A gun that fires a missile, powered by gas "discharged by the operator of the toy."
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| Number | Title | Issue Date |
| 8142521 | Large scale MOCVD system for thin film photovoltaic devices An apparatus for fabricating thin films on substrate panels includes a deposition chamber enclosed by sidewalls, a lid, and a base. The apparatus includes a mixing chamber disposed above the lid and configured to receive vapor species and form a mixed vapor. The mix... | 03/27/2012 |
| 7811337 | Ultracapacitor electrode with controlled sulfur content Particles of active electrode material are made by blending mixing a mixture of activated carbon and binder. In selected implementations, sulfur level in the activated carbon is relatively low and the binder is inert. For example, sulfur content of the activated car... | 10/12/2010 |
| 7658772 | Process for making electrode pairs The present invention is a process for making a matching pair of surfaces, which involves creating a network of channels on one surface of two substrate. The substrates are then coated with one or more layers of materials, the coating extending over the regions betw... | 02/09/2010 |
| 7348097 | Insulative feed through assembly for electrochemical devices An insulative feedthrough receives an electrical lead therethrough and includes a ferrule having fist and second open ends and an interior surface. At least one polymeric guide member is positioned substantially within the first end of the ferrule and has an apertur... | 03/25/2008 |
| 7318844 | Laser-irradiated metallized electroceramic The manufacturing method for an electroceramic component (1), for example a varistor (1), comprises a laser irradiation of a part (5; 6) of the surface of an electroceramic body (2) before a metallization (3; 4) is applied to the p... | 01/15/2008 |
| 7258520 | Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing A system for opening a substrate carrier includes a substrate carrier having an openable portion. The substrate carrier also has an opening mechanism coupled to the openable portion. A substrate transfer location has a support adapted to support a substrate carrier.... | 08/21/2007 |
| 7252007 | Method for the manufacturing of a capacitive pressure sensor, and a capacitive pressure sensor The invention relates to measuring devices for the measuring of pressure, and more specifically to capacitive pressure sensors. The silicon crystal planes {111} are located at the corners of a wet etched membrane well of a pressure sensor element according to... | 08/07/2007 |
| 7247603 | Charge dissipative dielectric for cryogenic devices A Superconducting Quantum Interference Device (SQUID) is disclosed comprising a pair of resistively shunted Josephson junctions connected in parallel within a superconducting loop and biased by an external direct current (dc) source. The SQUID comprises a semiconduc... | 07/24/2007 |
| 7220321 | Apparatus and processes for the mass production of photovoltaic modules An apparatus and processes for large scale inline manufacturing of CdTe photovoltaic modules in which all steps, including rapid substrate heating, deposition of CdS, deposition of CdTe, CdCl2 treatment, and ohmic contact formation, are performed within a... | 05/22/2007 |
| 7208021 | Fabrication of close-spaced MEMS devices by method of precise adhesion regulation In one aspect, the present invention provides a method for fabricating two layers separated by a gap comprising the steps of: (a) providing a first material; (b) treating the first material to reduce the number of available bonding centers; (c) placing a second mate... | 04/24/2007 |
| 7141081 | Solid electrolytic capacitor and method for producing the same The present invention relates to a solid electrolytic capacitor having a masking structure in which the insulation between the anode part and the cathode part can be ensured without fail, to its production method, to a method for coating a masking agent on a solid e... | 11/28/2006 |
| 7140102 | Electrode sandwich separation Materials bonded together are separated using electrical current, thermal stresses, mechanical force, any combination of the above methods, or any other application or removal of energy until the bonds disappear and the materials are separated. In one embodiment the... | 11/28/2006 |
| 7099495 | Frequency and resolution analyzed biometric authentication method and device During registration, an iris image taken is frequency-analyzed using a plurality of frequencies f1 to fn to generate features for the respective frequencies f1 to fn. During authentication, frequencies f2 to fn are selected from the frequencies ... | 08/29/2006 |
| 7070261 | Monolithic printhead with built-in equipotential network and associated manufacturing method An actuating assembly (50) for ink jet printheads consists of a silicon die (61), which comprises a groove (45) and a lamina (64), and of a structure (75) produced monolithically in the same production process. The actuating assemb... | 07/04/2006 |
| 7022627 | Method for the heat treatment of substrates A substrate undergoes a semiconductor fabrication process at different temperatures in a reactor without changing the temperature of the reactor. The substrate is held suspended by flowing gas between two heated surfaces of the reactor. Moving the two heated surface... | 04/04/2006 |
| 6971165 | Method for fabrication of separators for electrode pairs in diodes An improved method for manufacturing a matching pair of electrodes comprises the steps of: fabricating a first electrode with a substantially flat surface; depositing islands of an oxidizable material over regions of the surface; depositing a layer of a third materi... | 12/06/2005 |
| 6955741 | Semiconductor-processing reaction chamber The present application provides a PECVD reaction chamber for processing semiconductor wafers comprising a susceptor for supporting a semiconductor wafer inside the reaction chamber wherein the susceptor comprises a plurality vertical through-bores, a moving means f... | 10/18/2005 |
| 6949143 | Dual substrate loadlock process equipment One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. T... | 09/27/2005 |
| 6890363 | Solid electrolytic capacitor and method for producing the same The present invention relates to a solid electrolytic capacitor having a masking structure in which the insulation between the anode part and the cathode part can be ensured without fail, to its production method, to a method for coating a masking agent on a solid e... | 05/10/2005 |
