Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
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| Number | Title | Issue Date |
| 5043301 | Method of thermally treating semiconductor wafers in furnace and wafer hanger useful therein A wafer hanger has a rod member and a supporting member. The rod member is inserted into respective notches formed in semiconductor wafers, and then placed on the supporting member. The wafer hanger holding the wafers is put into a furnace for heat treatm... | 08/27/1991 |
| 5042123 | Computer controlled automated semiconductor production apparatus An apparatus for producing semiconductor devices includes: a wafer splitting device for splitting a semiconductor wafer into individual dice; an automatic warehouse for lead frames for storing a plurality of kinds of lead frame; an assembly device for ass... | 08/27/1991 |
| 5038453 | Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions... | 08/13/1991 |
| 5035034 | Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames A multi-fingered clamp assembly provides for the independent clamping of individual leads of a semiconductor device lead frame during wire bonding. The assembly consists of a clamp frame which carries and supports an interchangeable clamp insert. The clam... | 07/30/1991 |
| 5020200 | Apparatus for treating a wafer surface An apparatus for treating a surface of a wafer includes a wafer-holding device for holding the wafer horizontally at the center of the lower surface of the wafer to rotate the wafer around a predetermined rotation axis and a nozzle for supplying a flow of... | 06/04/1991 |
| 5016332 | Plasma reactor and process with wafer temperature control Gas plasma system and process which are particularly suitable for photoresist stripping and descumming operations. A wafer is placed on a heated platen in a processing chamber and is lifted away from the platen to control thermal contact between the wafer... | 05/21/1991 |
| 4977658 | Sensor and method for the production thereof Disclosed is a sensor comprising an insulating substrate, a plurality of electrodes coated on the insulating substrate and formed of a thin film conductor of a metallo-organic compound obtained by a pyrolysis, and a layer formed across the electrodes. The... | 12/18/1990 |
| 4949783 | Substrate transport and cooling apparatus and method for same A loading station receives a substrate into a load-lock volume pressure isolated from a loading station chamber which is open to a processing chamber. The volume is evacuated and the substrate lowered into the loading chamber. A transport arm moves the su... | 08/21/1990 |
| 4949152 | Semiconductor integrated circuit A semiconductor integrated circuit having a polycrystalline light interrupting layer covering at least one P-N junction. Photo leakage currents produced at the P-N junction by irradiation with light are thus decreased, and malfunctions are prevented.... | 08/14/1990 |
| 4903754 | Method and apparatus for the transmission heat to or from plate like object An installation for the transmission of heat energy between a carrier and a small plate receives a gas between the small plate and the carrier in order to improve the transmission of heat. The same gas serves to press the small plate against the carrier b... | 02/27/1990 |
| 4881922 | Separable drive coupling using metal bellows In semiconductor vacuum processing, it is desirable to minimize the material handling mechanisms that must be located in the evacuated process chamber. To accomplish this, a mechanism has been designed that locates the necessary power elements such as mot... | 11/21/1989 |
| 4868490 | Method and apparatus for sheet resistance measurement of a wafer during a fabrication process The sheet resistance of an integrated circuit wafer (W) may be measured during an integrated circuit fabrication process step. A chamber (26) has disposed therein a plurality of probes (40) each having a conductive tip (84) for abutting the work surface a... | 09/19/1989 |
| 4766516 | Method and apparatus for securing integrated circuits from unauthorized copying and use A security system and method for IC circuits has at least one additional circuit element that does not contribute toward the IC's circuit function, but inhibits proper functioning of the IC in case of an attempted copying or other unauthorized use. The id... | 08/23/1988 |
| 4741787 | Method and apparatus for packaging semiconductor device and the like The present invention relates to a method of and an apparatus for packaging a semiconductor device and the like to package the semiconductor device and the like completely associated with resin. A process for packaging a semiconductor device and the like accor... | 05/03/1988 |
| 4724222 | Wafer chuck comprising a curved reference surface A chuck for holding a workpiece (e.g., a semiconductor wafer) in a vacuum comprises a curved reference surface. By clamping the edges of the workpiece and maintaining its backside against the curved surface (or against pins mounted on the surface), the fr... | 02/09/1988 |
| 4718967 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate The apparatus includes a treating container having a light transmission window and a closure member for opening and closing the container, a light source positioned opposite the light transmission window, and equipment for deoxygenating at least a substan... | 01/12/1988 |
| 4715115 | Package for water-scale semiconductor devices The invention is a method of packaging whole or large silicon wafers that provides support for the wafer, eliminates thermally or package-induced wafer strain, and allows selection of a mounting substrate material that provides optimal heat conduction.... | 12/29/1987 |
