination, at least one bus bar(s) supported by one of the substrates is exposed in this notch ... | 06/14/2005 |
| 6901655 | Method for making overlay surface mount resistor A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween... | 06/07/2005 |
