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| Number | Title | Issue Date |
| 6929259 | Compact bank note dispensing device to prevent duplication releases A duplicate let off prevention device for sheets includes a first exit guide, a second exit guide which is spaced from the first exit guide at a distance that is larger than the thickness of one sheet and is smaller than the thickness of two sheets, and a pre-exit g... | 08/16/2005 |
| 6931296 | Algorithms tunning for dynamic lot dispatching in wafer and chip probing A method and system for flexible, comprehensive, on-line, real-time dynamic lot dispatching in a semiconductor test foundry based on a two-phased, event-driven dispatching system structure. An adjustable priority formula and tuned algorithms integrated with PROMIS' ... | 08/16/2005 |
| 6930498 | Membrane probing system A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, an... | 08/16/2005 |
| 6927181 | Transfer robot and inspection method for thin substrate A transfer robot (5) for thin substrate capable of efficiently detecting the stored state of thin substrates and an inspection method for thin substrate capable of accurately detecting the stored state of thin substrates; the robot (5), comprising an i... | 08/09/2005 |
| 6926798 | Apparatus for supercritical processing of a workpiece An apparatus for supercritical processing and non-supercritical processing of a workpiece comprises a transfer module, a supercritical processing module, a non-supercritical processing module, and a robot. The transfer module includes an entrance. The supercritical ... | 08/09/2005 |
| 6926188 | Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a mov... | 08/09/2005 |
| 6926012 | Method for supercritical processing of multiple workpieces An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled ... | 08/09/2005 |
| 6928207 | Apparatus for selectively blocking WDM channels An apparatus for selective blocking WDM channels comprises a light modulator, a diffraction grating, and a transform lens. The light modulator comprises an array of pixels. Each pixel of the light modulator is selectively operable to direct light into a first mode a... | 08/09/2005 |
| 6927891 | Tilt-able grating plane for improved crosstalk in 1×N blaze switches A light modulator includes elongated elements arranged parallel to each other. Each elongated element includes a light reflective planar surface with the light reflective planar surfaces configured in a first grating plane. A support structure is coupled to the elon... | 08/09/2005 |
| 6927842 | Wafer handling method for use in lithography patterning A method utilizing a lithography system comprises a lithography patterning chamber, a wafer exchange chamber separated from the lithography patterning chamber by a first gate valve, and at least one alignment load-lock separated from the wafer exchange chamber by a ... | 08/09/2005 |
| 6923188 | Method of sampling contaminants of semiconductor wafer carrier A method of sampling contaminants of a semiconductor wafer carrier. The method includes placing a tool chamber in a clean room and then placing and fixing the semiconductor wafer carrier with its opening facing downward inside the tool chamber. Then the method inclu... | 08/02/2005 |
| 6922272 | Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices A MEMS device such as a grating light valve™ light modulator is athermalized such that the force required to deflect the movable portion of the MEMS device remains constant over a range of temperatures. In MEMS embodiments directed to a grating light valve™ ligh... | 07/26/2005 |
| 6921456 | High pressure processing chamber for semiconductor substrate A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical... | 07/26/2005 |
| 6920369 | Methods of operating vacuum processing equipment and methods of processing wafers A method of operating vacuum processing equipment that includes multiple sets of apparatus for performing a succession of different processes on individual wafers, an apparatus for transporting said wafers, and an apparatus for controlling said processing apparatus ... | 07/19/2005 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer We disclose a method of applying a sculptured layer of material on a semiconductor feature surface using ion deposition sputtering, wherein a surface onto which the sculptured layer is applied is protected to resist erosion and contamination by impacting ions of a d... | 07/19/2005 |
| 6916398 | Gas delivery apparatus and method for atomic layer deposition One embodiment of the gas delivery assembly comprises a covering member having an expanding channel at a central portion of the covering member and having a bottom surface extending from the expanding channel to a peripheral portion of the covering member. One or mo... | 07/12/2005 |
| 6916147 | Substrate storage cassette with substrate alignment feature A substrate storage cassette and a method of orienting a substrate disposed therein are provided. In one embodiment, the substrate storage cassette includes a plurality of flanges pairs disposed between a first lateral sidewall coupled in a spaced-apart relation to ... | 07/12/2005 |
| 6910441 | Pressure regulating system of plasma processing equipment Plasma processing equipment includes a process, a cover covering the top of the process chamber, a wafer chuck disposed in the process chamber, a pressure regulating system including a pressure regulating plate situated at the bottom surface of the cover, and an ele... | 06/28/2005 |
| 6911391 | Integration of titanium and titanium nitride layers Embodiments of the present invention generally relate to an apparatus and method of integration of titanium and titanium nitride layers. One embodiment includes providing one or more cycles of a first set of compounds, providing one or more cycles of a second set of... | 06/28/2005 |
| 6911124 | Method of depositing a TaN seed layer We have discovered a method of providing a thin approximately from about 20 Å to about 100 Å thick TaN seed layer, which can be used to induce the formation of alpha tantalum when tantalum is deposited over the TaN seed layer. Further, the ... | 06/28/2005 |
| 6911112 | Method of and apparatus for performing sequential processes requiring different amounts of time in the manufacturing of semiconductor devices A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each... | 06/28/2005 |
