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| Number | Title | Issue Date |
| 7439552 | Semiconductor light-emitting device and method for fabricating the same A semiconductor light-emitting device includes a light-emitting layer and a light extraction layer formed on the light-emitting layer and made of a resin material containing particles. The maximum size of each of the particles contained in the light extraction layer... | 10/21/2008 |
| 7436000 | Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to... | 10/14/2008 |
| 7423294 | Semiconductor light-emitting device A semiconductor light-emitting device includes: a semiconductor light-emitting element including a first conductive type semiconductor layer, an active layer including a light-emitting region, and a second conductive type semiconductor layer in this order; a filter ... | 09/09/2008 |
| 7423297 | LED extractor composed of high index glass An LED extractor has an input surface adapted to optically couple to an emitting surface of an LED die, and is composed of a glass (including a glass-ceramic) material whose refractive index is at least 2, or at least 2.2. ... | 09/09/2008 |
| 7399995 | Backlight module for liquid crystal display A backlight module includes a base, a plurality of point light sources distributed on the base and a light guide plate. Each of the point light sources includes a transparent cover and a light-emitting unit received in the cover. The transparent cover includes an in... | 07/15/2008 |
| 7375382 | Direct optical light guide An optical light guide has a substantially rigid light transmissive body having an input window, a distal end, a front side, and a rear side. The light transmissive body has a substantially smooth exterior surface on the front side and a substantially clear and soli... | 05/20/2008 |
| 7372120 | Methods and apparatus to optically couple an optoelectronic chip to a waveguide Methods and apparatus to optically couple an optoelectronic chip to a waveguide are disclosed. A disclosed apparatus includes a substrate, a waveguide mounted on the substrate and an optoelectronic chip bonded to the substrate and having an optical element directly ... | 05/13/2008 |
| 7355210 | High-efficiency light-emitting element A high-efficiency light-emitting element includes a substrate, a first nitride semiconductor layer formed on the substrate, a nitride light-emitting layer formed on the first nitride semiconductor layer, and a second nitride semiconductor layer formed on the nitride... | 04/08/2008 |
| 7341879 | Method of manufacturing a point source light-emitting diode A point source light emitting-diode (LED) comprises a substrate, an epitaxy structure, a first electrode, an isolation layer, a bonding layer, a contact layer, and a connection bridge. The epitaxy structure is located on the substrate, and the substrate has a patter... | 03/11/2008 |
| 7339197 | Light emitting diode and fabrication method thereof A light emitting diode. The light emitting diode comprises a lead frame, a plurality of light emitting chips in the lead frame, and a molding unit in an optical path of the light emitting chips, wherein the molding unit comprises a periodic microstructure. ... | 03/04/2008 |
| 7329904 | LED lamp device An LED lamp device includes a light emitting element that emits light in a blue-based or violet-based color, an LED having a fluorescent material that emits fluorescent light in a yellow to yellow-green-based color in response to light received from the light emitti... | 02/12/2008 |
| 7321137 | RGB light emitting diode package with improved color mixing properties An RGB light emitting diode package with improved color mixing properties includes red, green, and blue light emitting diode chips provided on a reflector. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light... | 01/22/2008 |
| 7319244 | Lens assembly for sideward light emission A lens assembly for sideward light emission includes a lens and a lens cap. The lens has a cup portion, an open end portion, and first and second refracting portions. The cup portion surrounds a light source. The open end portion defines an opening. The first refrac... | 01/15/2008 |
| 7319248 | High brightness light emitting diode The present invention discloses a high brightness light emitting diode. The light emitting diode primarily includes a permanent substrate, a reflective mirror formed on said permanent substrate, an n-type cladding layer formed on said reflective mirror, and defining... | 01/15/2008 |
| 7309882 | Surface light source with photonic crystal LED A backlight system (20) includes a light guide plate (220), a reflector (230) disposed below the light guide plate, and an LED (210) emitting light beams into the light guide plate. The LED includes an LED chip (213), which has a b... | 12/18/2007 |
| 7307288 | Semiconductor device and manufacturing method thereof A semiconductor device capable of incorporating an element configured to accept and emit light having a short wavelength and a manufacturing method thereof are provided. A semiconductor element is housed in an enclosure which includes a bottom portion and side porti... | 12/11/2007 |
| 7294866 | Flip-chip light-emitting device with micro-reflector A Flip-chip light-emitting device with integral micro-reflector. The flip-chip light-emitting device emits reflected light provided by a light-emitting layer. The micro-reflector reflects light that might otherwise be lost to internal refraction and absorption, so a... | 11/13/2007 |
| 7291864 | Single or multi-color high efficiency light emitting diode (LED) by growth over a patterned substrate A single or multi-color light emitting diode (LED) with high extraction efficiency is comprised of a substrate, a buffer layer formed on the substrate, one or more patterned layers deposited on top of the buffer layer, and one or more active layers formed on or betw... | 11/06/2007 |
| 7279720 | Large bumps for optical flip chips The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer. ... | 10/09/2007 |
| 7279345 | Method of forming light emitting devices with improved light extraction efficiency A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applyin... | 10/09/2007 |