| 6855885 | Electrical component housing A housing for an electrical component includes an electrically conductive cup which includes a wall, a floor, and a cover having electrical terminals. The housing also includes an electrically insulating coating applied to an outside of the floor and adjoining regio... | 02/15/2005 |
| 6620366 | Method of making a capacitor post with improved thermal conductivity The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention pr... | 09/16/2003 |
| 6610241 | Microwave sintering of multilayer dielectrics with base metal electrodes Certain embodiments relate to a process for forming a multilayer electrical device. The process includes providing a multilayer structure including layers of a dielectric material and an electrode material. The electrode material may include at least one ... | 08/26/2003 |
| 6607602 | Device for processing semiconductor wafers Device for processing semiconductor wafers, comprising at least one processing chamber which is completely closed with the exception of a connection to a distribution. System. In said at least one processing chamber there are situated preferably two react... | 08/19/2003 |
| 6563555 | Methods of manufacturing a two-terminal nonlinear device An MIM nonlinear device having a large nonlinearity coefficient that represents the sharpness of the voltage-current characteristic, a liquid crystal display panel with high image-quality that uses this device, and a manufacturing method of said MIM nonli... | 05/13/2003 |
| 6449521 | Decontamination of a plasma reactor using a plasma after a chamber clean A method and apparatus for reducing fluorine and other sorbable contaminants in plasma reactor used in chemical vapor deposition process such as the deposition of silicon oxide layer by the reaction of TEOS and oxygen. According to the method of the prese... | 09/10/2002 |
| 6423104 | Method of and apparatus for manufacturing tantalum solid electrolytic capacitors A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first c... | 07/23/2002 |
| 6423103 | Method for producing a solid electrolytic capacitor First, an anode lead is led out of an anode member. Next, a dielectric film is formed at a surface of the anode member by anodic oxidation to form a capacitor element. Thereafter, a water-repellent agent is applied on a predetermined position of the anode... | 07/23/2002 |
| 6409775 | Method of molding a plurality of solid electrolytic capacitors on a metal lead frame A hoop metal lead frame (1) having, solid electrolytic capacitor elements (5) on its terminal sections (2) is provided with a crosspiece (3) bridging both sides in terms of the width direction disposed along the length direction in a region between the ca... | 06/25/2002 |
| 6409777 | Solid electrolytic capacitor and method of manufacturing the same A conductive high polymer layer as an electrolyte is formed on the entire surface of fine pores of a dielectric oxide layer of an anode electrode having an undulated surface of fine pores or the like. As a result, a solid electrolytic capacitor having cha... | 06/25/2002 |
| 6334879 | Method for providing a hermetically sealed capacitor A sealed capacitor, which may be hermetic, having a generally flat, planar geometry, is described. The capacitor includes at least one electrode provided by a metallic substrate having a capacitive material contacted thereto. The coated substrate can prov... | 01/01/2002 |
| 5913105 | Method and system for recognizing scratch patterns on semiconductor wafers Method and system for performing semiconductor manufacturing scratch recognition analysis in cooperation with wafer scanning tools is disclosed. The invention comprises a method for determining from scan data associated with defects or other points on a s... | 06/15/1999 |
| 5581091 | Nanoelectric devices Single-electron devices useful as diodes, transistors or other electronic components are prepared by anodizing a metal substrate in sheet or foil form electrolytically in an acid bath, to deposit thereon an oxide film having axially disposed micropores of... | 12/03/1996 |
| 5485294 | Process for producing MIM elements by electrolytic polymerization An active element such as a MIM element includes a first electrically conductive layer, a nonlinearly conductive layer having a low dielectric constant disposed on the first conductive layer and a second electrically conductive layer disposed on the nonli... | 01/16/1996 |
| 5407449 | Device for treating micro-circuit wafers The invention relates to a device for treating micro-circuit wafers, comprising a feed station for cassettes with wafers, at least one treatment station in which wafer carriers and treatment means co-acting therewith are disposed and a transfer station pr... | 04/18/1995 |
| 5374594 | Gas-based backside protection during substrate processing A suitable inert gas such as argon or a mixture of inert and reactive gases such as argon and hydrogen is introduced onto the backside of wafers being processed in a CVD reactor during the deposition of tungsten or other metals, metal nitrides and silicid... | 12/20/1994 |
| 5332406 | Apparatus for producing semiconductor device A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ... | 07/26/1994 |
| 5322526 | Method for manufacturing a superconducting device having an extremely thin superconducting channel formed of oxide superconductor material A superconducting device includes a superconducting channel constituted of an oxide superconductor thin film formed on a substrate, a superconductor source electrode and a superconductor drain electrode formed at opposite ends of the superconducting chann... | 06/21/1994 |
| 5313693 | Device for the mounting of very wide-band microwave integrated circuits The integrated circuit chips (5) are mounted on a ferrite support (20). The ferrite support is metallized uniformly (26) on its lower face and bears metallization zones (21, 24) on its other face. To certain of these zones (24) serving as a ground plane, ... | 05/24/1994 |
| 5294560 | Bidirectional nonlinear resistor, active matrix liquid crystal panel using bidirectional nonlinear resistor, and method for production thereof A bidirectional nonlinear resistor for use as a nonlinear active element having a highly insulating organic film formed on a first conductor by polymerizing in an electrolytic solution containing a supporting electrolyte and a soluble organic compound, an... | 03/15/1994 |
| 5279623 | Method of fabricating flat type electrochemical device A method of fabricating a flat type electrochemical device, which is constructed by placing in a case comprising first and second case half bodies a separator and first and second functional substances for an electrochemical device so arranged as to inter... | 01/18/1994 |