A kissing shield comprised of a thin, flexible membrane and a frame or holder.
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7441321 | Method of manufacturing ultrasound transducer device having acoustic backing An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible e... | 10/28/2008 |
| 7439616 | Miniature silicon condenser microphone A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume... | 10/21/2008 |
| 7434305 | Method of manufacturing a microphone A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper su... | 10/14/2008 |
| 7412764 | Method for manufacturing quartz crystal unit and electronic apparatus having quartz crystal unit In a method for manufacturing a quartz crystal unit, a quartz crystal tuning fork resonator is formed by etching a quartz crystal wafer to form a quartz crystal tuning fork base and first and second quartz crystal tuning fork tines connected to the quartz crystal tu... | 08/19/2008 |
| 7412763 | Method of making an acoustic assembly for a transducer A method of making an acoustic assembly for use in a transducer includes forming a multi-layer assembly. The multi-layer assembly includes a first layer member and a second layer member. Each member includes a center portion, an edge portion and an aperture separati... | 08/19/2008 |
| 7404247 | Method for making a pressure sensor A method for making a pressure sensor including the steps of providing a substrate and forming or locating a pressure sensing component on the substrate. The method further includes the step of, after the forming or locating step, etching a cavity in the substrate b... | 07/29/2008 |
| 7401397 | Method of producing an inertial sensor The present invention discloses an inertial sensor comprising a planar mechanical resonator with embedded sensing and actuation for substantially in-plane vibration and having a central rigid support for the resonator. At least one excitation or torquer electrode is... | 07/22/2008 |
| 7360292 | Method of minimizing inter-element signals for surface transducers The present invention provides a method of packaging surface microfabricated transducers such that electrical connections, protection, and relevant environmental exposure are realized prior to their separation into discrete components. The packaging method also isol... | 04/22/2008 |
| 7353585 | Method of poling ferroelectric materials A method of producing an actuator includes shaping a block of ferroelectric material to provide an active element of the actuator. The element includes a stack of ferroelectric layers with adjacent layers separated by electrodes arranged parallel to end faces of the... | 04/08/2008 |
| 7350287 | Voice coil insertion jig, speaker producing method using the jig, and speaker produced by using the jig A method of manufacturing a speaker using a voice coil insertion jig including providing a voice coil insertion jig, deforming a plurality of moving pieces from a first position elastically toward a central boss side to a second position, inserting the voice coil in... | 04/01/2008 |
| 7343661 | Method for making condenser microphones A method for making condenser microphones includes: forming a fixed electrode layer structure of a plurality of fixed electrode units; forming a sacrificial layer of a plurality of sacrificial units on one side of the fixed electrode layer structure; forming a diaph... | 03/18/2008 |
| 7322093 | Method for producing a boundary acoustic wave device In a method for producing a boundary acoustic wave device that includes a first medium, a second medium, and a third medium laminated in that order, and electrodes disposed at the interface between the first medium and the second medium, the method includes the step... | 01/29/2008 |
| 7316059 | Method of manufacturing an ultrasonic probe A method of manufacturing an ultrasonic probe including the steps of forming a plurality of first slits on a layered assembly having a first imner electrode member and a second inner electrode member through a top surface of the layered assembly and forming a plural... | 01/08/2008 |
| 7308750 | Method of manufacturing a magnesium diaphragm In a rolling process, the level of rolling performed by a rolling mill for one operation is set to 1 μm to 20 μm. A magnesium substrate is rolled by rollers while being heated by a thermostatic chamber. As a result, there is manufactured a high-quality magnesium s... | 12/18/2007 |
| 7305750 | Method of assembling a loudspeaker A loudspeaker and method of assembly according to this invention provides for precise alignment between the frame and motor structure before they are connected to one another, and employs a fixture to form the moving assembly of the speaker, i.e. the voice coil, upp... | 12/11/2007 |
| 7302748 | Linkage assembly for an acoustic transducer A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of s... | 12/04/2007 |
| 7281311 | Method of attaching a transfer resistant RFID tag to a surface A transfer resistant RFID tag preferably includes an identification chip, a tag coil, a housing and a cap. The identification chip is electrically connected to the tag coil with two wires. A first quantity of bonding compound is applied to a surface that is slightly... | 10/16/2007 |
| 7278200 | Method of tensioning a diaphragm for an electro-dynamic loudspeaker Electro-dynamic loudspeakers typically include a diaphragm having a conductor applied to one of its surfaces. The diaphragm is secured to a frame. The conductor is connected to a power supply for providing electrical current through linear traces of the conductor th... | 10/09/2007 |
| 7275298 | Ultrasonic printed circuit board transducer There is provided methods for producing an ultrasonic transducer assembly. The methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board, having a top surface and bottom surface; creating a patterned conducting layer up... | 10/02/2007 |
