Bizarre Patents
A helium-filled sun shade for protecting individuals engaged in outdoor activities.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8105524 | Compression molding method for electronic component and compression molding apparatus employed therefor First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a c... | 01/31/2012 |
| 8043544 | Method of manufacturing an encapsulated package for a magnetic device A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The met... | 10/25/2011 |
| 8038919 | Method of manufacturing film antenna using sputtering process A method of manufacturing a film antenna includes: preparing a carrier film formed of an insulation polymer material; forming an antenna radiator on at least one side of the carrier film by one of sputtering and deposition; inserting the carrier film with the antenn... | 10/18/2011 |
| 8007704 | Insert molded actuator components The present invention relates to electrostatically actuated device components and methods of making the same. In an embodiment, the invention includes a method of making an electrostatically actuated device component including providing a multilayered structure comp... | 08/30/2011 |
| 7922953 | Method for manufacturing an end effector assembly A method of manufacturing a jaw member of an end effector assembly for use with an electrosurgical instrument is disclosed that includes the steps of providing an electrically conductive tissue engaging plate and a jaw support; covering one side of the electrically ... | 04/12/2011 |
| 7850893 | Molded plastic container and preform having insert-molded RFID tag An RFID assembly includes an RFID inlay, with an RFID tag, encapsulated within a plastic housing. The housing has a peripheral array of flexible resilient fingers for mounting the housing within a pocket on a support structure, such as a pocket on a mold core. The p... | 12/14/2010 |
| 7776247 | Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiri... | 08/17/2010 |
| 7628948 | Alternate vent hole sealing method A method of assembling and sealing a circuit board within a housing includes the steps of placing the circuit board within the housing, filling the space above the circuit board or around the circuit board with a potting material, and then exhausting that cavity of ... | 12/08/2009 |
| 7572402 | Method of overmolding circuit A method is provided for the punching of a bridge break and thereafter sealing the bridge break during the injection molding process of the lead frame. The bridge breaking tool is placed over the bridge that is to be broken. The collar presses down on the circuit an... | 08/11/2009 |
| 7429800 | Molding composition and method, and molded article A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica... | 09/30/2008 |
| 7405656 | Device and method for encapsulation and mounting of RFID devices This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmissi... | 07/29/2008 |
| 7381358 | Polyester resin and resin composition for molding, and formed product thereof In a saturated polyester resin or a composition with the saturated polyester resin as the main component for molding, the melt viscosity at 200° C. is at least 5 dPa·s and not more than 1000 dPa·s, and the product a×b is at least 500 where a (N/cm2) i... | 06/03/2008 |
| 7381359 | Method for making filled epoxy resin compositions An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavele... | 06/03/2008 |
| 7378455 | Molding composition and method, and molded article A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent c... | 05/27/2008 |
| 7373719 | Method and process for manufacturing a terminal block A method of manufacturing a terminal block for a telecommunication cable comprising the steps of providing a mold having a first half and a second half, each forming a respective body cavity configured to form a terminal block and configured to receive a substrate c... | 05/20/2008 |
| 7370402 | Method for producing stator packs for long-stator linear motors of magnetic levitation railways A method for producing stator packs for long-stator linear motors of magnetic levitation vehicles is described. At first steel sheets are stacked to form a sheet stack, cross members are inserted into grooves of the sheet stack and the sheet stack and the cross memb... | 05/13/2008 |
| 7368663 | Anaerobic wire connector sealant and moisture resistant wire connector containing the same A waterproof electrical connection includes a wire connector including a housing having a cavity and an insert having a surface adapted for receiving at least two metallic wires disposed within the cavity of the housing; at least two metallic wires having exposed me... | 05/06/2008 |
| 7364684 | Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are ... | 04/29/2008 |
| 7357886 | Singular molded and co-molded electronic's packaging pre-forms Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded co... | 04/15/2008 |
| 7359144 | Overmold component seal in an electronic device housing In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for ... | 04/15/2008 |
| 7355278 | Mold die for a semiconductor device A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a ... | 04/08/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7347963 | Method of molding resin to protect a resolver winding At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7 | 03/25/2008 |
| 7310219 | Electrochemical capacitor The present invention relates to an electrochemical capacitor, and provides an electrochemical capacitor which has a fully lowered internal resistance and can yield excellent charging/discharging characteristics. The electrochemical capacitor of the present inventio... | 12/18/2007 |
| 7308752 | Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis direction, and tracking servo coils for moving the moveable unit containi... | 12/18/2007 |
| 7291657 | Ultraviolet light curing compositions for composite repair An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine... | 11/06/2007 |
| 7291303 | Method for bonding a transmission line to a downhole tool An apparatus for bonding a transmission line to the central bore of a downhole tool includes a pre-formed interface for bonding a transmission line to the inside diameter of a downhole tool. The pre-formed interface includes a first surface that substantially confor... | 11/06/2007 |
| 7291656 | Ultraviolet light curing compositions for composite repair An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine... | 11/06/2007 |
| 7276542 | Ultraviolet light curing compositions for composite repair An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine... | 10/02/2007 |
| 7262363 | Electric wire protective cap The present invention is to provide an electric wire protective cap. The protective cap can be formed easily by a resin molding and prevents a seal material from leaking and improves waterproof. The protective cap includes a cap main body with a bottom, and a cover ... | 08/28/2007 |
| 7261851 | Personal hygiene article with vibrating part and method A personal hygiene article, such as a toothbrush, includes a handle configured to accommodate an electric power source, a head carrying a treatment tool, and a neck between the handle and the head. The head or neck includes a mechanical motorized vibratory device, i... | 08/28/2007 |
| 7247266 | Lubricating coating and application process for elastomeric electrical cable accessories This invention relates to a method for coating an elastomeric component with a coating that has a low coefficient of friction and the articles formed by the method. The method includes preparing an elastomeric coating; applying the coating to a substrate; contacting... | 07/24/2007 |
| 7248133 | Method for manufacturing surface acoustic wave device A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing ... | 07/24/2007 |
| 7237724 | Smart card and method for manufacturing a smart card A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board,... | 07/03/2007 |
| 7234234 | Method of manufacturing bandpass filters for GHz bands Disclosed is a method of manufacturing a BPF (bandpass filter) for GHz bands of the structure that an input signal line (2) and an output signal line (3) run with a small gap on one surface of a sheet (1) made by dispersing soft magnetic metal p... | 06/26/2007 |
| 7232953 | Insulation cap and joined electrical wire using the same An insulation cap of a wire joint of a joined electrical wire, the insulation cap including a cap main body for receiving the wire joint being formed by joining cores of a plurality of covered wires and an electro-conductive sleeve, and a flexible fastener provided ... | 06/19/2007 |
| 7225536 | Precasting multi-layer PCB process A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recess... | 06/05/2007 |
| 7219421 | Method of a coating heat spreader A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PC... | 05/22/2007 |
| 7219416 | Method of manufacturing a magnetic element The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 Ω·cm. W... | 05/22/2007 |
| 7217999 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from ... | 05/15/2007 |
