Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 8173056 | Method of fabricating an entity and corresponding device A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material (28) in a mold, and (26); personalizing the entity while in the mould (26). A corresponding device is also described.... | 05/08/2012 |
| 8119049 | Continuous injection molding processes and systems with retractable core Injection-molding processes and systems are described herein. An exemplary method involves: (a) holding one or more inserts in a desired position within a mold cavity by contacting a retractable core to at least a portion of each insert, wherein the retractable core... | 02/21/2012 |
| 8062571 | Resin sealing method in stacked wiring substrate A resin sealing device includes a lower die, an upper die which is arranged over the lower die, on a lower surface side of which a concave portion is provided, and to a bottom surface peripheral portion of the concave portion of which a projection portion projecting... | 11/22/2011 |
| 7910035 | Method and system for manufacturing integrated molded concentrator photovoltaic device A method for manufacturing an integrated solar cell and concentrator. The method includes providing a first photovoltaic region and a second photovoltaic region disposed within a first mold member. A second mold member is coupled to the first mold member to form a c... | 03/22/2011 |
| 7682544 | Method of fabricating photovoltaic panel A method of fabricating a photovoltaic panel is disclosed which is formed by arranging a number of granular photovoltaic devices in an array and forming the array into the shape of a panel from a transparent resin and includes each photovoltaic device having a part ... | 03/23/2010 |
| 7431875 | Process of preparing a unitized membrane electrode assembly using compression molding The invention provides a mold for use in a compression molding apparatus that has a frame part (41) with a hole through its center; a bottom plunger (42); and a top plunger (43); wherein the plungers are fabricated to fit substantially snugly in... | 10/07/2008 |
| 7405656 | Device and method for encapsulation and mounting of RFID devices This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmissi... | 07/29/2008 |
| 7402270 | Method and system for integrated circuit packaging According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfac... | 07/22/2008 |
| 7380333 | Chip resistor fabrication method A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer a... | 06/03/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7309919 | Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the... | 12/18/2007 |
| 7308752 | Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis direction, and tracking servo coils for moving the moveable unit containi... | 12/18/2007 |
| 7275925 | Apparatus for stereolithographic processing of components and assemblies An apparatus for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing. A double platen assembly including a first platen and a second platen... | 10/02/2007 |
| 7247521 | Semiconductor assembly encapsulation mold and method for forming same An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contai... | 07/24/2007 |
| 7243987 | Apparatus and method for noise reduction in a vehicle An area-reducing surface texture applied to a noise-prone portion of a vehicle panel or part where it makes contact with an unsecured length of wire harness, duct or other conduit. A plurality of small spaced structures is formed on or in the surface with their dist... | 07/17/2007 |
| 7217335 | Method of manufacturing a soft hearing aid A method of manufacturing a hearing aid preferably includes the steps of: placing a moldable material in the ear canal of a patient to cast a form; using the form to form a hollow shell with an outer surface that approximates the shape of the patient's ear canal, th... | 05/15/2007 |
| 7192807 | Wafer level package and fabrication method A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through t... | 03/20/2007 |
| 7173332 | Placement tool for wafer scale caps A tool is used to hold an array of wafer scale protective caps and place the array onto a semiconductor wafer. The tool comprises a first tool half made from a semiconductor which has a coefficient of thermal expansion which is about the same as that of the wafer. T... | 02/06/2007 |
| 7166252 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clampin... | 01/23/2007 |
| 7147447 | Plastic semiconductor package having improved control of dimensions A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The enc... | 12/12/2006 |
| 7144045 | Electrofusion socket forming system An electrofusion joint assembly includes a meltable member, such as a pipe or fitting, and a heating element secured to the pipe or fitting. The pipe or fitting may be tapered to facilitate receiving another pipe to form an electrofusion weld joint. Fasteners are us... | 12/05/2006 |
