Did You Know...
...that while attempting to develop a super strong glue, 3M employee Spencer Silver accidentally developed a glue that was so weak it would barely hold two pieces of paper together? However, his colleague Art Fry needed the glue. Fry sang with his church choir and marked the pages of his hymnal with small scraps of paper that often fell out. He used Silver's glue to hold the papers in place. Today we call this invention Post-it Notes.
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| Number | Title | Issue Date |
| 8158046 | Mold apparatus and method An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged... | 04/17/2012 |
| 8119050 | Method of manufacturing a semiconductor device Improvement in the yield of a semiconductor device is aimed at. When extruding a molded body with the ejector pin which performs advance-or-retreat movement at the projecting portion which projects from this bottom face in the bottom face of a mold cavity correspond... | 02/21/2012 |
| 8092735 | Method of making a light emitting device having a molded encapsulant Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, ... | 01/10/2012 |
| 8048358 | Pop semiconductor device manufacturing method The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and li... | 11/01/2011 |
| 8043545 | Methods and apparatus to evenly clamp semiconductor substrates Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate having a second surface opposite the first surface, and a plurality of ... | 10/25/2011 |
| 8003036 | Mold for forming a molding member and method of fabricating a molding member using the same There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. I... | 08/23/2011 |
| 7883655 | Molding apparatus for manufacturing a semiconductor device and method using the same A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which... | 02/08/2011 |
| 7842219 | Mold for forming a molding member and method of fabricating a molding member using the same There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. I... | 11/30/2010 |
| 7833456 | Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece are disclosed. A method in accordance with one aspect includes placing a semiconductor workpiece and an encapsulant in a mold cavity and driving some of the encapsulant from the mo... | 11/16/2010 |
| 7815836 | Packaging apparatus for optical-electronic semiconductors A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the encapsulating module. The bottom of the mold base has at least one air... | 10/19/2010 |
| 7622067 | Apparatus and method for manufacturing a semiconductor device An apparatus for manufacturing a semiconductor device includes an upper mold (21), a lower mold (22), and a plate (30, 130, 230) that includes at least one cavity (31) that receives resin and defines an outer shape and a thickness of a re... | 11/24/2009 |
| 7604765 | Electronic circuit device and manufacturing method of the same A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed... | 10/20/2009 |
| 7595017 | Method for using a pre-formed film in a transfer molding process for an integrated circuit A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape... | 09/29/2009 |
| 7501086 | Encapsulation method for leadless semiconductor packages An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically... | 03/10/2009 |
| 7419629 | Metal mold for forming, method for the preparation of the metal mold for forming and molded article obtained on forming by the metal mold for forming A molded article manufactured by a fixed mold used with a forming metal mold for molding synthetic resin includes a base mold, a first forming mold secured to the base mold and having a molding recess, and a second forming mold secured to the base mold as it is comb... | 09/02/2008 |
| 7407608 | Resin molding equipment and resin molding method The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section havin... | 08/05/2008 |
| 7402270 | Method and system for integrated circuit packaging According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfac... | 07/22/2008 |
| 7393489 | Mold die for molding chip array, molding equipment including the same, and method for molding chip array Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block wher... | 07/01/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7378455 | Molding composition and method, and molded article A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent c... | 05/27/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7364778 | Container for an electronic component A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electro... | 04/29/2008 |
| 7358599 | Optical semiconductor device having a lead frame and electronic equipment using same An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an ... | 04/15/2008 |
| 7357886 | Singular molded and co-molded electronic's packaging pre-forms Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded co... | 04/15/2008 |
| 7355278 | Mold die for a semiconductor device A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a ... | 04/08/2008 |
| 7303709 | Compression molding process A molded article is produced by a method of compression molding employing a specially shaped billet of thermoplastic material which is positioned at a predetermined location in a predetermined orientation with respect to the mold cavity surfaces of a mold part. In a... | 12/04/2007 |
| 7288440 | Method of manufacturing a semiconductor device For molding semiconductor chips on a wiring substrate matrix with a sealing resin, the wiring substrate matrix is placed on a lower die cavity block of a lower die, and, thereafter, an upper die is brought down, whereby an outer peripheral portion of a cavity of the... | 10/30/2007 |
| 7267791 | Method for the production of light-guiding LED bodies in two chronologically separate stages Disclosed is a method for producing light-guiding LED bodies in a mold, using a material that is flowable before becoming definitively solid. Each LED body comprises at least one light-emitting chip and at least two electrical connections that are connected to the c... | 09/11/2007 |
| 7264456 | Leadframe and method for reducing mold compound adhesion problems An integrated circuit leadframe has a pair of leadframe rails that are specially treated to adhere to injection mold compounds to a lesser or greater degree than portions of the leadframe rails outside of the treated areas. By adhering to mold compounds to a greater... | 09/04/2007 |
| 7265453 | Semiconductor component having dummy segments with trapped corner air A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such tha... | 09/04/2007 |
| 7255610 | Molded part and electronic device using the same An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and... | 08/14/2007 |
| 7253021 | Transfer molding apparatus and method for manufacturing semiconductor devices A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any... | 08/07/2007 |
| 7250687 | Systems for degating packaged semiconductor devices with tape substrates A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a first major surface of the packaged semiconductor device and includes a ... | 07/31/2007 |
| 7247267 | Mold and method of molding semiconductor devices A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner and a plurality of mold cavities. The first dummy runner connects with ... | 07/24/2007 |
| 7241414 | Method and apparatus for molding a semiconductor device A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface... | 07/10/2007 |
| 7239933 | Substrate supports for use with programmable material consolidation apparatus and systems A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substra... | 07/03/2007 |
| 7235423 | Molded memory card production using carrier strip Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the ... | 06/26/2007 |
| 7225537 | Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces Memory Cards containing Integrated Circuits and other electronic components (e.g. resistors) in a variety of form factors having high quality external surfaces of polycarbonate, synthetic paper (e.g. Teslin), or other suitable material (e.g. PVC) can be made through... | 06/05/2007 |
| 7224057 | Thermal enhance package with universal heat spreader A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat sprea... | 05/29/2007 |
| 7220119 | Pre-stressed tie rod and method of manufacture The present invention relates to a pre-stressed tie rod and method of manufacture. The pre-stressed tie rod can be used on injection molding machines to increase the length of the tie rod and movement of the platen, wherein the tie rods are loaded to restrict mold s... | 05/22/2007 |
