Bizarre Patents
Crispy Chip Sandwich and Process of Producing a Sandwich Product
A food product comprising a multilayer cookie or snack having outer layers formed from a crispy type edible food product such as a potato chip or corn chip, etc. with an intermediate marshmallow layer being in contact with the inner surface of each crispy chip and one or more filler substances.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8136820 | Electrostatic chuck with heater and manufacturing method thereof An electrostatic chuck with a heater includes: a base formed of a sintered body containing alumina; an ESC electrode provided in an upper portion side in the base; and a resistance heating body embedded in a lower portion side in the base. The base is composed of a ... | 03/20/2012 |
| 7850174 | Plasma processing apparatus and focus ring A plasma processing apparatus and a focus ring enables to perform uniform plasma processing over the entire surface of a substrate to be processed to thereby improve in-surface uniformity of plasma processing compared with conventional cases. The focus ring is dispo... | 12/14/2010 |
| 7442450 | Yttria sintered body, electrostatic chuck, and manufacturing method of yttria sintered body A yttria sintered body contains an amount of silicon carbide within a range of 5 to 40% by volume, has a volume resistivity at room temperature within a range of 1×101 to 1×1017 Ω·cm, and is adapted for application to an electrostatic chuck... | 10/28/2008 |
| 7431770 | Table device, film-forming apparatus, optical element, semiconductor element, and electric apparatus A table device for chucking a substrate includes a chucking unit including a porous body, and having a substrate chucking surface, and a conductive film which is disposed on the substrate chucking surface of the chucking unit, and which is grounded. ... | 10/07/2008 |
| 7422656 | Dry etching method and apparatus for use in the LCD device A dry etching step during the manufacturing of a substrate for a liquid crystal display (LCD) device is improved by placing the substrate at a predetermined distance away from the lower electrode to prevent damage of the substrate due to electrostatic formed therebe... | 09/09/2008 |
| 7416793 | Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same An electrostatic chuck comprises a dielectric ceramic layer made of an alumina sintered body having a volume resistivity equal to or greater than about 1×1017Ω·cm at room temperature and a volume resistivity equal to or greater than about 1×1014 | 08/26/2008 |
| 7393433 | Plasma processing apparatus, semiconductor manufacturing apparatus and electrostatic chucking unit used thereof A wiring member which becomes substantially symmetrical on the plane of an electrostatic chuck unit is connected to the tip end of an RF introduction rod between the RF introduction rod and the electrostatic chuck unit in order to make uniform generation of an elect... | 07/01/2008 |
| 7394640 | Electrostatic chuck and substrate fixing method using the same The electrostatic chuck 101 where pairs of electrodes 3a/3b, 4a/4b and 5a/5b to which voltages are applied are embedded in the main body 1, and where a substrate 110... | 07/01/2008 |
| 7387977 | Alumina-sintered body and associated manufacturing method, and electrostatic chuck and associated manufacturing method A binder is mixed to alumina powder with a purity of 99.5% or more (step S11), the mixture is granulated (step S12), resultant granule powder is formed with a die (step S13), and a formed compact is sintered in a hot-pressing manner (step S14... | 06/17/2008 |
| 7381293 | Convex insert ring for etch chamber A new and improved insert ring for a wafer support inside a processing chamber for the processing, particularly dry etching, of semiconductor wafer substrates. The insert ring includes a generally convex inner surface which faces the wafer support and defines a gap ... | 06/03/2008 |
| 7381673 | Composite material, wafer holding member and method for manufacturing the same A composite material according to the present invention, is composed of SiC, SiO2, at least one out of Al and Si, with He leak rate of 1.3×10−10 Pa·m3/sec or below, thereby providing a composite material, which has a higher vacuu... | 06/03/2008 |
| 7375947 | Method of feedback control of ESC voltage using wafer voltage measurement at the bias supply output In a plasma reactor having an electrostatic chuck, wafer voltage is determined from RF measurements at the bias input using previously determined constants based upon transmission line properties of the bias input, and this wafer voltage is used to accurately contro... | 05/20/2008 |
| 7367102 | Method for mounting object and spindle device A spindle device to mount and rotate an object, including: a housing; a main shaft supported by the housing rotatably to the housing wherein the main shaft includes a through hole which goes through from an end to the other end thereof, and an opening of the through... | 05/06/2008 |
| 7361230 | Substrate processing apparatus In the substrate processing apparatus, a ceramic module for mounting a substrate has a flat plate portion having an electric circuitry and a ceramic base body, and as at least a part of a surface of the flat plate portion other than the surface mounting the substrat... | 04/22/2008 |
| 7353979 | Method of fabricating substrate placing stage A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite... | 04/08/2008 |
| 7347975 | Bead dispensing system A bead dispensing system is provided for delivering small amounts of substances onto substrates. The system can include, for example, a movable support structure having an array of spaced-apart projections depending from its lower side. An attraction source, such as... | 03/25/2008 |
| 7331535 | Injection nozzle An injection nozzle for use in delivering fuel to a combustion space, the injection nozzle comprising a nozzle body, at least a part of which is provided with a first coating arranged so as to reduce the temperature of at least a part of the nozzle body, in use. The... | 02/19/2008 |
| 7331097 | Method of manufacturing a workpiece chuck A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers app... | 02/19/2008 |
| 7301623 | Transferring, buffering and measuring a substrate in a metrology system A chuck that clamps a substrate to the top surface using, e.g., a vacuum, electrostatic force, or other appropriate means, includes a plurality of lift pins that can raise the substrate off the top surface of the chuck. The chuck may be used with a metrology device ... | 11/27/2007 |