| 7138667 | High power light emitting diode An LED package is disclosed. The LED package comprises a base contact and a leadframe connected to the base contact. The leadframe includes an annular contact. An LED die is coupled to the base contact and the annular contact. A trim bezel is coupled to the leadfram... | 11/21/2006 |
| 7126216 | Two part mold for wafer scale caps The invention provides a two part mold for forming wafer scale caps. The mold has a first half and a second half. The first half and second half, when brought together defining mold cavities for wafer scale caps. The caps have central areas surrounded by sidewalls a... | 10/24/2006 |
| 7122404 | Techniques for packaging a multiple device component A technique for packaging multiple devices to form a multi-chip module. Specifically, a multi-chip package is coupled to an interposer to form the multi-chip module. The multi-chip package includes a plurality of integrated circuit chips coupled to a carrier. The ch... | 10/17/2006 |
| 7109057 | Sealing apparatus for semiconductor wafer and method of manufacturing semiconductor device by using sealing apparatus A sealing apparatus for a semiconductor wafer includes an upper mold and a lower mold. The lower mold includes a recess in which the semiconductor wader is placed, and a pot for introducing resin to the recess. The pot is located under a center area of the recess. T... | 09/19/2006 |
| 7094046 | Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead co... | 08/22/2006 |
| 7082728 | Electrical box for use with insulated concrete form building systems An electrical box for use with insulated concrete form building systems includes a main body having an electrical box cavity for housing electrical outlets, switches, and electrical connections. The insulated concrete form building systems utilize insulated forms to... | 08/01/2006 |
| 7073841 | Vehicle door including a seal or molding A vehicle door includes a door edge, a cable harness that powers electrical components, such as a window regulator inside the door, and runs along the door edge, and a seal or molding that masks the cable harness along the door edge. During assembly, a sub-assembly ... | 07/11/2006 |
| 7067905 | Packaged microelectronic devices including first and second casings The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to either a fi... | 06/27/2006 |
| 7055549 | Electrohydraulic valve assembly for controlling operation of engine cylinders A hydraulic valve assembly is provided to activate and deactivate cylinder valves of a multi-cylinder engine. A plurality of electrohydraulic valves are loosely received in openings in a base plate which allows the relative positions of the valve to adjust automatic... | 06/06/2006 |
| 7005101 | Virtual gate design for thin packages The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so... | 02/28/2006 |
| 7000317 | Method for manufacturing electrical connectors for enhancing coplanarity The present invention is a method for manufacturing an electrical connector comprising an insulative housing with a base side and an opposed side and lateral sides interposed between said base side and said opposed side and at least one conductive contact extending ... | 02/21/2006 |
| 6989121 | Method for encasing plastic array packages The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-o... | 01/24/2006 |
| 6977055 | Securing electrical conductors An elongated electrical cable or flexible circuit board includes an electrically conductive path and an insulating body encompassing and electrically isolating the conductive path, the insulating body including an exposed surface having an array of fastener elements... | 12/20/2005 |
| 6975025 | Semiconductor chip package and method of manufacturing same A semiconductor chip package, an electronic system, and a method of manufacturing such package. A lower structure includes a lower insulating layer and a metal layer made of separate electrical conductors. A wall defines a cavity on the metal layer. Electrical condu... | 12/13/2005 |
| 6949709 | Method for making a dashboard subassembly in paticular a motor vehicle dashboard console The invention concerns a method for making a dashboard subassembly comprising electrical and/or electronic components (1) connected to conductors (2) and attached to a rigid support (3). The invention is characterized in that it consists in: pro... | 09/27/2005 |
| 6911166 | Method of encapsulating hard disc drive and other electrical components A method for injection molding a layer of phase change material around a surface of a plurality of identical motor components or hard disc drive components which includes providing a plurality of motor components or hard disc drive components; placing a motor compon... | 06/28/2005 |
| 6893244 | Apparatus for encasing array packages The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back... | 05/17/2005 |
| 6858172 | Current sensor supporting structure An electrical switchgear device includes a conductor, a base, and a current sensor positioned to detect current in the conductor and attached to the base using a support element. The device also includes an apparatus mounted to the base to interrupt current through ... | 02/22/2005 |