| 4667076 | Method and apparatus for microwave heat-treatment of a semiconductor water The present invention relates to a method of heat-treating a semiconductor wafer by utilizing an electromagnetic wave. The wafer is floated by the blast of a gas and is held in a non-contacting state, and the electromagnetic wave, such as microwave, is pr... | 05/19/1987 |
| 4600936 | Chip registration mechanism A chip registration mechanism may form a part of a carrier for retaining in position a plurality of integrated circuit chips in row and column fashion having identification codes on one surface thereof, such that the chip codes may be read and cooperate w... | 07/15/1986 |
| 4592926 | Processing apparatus and method A vacuum processing apparatus and method utilize a vacuum chamber formed from a pair of casing sections, one of which is movable in to and out of sealing engagement with the other casing section. The movable casing section is equipped to carry a workpiece... | 06/03/1986 |
| 4561718 | Photoelastic effect optical waveguides An optical waveguide apparatus provides for single-mode and multimode switching or modulation of light wave energy with reduced bias voltages. Optical channels are formed in a crystal substrate by depositing film stripes thereon to cause stress-induced ch... | 12/31/1985 |
| 4441250 | Apparatus for registering a mask pattern in a photo-etching apparatus for semiconductor devices An apparatus is provided for registering a pattern on a mask plate with a pattern already formed on a semiconductor wafer. A reflector group is provided on the wafer comprising a plurality of reflectors having a predetermined shape, interval and alignment... | 04/10/1984 |
| 4441248 | On-line inspection method and system for bonds made to electronic components On-line inspection of electric characteristics of a semiconductor device can be achieved during a step of bonding a lead wire to a chip surface of the semiconductor device in the process of fabricating an electronic component, by the use of a circuit arra... | 04/10/1984 |
| 4228570 | Electroding preparation apparatus An apparatus is provided for forming a large area photovoltaic cell into a plurality of photovoltaic cells on a common substrate and preparing the individual cells for an overlying layer of conductive material. A tool bit is urged against the polycrystall... | 10/21/1980 |
| 4166574 | Apparatus for marking identification symbols on wafer An apparatus for marking identification symbols on a wafer including: a marking means for marking identification symbols on the wafer; a reading means for reading the marked identification symbols; a comparing means for comparing data of the identificatio... | 09/04/1979 |
| 4127432 | Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same Chip type circuit elements are mounted on adhesive layers provided on predetermined positions of a printed circuit board by pushing up each circuit element stack inserted in a magazine which is vertically held just below the corresponding adhesive layer a... | 11/28/1978 |
| 4125252 | Power semiconductor assembly and the method and apparatus for assembly thereof A power semiconductor assembly in which two metallic heat sinks with inner planar surfaces clamp between these surfaces a housing of a power semiconductor therein at a set clamping pressure. The casing has planar surfaces against which the inner planar su... | 11/14/1978 |
| 4069924 | Methods and apparatus for positioning an article laterally on a support Subassemblies, comprising an integrated circuit bonded to a conductor pattern on a small ceramic substrate, are automatically bonded to lead frames. In carrying out this operation, each subassembly is placed on a support and precisely positioned thereon. ... | 01/24/1978 |
| 3972356 | Lead straightening, aligning, and spacing implement for an electronic semi-conductor package A combination lead straightening, lead aligning, and dielectric spacing implement for a semi-conductor package of the so-called TO (transistor outline) type. The implement has a generally annular body with hook-like formations or fingers spaced about the ... | 08/03/1976 |
| 3972100 | Transistor sequencer inserter apparatus An apparatus for selecting predesignated transistor components from a plurality of loading stacks, transporting them to a pickup position by a shuttle mechanism, transferring them to an insertion head collet member, inserting them into a circuit board and... | 08/03/1976 |
| 3969813 | Method and apparatus for removal of semiconductor chips from hybrid circuits A method and apparatus are disclosed for removal of defective semiconductor chips from hybrid integrated circuits. The apparatus includes a jet nozzle which directs at least four high pressure water jet streams to the area surrounding the defective chip. ... | 07/20/1976 |
| 3946484 | Continuous processing system A manufacturing system utilizing a plurality of satellite functional processing stations or sectors, each capable of stand-alone operation. The stations are interconnected by a handler or conveyor, which will transport individual ones of work-pieces from ... | 03/30/1976 |
| 3939558 | Method of forming an electrical network package A method of forming an electrical network package in which a B-stage thermosetting adhesive material is sandwiched between and adheres together a substrate bearing a network of electric circuit elements, and a protective superstrate. The component package... | 02/24/1976 |