| 6908027 | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process More complete bonding of wafers may be achieved out to the edge regions of the wafer by constrained bond strengthening of the wafers in a pressure bonding apparatus after direct wafer bonding. The pressure bonding process may be accompanied by the application of not... | 06/21/2005 |
| 6908201 | Micro-support structures A MEM device in accordance with the invention comprises one or more movable micro-structures which are preferably ribbon structures or cantilever structures. The ribbon structures or cantilever structures are preferably coupled to a substrate structure through one o... | 06/21/2005 |
| 6908838 | Method and device for treating semiconductor substrates The invention relates to a method and to a device for treating semiconductor substrates. In conventional systems, the especially uncoated semiconductor substrates are fed to a treatment device through a charging sluice, said charging sluice adjoining a transfer cham... | 06/21/2005 |
| 6904920 | Method and apparatus for cleaning containers A machine for cleaning containers such as flat media carriers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor in a chamber. The cleaning solution, a mixture of water and a detergent or surf... | 06/14/2005 |
| 6905333 | Method of heating a substrate in a variable temperature process using a fixed temperature chuck A method is provided for heating a substrate in a process chamber using a heated chuck. In accordance with the method, the substrate is lowered onto the chuck and heated to a first temperature less than a temperature of the chuck. The substrate is then raised away f... | 06/14/2005 |
| 6904699 | Vacuum processing apparatus and operating method therefor This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred ... | 06/14/2005 |
| 6903465 | Method and apparatus for a semiconductor package for vertical surface mounting A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least a portion of the semiconductor device and at least a portion of each... | 06/07/2005 |
| 6902620 | Atomic layer deposition systems and methods Atomic layer deposition systems and methods are disclosed utilizing a multi-wafer sequential processing chamber. The process gases are sequentially rotated among the wafer stations to deposit a portion of a total deposition thickness on each wafer at each station. A... | 06/07/2005 |
| 6904384 | Complex multivariate analysis system and method A complex multivariate analysis system is provided. The system has a storage module, a selecting module, an analyzing module, a correlation searching module and a reporting module. The storage module includes a first database and a second database. The first databas... | 06/07/2005 |
| 6903278 | Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate In substrate packaging and mounting, such as for a flip chip mounted on a thin-core or coreless substrate, a high degree of rigidness and support is imparted to the substrate, to overcome bending/flexing/distortion during mounting/packaging of the chip and to preven... | 06/07/2005 |
| 6881675 | Method and system for reducing wafer edge tungsten residue utilizing a spin etch A method and system for reducing wafer edge residue following a chemical mechanical polishing operation. A semiconductor wafer can be polished utilizing a chemical mechanical polishing apparatus. Thereafter, an acid etch operation may be performed to remove a residu... | 04/19/2005 |
| 6878172 | Systems employing elevated temperatures to enhance quality control in microelectronic component manufacture Aspects of the invention provide various methods and apparatus for delivering more reliable packaged microelectronic components. One embodiment provides a method in which packaged microelectronic components are heated to a reflow temperature of a selected solder bef... | 04/12/2005 |
| 6872229 | Apparatus for peeling protective sheet Chips C which have already been diced are attached to a ring frame F using an adhesive sheet, and a protective sheet S1 is attached to a circuit pattern surface of the chips C. The chips C, along with a ring frame F, are held in place on a table 27 of ... | 03/29/2005 |
| 6862784 | Method of fabricating a wound capacitor A method of fabricating a capacitor provides for coupling a ball grid array (BGA) lead configuration to a foil and disposing the foil within a case. The BGA lead configuration extends from the case. ... | 03/08/2005 |
| 6853872 | Operating method of vacuum processing system and vacuum processing system A vacuum processing method and apparatus processing units for conducting processing, a transfer processing unit connected with the plurality of processing units for carrying wafers, and a control unit for controlling the processing units. A processing order informat... | 02/08/2005 |
| 6843809 | Vacuum/purge operation of loadlock chamber and method of transferring a wafer using said operation A vacuum/purge operation of a loadlock chamber prevents an eddy phenomenon from occurring in the chamber and thereby prevents wafers from being polluted and damaged by particles in the chamber. A vacuum pump for providing the loadlock chamber with vacuum pressure, a... | 01/18/2005 |
| 6810575 | Functional element for electric, electronic or optical device and method for manufacturing the same Disclosed is a functional element for use in an electric, an electronic or an optical device, and a method for producing the same. The functional element comprises a substrate having on an upper surface thereof a plurality of metal oxide needles extending upwardly o... | 11/02/2004 |
| 6790242 | Fullerene coated component of semiconductor processing equipment and method of manufacturing thereof A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a fullerene containing surface and process for manufacturing thereof. ... | 09/14/2004 |
| 6786936 | Methods, complexes, and systems for forming metal-containing films on semiconductor structures A method of forming a film on a substrate using Group IVB, VB, or VIB metal complexes. The methods are particularly suitable for the preparation of semiconductor structures using chemical vapor deposition techniques and systems. ... | 09/07/2004 |