| 7253706 | Method for manufacturing surface acoustic wave element, as well as surface acoustic wave element manufactured by the same method A method for manufacturing a surface acoustic wave element including: forming a conductive film on a surface of a piezoelectric substrate; forming a photoresist film on the conductive film; printing a pattern by exposing and developing the pattern, which is original... | 08/07/2007 |
| 7246425 | Method of manufacturing a speaker In manufacturing a speaker, ultrasonic complex vibration welding is applied at least to: a process of fixedly putting together a magnet, a pot yoke a the pole piece; a process of fixing, to a portion of an inner circumference of a frame, an outer periphery of a spid... | 07/24/2007 |
| 7237315 | Method for fabricating a resonator A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate. The quartz substrate is metallized so that a bias voltage is applied t... | 07/03/2007 |
| 7213322 | Method for manufacturing surface acoustic wave device A piezoelectric substrate is provided with interdigital transducer electrodes including a first electrode layer, a second electrode layer, and a third electrode layer that is principally made of aluminum. The piezoelectric substrate has a stepped structure on the su... | 05/08/2007 |
| 7210213 | Method for manufacturing a dynamic speaker A speaker collective substrate with component insertion hole sections and electrode sections has a plurality of speaker forming areas. An electrical speaker section, which comprises a magnetic circuit section and a vibration section, is inserted into each of the com... | 05/01/2007 |
| 7204009 | Manufacturing method of acoustic sensor The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a s... | 04/17/2007 |
| 7197798 | Method of fabricating a composite apparatus A method for fabricating a piezoelectric macro-fiber composite actuator comprises making a piezoelectric fiber sheet by providing a plurality of wafers of piezoelectric material, bonding the wafers together with an adhesive material to form a stack of alternating la... | 04/03/2007 |
| 7194793 | Method for producing an edge reflection type surface acoustic wave device A method for adjusting a frequency characteristic of an edge reflection type surface acoustic wave device includes the step of obtaining a frequency characteristic of an edge reflection type surface acoustic wave device having a piezoelectric substrate. The edge ref... | 03/27/2007 |
| 7152299 | Method of assembling a loudspeaker Electro-dynamic loudspeakers typically include a diaphragm having a conductor applied to one of its surfaces. The diaphragm is secured to a frame. The conductor is connected to a power supply for providing electrical current through linear traces of the conductor th... | 12/26/2006 |
| 7127793 | Method of producing solid state pickup device A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a ... | 10/31/2006 |
| 7107665 | Method for manufacturing microphone assembly A microphone assembly comprises a microphone, a connector secured to the underside of the microphone. A gasket has a sound collecting hole and is secured on the upper surface of the microphone. ... | 09/19/2006 |
| 7110561 | Transparent panel-form loudspeaker A transparent panel-form loudspeaker consists of a transparent sound radiation panel that can radiate sound with desired pressure level over a specific frequency range when subjected to the flexural vibration induced by a preselected number of transducers located at... | 09/19/2006 |
| 7103948 | Method of manufacturing piezoelectric wafers of saw identification tags The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wafer-independent patterns that... | 09/12/2006 |
| 7103960 | Method for providing a backing member for an acoustic transducer array A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are prov... | 09/12/2006 |
| 7093343 | Method of manufacturing an acoustic transducer An acoustic transducer design having a slotted oval-shaped shell and active transducer elements located on the inner surface of the shell is disclosed. The design provides a high power, ultra-low frequency oval projector having a number of applications, including un... | 08/22/2006 |
| 7091818 | Noise suppressor unit for a power source module The invention relates to a noise suppressor unit for installing a common mode choke for a noise suppressor in a power source module onto a circuit board of the power source module, the module being arranged onto a circuit board of a plug-in unit. The noise suppresso... | 08/15/2006 |
| 7080442 | Manufacturing method of acoustic sensor The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a s... | 07/25/2006 |
| 6993812 | Method of manufacturing the piezoelectric transducer Inner individual electrodes are formed at intervals on a piezoelectric ceramic layer so as to correspond in a one-to-one relationship with ink channels, and an inner common electrode are formed on another piezoelectric ceramic layer. The required number of piezoelec... | 02/07/2006 |
| 6988300 | Method of producing a piezoelectric element A piezoelectric element contains a piezoelectric ceramic body having a layered perovskite structure, and has the C axis selected and oriented in the thickness direction. In the piezoelectric ceramic body, line shaped electrodes are formed perpendicular to the C axis... | 01/24/2006 |
| 6931698 | Method for fabricating piezoelectric/electrostrictive device A piezoelectric/electrostrictive device is provided including a functional element. The functional element includes a base portion, a deformable portion assuming the form of a thin plate and extending from the base portion to thereby form a plane, a piezoelectric/el... | 08/23/2005 |
| 6928718 | Method for array processing of surface acoustic wave devices An assembly and method for array processing of hermetically sealed Surface Acoustic Wave (SAW) Devices employs a non-conductive material having an array of spaced cavities extending into the material for receiving a SAW die face down, in a flip-chip arrangement. Eac... | 08/16/2005 |