| 7256428 | Optoelectronic component and method for the production thereof In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). Th... | 08/14/2007 |
| 7227193 | Solid-state image sensor with micro-lenses for preventing shading A solid-state image sensor prevents shading while maintaining the wide dynamic range of an image signal without reducing its resolution. The image sensor has its photodiode array including arrangement patterns, each of which includes a smaller micro-lens and larger ... | 06/05/2007 |
| 7217583 | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension Semiconductor light emitting devices are fabricated by placing a suspension including phosphor particles suspended in solvent on at least a portion of a light emitting surface of a semiconductor light emitting element, and evaporating at least some of the solvent to... | 05/15/2007 |
| 7172911 | Deflectable microstructure and method of manufacturing the same through bonding of wafers A method of making a deflectable, free hanging micro structure having at least one hinge member, the method includes the steps of providing a first sacrificial wafer having a single crystalline material constituting material forming the micro structure. A second sem... | 02/06/2007 |
| 7161189 | LED package including a frame A power LED package module includes a frame, a chip heat-conductive support, a light-emitting chip and a package body. The frame has a conductive pin, and a support separated from the conductive pin and connecting to the chip heat-conductive support. The light-emitt... | 01/09/2007 |
| 7148516 | Color-tunable light emitter The color-tunable light emitter has a first electrode and a light-generating layer adjacent the first electrode. The light-generating layer is operable to generate light in a band of wavelengths. The color-tunable light emitter also includes an electro-optical layer... | 12/12/2006 |
| 7144748 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 12/05/2006 |
| 7138663 | Color separation device of solid-state image sensor A microlens condenses incident light to an opening. Light passed through the opening reaches a first dichroic mirror. The first dichroic mirror passes blue light and reflects green and red light. Only the blue light is incident on a first light receiving surface. Th... | 11/21/2006 |
| 7122391 | Wafer-level test structure for edge-emitting semiconductor lasers Wafer-level stage testing of semiconductor lasers can be facilitated by directing a light beam emitted from the semiconductor laser toward a direction different from a path of the light beam as originally emitted from the laser. A test structure can be coupled to a ... | 10/17/2006 |
| 7105858 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 09/12/2006 |
| 6649440 | Aluminum indium gallium nitride-based LED having thick epitaxial layer for improved light extraction A light-emitting diode (LED) and a method of making the device utilize a thick multi-layered epitaxial structure that increases the light extraction efficiency of the device. The LED is an aluminum-gallium-indium-nitride (AlGaInN)-based LED. The thick ... | 11/18/2003 |
| 6646289 | Integrated circuit device An integrally packaged optronic integrated circuit device (310) including an integrated circuit die (322) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechan... | 11/11/2003 |
| 6624505 | Packaged integrated circuits and methods of producing thereof This invention discloses a packaged integrated circuit including an integrated circuit substrate lying in a substrate plane and having electrical circuitry formed thereon, a package enclosing the integrated circuit substrate and defining first and second ... | 09/23/2003 |
| 6617615 | Semiconductor light-emitting device Attempted is to provide a semiconductor light-emitting device capable of inexpensively coping with an encoder requiring high resolving power. Provided are a semiconductor light-emitting element, a light-transmissive resin mold part encapsulating the semic... | 09/09/2003 |
| 6614055 | Surface light-emitting element and self-scanning type light-emitting device A surface light-emitting element having improved external light emission efficiency and a self-scanning light-emitting device using this surface light-emitting element are provided. To improve external light-emission efficiency, the light-emitting center ... | 09/02/2003 |
| 6420198 | Gallium nitride based compound semiconductor laser and method of forming the same A semiconductor device and method of forming a current block layer structure includes the steps of providing dielectric stripe masks defining at least a stripe-shaped opening on a surface of a compound semiconductor region having a hexagonal crystal struc... | 07/16/2002 |
| 6399409 | Method for fabricating semiconductor light emitting element The semiconductor light emitting element of the present invention includes: a compound semiconductor substrate having a first conductivity type; a light emitting layer; a compound semiconductor interface layer having a second conductivity type and not con... | 06/04/2002 |
| 6316792 | Compound semiconductor light emitter and a method for manufacturing the same A compound semiconductor light emitting element includes a light emitting region formed by a pn-junction between a first compound semiconductor layer of a first conductivity type and a second compound semiconductor layer of a second conductivity type. A f... | 11/13/2001 |
| 6298079 | Gallium nitride type laser for emitting blue light In a semiconductor laser which uses a semiconductor of GaN type compound, an optimum material is used for a current blocking layer, so that it is made possible to obtain a semiconductor laser that satisfies a gain guiding structure of high light emitting ... | 10/02/2001 |
| 6284559 | Gallium nitride group compound semiconductor light-emitting device and method for fabricating the same A gallium nitride group compound semiconductor light-emitting device comprises a substrate and a layered structure provided on the substrate. The layered structure includes: an active layer; an upper cladding layer and a lower cladding layer which is loca... | 09/04/2001 |
