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| Number | Title | Issue Date |
| 7426780 | Method of manufacturing a power module A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placi... | 09/23/2008 |
| 7405656 | Device and method for encapsulation and mounting of RFID devices This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmissi... | 07/29/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7378455 | Molding composition and method, and molded article A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent c... | 05/27/2008 |
| 7363704 | RFID tag and method of manufacturing RFID tag A method of manufacturing an RFID tag includes forming through-holes on a sheet to embed a plurality of electronic components, such as IC chips; forming a substrate by sticking a bottom plate sheet to the sheet, and forming recesses; embedding the electronic compone... | 04/29/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7359144 | Overmold component seal in an electronic device housing In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for ... | 04/15/2008 |
| 7357886 | Singular molded and co-molded electronic's packaging pre-forms Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded co... | 04/15/2008 |
| 7339201 | Light emitting diode and process for producing the same A light emitting diode includes a casing having a concave surface, a reflecting surface formed by depositing a metallic layer on a concave surface thereof, and a lead having a light emitting element fitted thereto so as to confront the reflecting surface. A cationic... | 03/04/2008 |
| 7329388 | Electrophoresis apparatus having staggered passage configuration An electrophoresis apparatus is generally disclosed for sequentially analyzing a single sample or multiple samples having one or more analytes in high or low concentrations. The apparatus comprises a relatively large-bore transport capillary which intersects with a ... | 02/12/2008 |
| 7323767 | Standoffs for centralizing internals in packaging process A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrat... | 01/29/2008 |
| 7300615 | High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials An electrical component in the form of an inductor or transformer is disclosed which includes one or more coils and a magnetic polymer material located near the coils or supporting the coils to provide an electromagnetic interaction therewith. The magnetic polymer m... | 11/27/2007 |
| 7271513 | Thermal stress relieved overmolded mounting base A method of manufacturing and an overmolded mounting base. A plate is provided with mounting surfaces having a range of alignments including a nominal alignment. The plate is overmolded to form an overmolded plate. The overmolding changes the alignment of the mounti... | 09/18/2007 |
| 7247060 | Plate fitted resin molded article and method of molding it A hydraulic switch body (1) has a metal plate (10) and a resin main portion (20) molded on a first surface (13) of the metal plate (10). A hydraulic switch (2) and busbar circuits (30) are mounted in recesses (21 | 07/24/2007 |
| 7227109 | Microwave ovens The oven cavity (1) of a microwave oven includes an apertured launch wall (3) on the external side of which a launch box (5) is mounted so as to cover the aperture. Two three or four magnetrons supply microwave energy to the launch box (5... | 06/05/2007 |
| 7211215 | Mould, encapsulating device and method of encapsulation The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising: at least two mould parts displaceable relative to each other, at least one of which is provided with a recess, and feed means for encapsulating material, where... | 05/01/2007 |
| 7180395 | Encapsulated package for a magnetic device An encapsulatable package for a magnetic device that includes a magnetic core. In one embodiment, the encapsulatable package for the magnetic device includes a shielding structure located about the magnetic core configured to create a chamber thereabout and configur... | 02/20/2007 |
| 7166252 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clampin... | 01/23/2007 |
| 7122102 | Electrochemical sensor An electrochemical sensor with a capillary channel is formed by placing a sacrificial insert on a sensor base and applying casting material. After the casting material is cured, the sacrificial is removed leaving a capillary channel in the sensor. The insert may be ... | 10/17/2006 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an inte... | 09/26/2006 |
| 7077990 | High-density, thermally-conductive plastic compositions for encapsulating motors A method for making a stator assembly having a thermally-conductive, plastic housing for a high speed motor is provided. A thermally-conductive, high-density polymer composition is used to make the housing, and the stator is uniformly encapsulated therein. The polym... | 07/18/2006 |
| 7060520 | Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device The invention provides a method of sealing piezoelectric devices with covers capable of rapidly and securely sealing a plurality of packages or many packages of piezoelectric devices with covers. A piezoelectric device includes a package in which a piezoelectric vib... | 06/13/2006 |
| 7061085 | Semiconductor component and system having stiffener and circuit decal A semiconductor component includes a stiffener, a circuit decal attached to the stiffener, and a semiconductor die attached to the stiffener. The circuit decal includes conductors which function as an internal signal transmission system for the component, and a mask... | 06/13/2006 |
| 7056770 | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, t... | 06/06/2006 |
| 7047626 | Encapsulated electrically resistive heater Electrically resistive heating element, with metal strip electrodes secured thereto, and with electrical wires secured to said metal strip electrodes, is encapsulated with thermoset-molding compound. ... | 05/23/2006 |
| 7037455 | Insert molding method A method of insert molding a preformed item into a molded product, the molded product being formed by injecting a moldable material into a mold, is disclosed. The method includes adhering the preformed item to a surface of the mold with an adhesive, wherein the surf... | 05/02/2006 |
| 7026170 | Methods of controlling optical properties of a capping insulating layer on memory devices, and system for performing same The present invention is generally directed to various methods of controlling optical properties of a capping insulating layer on memory devices, and system for performing same. The method includes forming a first capping layer that includes at least one process lay... | 04/11/2006 |
| 7005101 | Virtual gate design for thin packages The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point outside of the area of the finished package, but within the dam bars, so... | 02/28/2006 |
| 6989121 | Method for encasing plastic array packages The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-o... | 01/24/2006 |
| 6896837 | Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length An apparatus and method for controlling the surface level of a liquid residing within a relatively vertically stationary workpiece support platform disposed within a reservoir for use in stereolithographic processes wherein a layered object or structure is formed by... | 05/24/2005 |
| 6852263 | Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight;... | 02/08/2005 |
| 6830719 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clampin... | 12/14/2004 |
| 6696005 | Method for making a polishing pad with built-in optical sensor An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects... | 02/24/2004 |
| 6652795 | Production method for semiconductor devices using resin molding mold A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air ... | 11/25/2003 |
| 6643909 | Method of making a proximity probe Method of making a proximity probe including providing a preform having an interior cavity accessible by an opened rearward end; coupling a coil to the preform proximate a forward most end of the preform for defining an assembly; locating a single support... | 11/11/2003 |
| 6616880 | Method for encasing array packages The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. A buffer member, optionally... | 09/09/2003 |
| 6544466 | Surface modification method for molds used during semiconductor device fabrication Surface modifications of a mold used during semiconductor device fabrication provide non-stick characteristics and a mold surface that is resistant to abrasion or wear. Such surface modifications are particularly useful in a mold having a quartz planar su... | 04/08/2003 |
| 6537482 | Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography A method for underfilling and encapsulating flip-chip configured semiconductor devices mounted on a carrier substrate using stereolithography (STL) to form, in situ, at least semisolid dam structures of photopolymeric material about the devices to entrap ... | 03/25/2003 |
| 6531083 | Sproutless pre-packaged molding for component encapsulation A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die... | 03/11/2003 |
| 6527999 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least ... | 03/04/2003 |