| 7288496 | Aluminum nitride sintered body and method of evaluation for the same An aluminum nitride sintered body is provided, including a polycrystalline structure in which grain boundary fracture toughness KICgb is 1.6 MPa·m1/2 or more. The grain boundary fracture toughness KICgb is dete... | 10/30/2007 |
| 7279108 | Method for the manufacture of printed circuit boards with plated resistors A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as... | 10/09/2007 |
| 7264676 | Plasma apparatus and method capable of adaptive impedance matching A plasma apparatus capable of adaptive impedance matching comprises a plasma reactor which can produce plasma to proceed with CVD (chemical vapor deposition) process, a bi-polar electrostatic chuck which locates inside the plasma reactor and is used to support and s... | 09/04/2007 |
| 7252872 | Joined structures of ceramics An object of the present invention is to provide a joined structure effective for preventing crack formation after thermal cycles. The joined structure has a ceramic member 1, a metal member 4 to be joined, and a metal fixed member 3 fixed to th... | 08/07/2007 |
| 7248456 | Electrostatic chuck An electrostatic chuck is provided which includes a circular ceramic plate having an electrostatic attractive electrode, a mounting surface for supporting a waferhich is formed on one of the main surfaces of the circular ceramic plate, an annular gas groove formed o... | 07/24/2007 |
| 7245357 | Lithographic apparatus and device manufacturing method A lithographic apparatus is disclosed. The lithographic apparatus includes an illumination system for providing a beam of radiation on a flat article to be placed in a beam path of the beam of radiation, and an article handler for handling the article during placeme... | 07/17/2007 |
| 7241346 | Apparatus for vapor deposition A stage has a plate, a first seal surface, a stem, a second seal surface, a cover, a conductor and a flow path. A heater is embedded in the plate. A terminal for supplying power to the heater is exposed at one surface of the plate. The first seal surface is provided... | 07/10/2007 |
| 7220319 | Electrostatic chucking stage and substrate processing apparatus This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chu... | 05/22/2007 |
| 7218503 | Method of determining the correct average bias compensation voltage during a plasma process A method for removing a substrate that is attached to a bipolar electrostatic chuck (ESC) by application of a bipolar ESC voltage is provided which includes discontinuing the bipolar ESC voltage after processing a current substrate, and determining a monopolar compo... | 05/15/2007 |
| 7211153 | Ceramic joined body, substrate holding structure and substrate processing apparatus A substrate holding structure having excellent corrosion resistance and airtightness, excellent dimensional accuracy and sufficient durability when mechanical or thermal stress is applied thereto is obtained. A holder (1) serving as the substrate holding stru... | 05/01/2007 |
| 7208067 | Method and system for monitoring RF impedance to determine conditions of a wafer on an electrostatic chuck A method and system for monitoring and/or controlling the conditions of a wafer on an electrostatic chuck during plasma processing. The method and system include utilizing backflow gas pressure and DC clamping voltage as control variables to adjust the wafer tempera... | 04/24/2007 |
| 7198276 | Adaptive electrostatic pin chuck Disclosed is an electrostatic chuck and system for maintaining a device flat within the electrostatic chuck. The electrostatic chuck has a plate, height adjustment mechanisms connected to the plate; and electrostatic chuck pins connected to the height adjustment mec... | 04/03/2007 |
| 7175737 | Electrostatic chucking stage and substrate processing apparatus This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chu... | 02/13/2007 |
| 7161662 | Lithographic apparatus, device manufacturing method, and device manufactured thereby A lithographic projection apparatus includes a radiation system for providing a beam of radiation, and a substrate holder. The substrate holder includes a plurality of protrusions for providing a substantially flat plane of support for supporting a substrate in a be... | 01/09/2007 |
| 7151658 | High-performance electrostatic clamp comprising a resistive layer, micro-grooves, and dielectric layer An electrostatic clamp for securing a semiconductor wafer during processing. The electrostatic clamp includes a base member, a first dielectric layer, a second dielectric layer having a gas pressure distribution micro-groove network formed therein, a gas gap positio... | 12/19/2006 |
| 7133273 | Electrostatic device for holding an electronic component wafer A device for holding a wafer, an electronic component comprises a system for transporting without deformation a wafer of electronic components. The device also enables the transport by one or the other of the passive or active faces. The device comprises a planar an... | 11/07/2006 |
| 7126808 | Wafer platen equipped with electrostatic clamp, wafer backside gas cooling, and high voltage operation capability for plasma doping An apparatus is provided for handling workpieces, such as semiconductor wafers, during semiconductor processing. The apparatus includes a wafer platen having a plurality of channels each extending from a top surface to a bottom surface of the wafer platen, a plurali... | 10/24/2006 |
| 7101510 | Matrix storage and dispensing system The present invention provides a system and process providing variable access to, as well as quick and accurate dispensing of, numerous selected reagents from a mass storage arrangement. According to one embodiment, an array of reagent dispensers is supported over a... | 09/05/2006 |
| 7092231 | Chuck, lithographic apparatus and device manufacturing method A lithographic projection apparatus is provided with an electrostatic chuck. The electrostatic chuck includes a dielectric element which has a plurality of pins formed on a first surface. The item to be clamped is clamped in position on the chuck by applying a poten... | 08/15/2006 |
| 7075772 | Electrostatic gripping device An electrostatic gripper for moving wafers includes bipolar electrodes with an insulating layer of zirconium oxide, which are positioned on a circuit board. The gripper is produced by a pressing process and can be operated with a DC voltage of less than 900 V. As a ... | 07/11/2006 |
| 7073417 | Combination screw driver and bit holder The present invention a combination screwdriver and bit holder for use with a drill chuck includes a shaft adapted at one end for releasably mounting to the drill chuck, and at the other end for releasably mounting tool bits therein; and, a housing connected operabl... | 07/11/2006 |
