Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Number | Title | Issue Date |
| 7436000 | Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to... | 10/14/2008 |
| 7436002 | Surface-mountable radiation-emitting component A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip. ... | 10/14/2008 |
| 7432119 | Light emitting diode with conducting metal substrate Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer epitaxial structure; removing the carrier substrate. ... | 10/07/2008 |
| 7420216 | Reflection type light-emitting diode device A reflection type light-emitting diode device of a kind capable of emitting rays of light to the outside after having been reflected by a reflecting surface includes a recessed casing (22) having a cavity defining the reflecting surface (15) and also h... | 09/02/2008 |
| 7417324 | Semiconductor device and method for manufacturing the same A semiconductor device is composed of a semiconductor chip, aluminum pads formed on the semiconductor chip, alloy ball bumps, which are formed on the aluminum pads, containing gold and Pd, and gold wires, which are connected to the alloy ball bumps, having a surface... | 08/26/2008 |
| 7390733 | Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode To enhance bonding accuracy of a bump electrode, while coping with narrowing pitch of the bump electrodes, a protruding electrode, whose leading end is sharpened, is provided to a semiconductor chip, and the protruding electrode is bonded to a lead electrode, while ... | 06/24/2008 |
| 7391101 | Semiconductor pressure sensor A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a... | 06/24/2008 |
| 7372082 | Submount substrate for mounting light emitting device and method of fabricating the same A submount substrate for mounting a light emitting device and a method of fabricating the same, wherein since a submount substrate for mouthing a light emitting device in which a Zener diode device is integrated can be fabricated by means of a silicon bulk micromach... | 05/13/2008 |
| 7361937 | White-light emitting device and the use thereof A white-light emitting device includes a first die and a second die. The first die has a first semiconductor light-emitting layer emitting a first primary color light. The second die has a second semiconductor light-emitting layer emitting a second primary color lig... | 04/22/2008 |
| 7351611 | Method of making the mould for encapsulating a leadframe package A mould for encapsulating an integrated circuit package on a leadframe including a top mould-half and a complementary bottom mould-half enclosing a cavity for encapsulating said package wherein structures are provided on at least one of said mould-halves which, upon... | 04/01/2008 |
| 7352058 | Methods for a multiple die integrated circuit package Methods for a multiple die package for integrated circuits are disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and vias formed later. At least one integrated circuit is provided and ele... | 04/01/2008 |
| 7329905 | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the... | 02/12/2008 |
| 7297988 | Flip chip type nitride semiconductor light emitting device The present invention relates to a flip chip type nitride semiconductor light emitting device having p-type and n-type nitride semiconductor layers, and an active layer in between. The invention also has an ohmic contact layer formed on the p-type nitride semiconduc... | 11/20/2007 |
| 7271425 | Optoelectronic component The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending ... | 09/18/2007 |
| 7262438 | LED mounting having increased heat dissipation There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat ... | 08/28/2007 |
| 7259402 | High efficiency group III nitride-silicon carbide light emitting diode A method and resulting structures are disclosed for fabricating a high efficiency high extraction light emitting diode suitable for packaging. The method includes the steps of adding a light emitting active portion of wide-bandgap semiconductor material to a conduct... | 08/21/2007 |
| 7253447 | Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base ... | 08/07/2007 |
| 7221052 | Chip scale package with micro antenna and method for manufacturing the same A chip scale package with micro antenna includes a chip, a first dielectric layer and an antenna. The chip has an active surface, a first bonding pad and a second bonding pad on the active surface. The first dielectric layer is formed on the active surface of the ch... | 05/22/2007 |
| 7220608 | Transferring semiconductor crystal from a substrate to a resin A semiconductor crystal layer formed by epitaxial growth on a seed crystal substrate is embedded in an insulating material in the condition where the seed crystal substrate is removed, electrodes are provided respectively on a first surface of the semiconductor crys... | 05/22/2007 |
| 7217956 | Light active sheet material Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side.... | 05/15/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7180161 | Lead frame for improving molding reliability and semiconductor package with the lead frame A lead frame for improving molding reliability and a semiconductor package with the lead frame are proposed. At least one embossed structure, such as a metal bump or recessed portion, is formed on a bonding layer of a wire-bonding area of the lead frame. At least on... | 02/20/2007 |
| 7161190 | Semiconductor light-emitting device and method of manufacturing the same A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the firs... | 01/09/2007 |
| 7144748 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 12/05/2006 |
| 7112824 | Light-emitting diode array A light-emitting diode array comprising a conductive layer formed on a substrate, pluralities of separate light-emitting portions formed on the conductive layer, a first groove formed in the conductive layer to divide the light-emitting portions to blocks, first ele... | 09/26/2006 |
| 7105858 | Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during... | 09/12/2006 |
| 7067848 | High intensity LED A High Intensity LED is disclosed to include a metal base, which has a through hole extending between the top and bottom surfaces thereof and a first electrode formed integral with and downwardly extending from the bottom surface, a second electrode inserted through... | 06/27/2006 |
| 6700692 | Electrochromic rearview mirror assembly incorporating a display/signal light According to one embodiment of the present invention, an electrochromic rearview mirror assembly for a vehicle includes an electrochromic mirror having a variable reflectivity, a glare sensor for sensing levels of light directed towards the front element ... | 03/02/2004 |
| 6700136 | Light emitting device package A light emitting device (LED) package comprises: a thermally conductive layer; an electrically insulating layer having openings extending therethrough; LEDs situated within the openings of the electrically insulating layer and including contact pads; and ... | 03/02/2004 |
| 6693304 | Laminated lead frame, and optical communication module and method of manufacturing the same The optical communication module comprises a laminated lead frame composed of a plurality of lead frames that are laminated and held by a tie bar made of an insulating material, and an optical communication functional unit that is disposed on at least one... | 02/17/2004 |
| 6677707 | Side-emitting surface mounted light emitting diode A unique side mounted LED and side sensing photo-transistor with free-end contacts, useful for thin profile side and back lighting and low-profile touch screen photo-circuits, and a method of manufacturing the side mounted side emitting or sensing photo c... | 01/13/2004 |
| 6677614 | Semiconductor light-emitting device and method for manufacturing the device A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor light-emitting element of the upper end of another lead, and ... | 01/13/2004 |
| 6670207 | Radiation emitter device having an integral micro-groove lens The radiation emitter device of the present invention includes at least two radiation emitters emitting radiation of different wavelengths, first and second electrical leads electrically coupled to at least one of the radiation emitters, and an encapsulan... | 12/30/2003 |
| 6670751 | Light emitting diode, light emitting device using the same, and fabrication processes therefor Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic s... | 12/30/2003 |
| 6667497 | LED package A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connecti... | 12/23/2003 |
| 6652123 | Light emitting diode display having heat sinking circuit rails An LED display panel are mounted with an array of LEDs on a number of metallic partitions, serving as common electrodes foil a line of LEDs as well as heat sinks. Another number of rails serve as common electrodes for another line of LEDs. The metallic pa... | 11/25/2003 |
| 6650048 | Ventilated light emitting diode matrix panel LEDs of a light matrix display are mounted between two metal frames. Each frame has air ducts to circulate air around the LEDs, thereby removing the heat generated in the LEDs and allowing higher intensity light to be emitted.... | 11/18/2003 |
| 6642072 | Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor A GaN-based LED element 1 having a double heterostructure, which includes a GaN layer and the like and is formed on a sapphire substrate, is mounted face-down on a Si diode element 2 formed in a silicon substrate. Electrical connections are provided via A... | 11/04/2003 |
| 6642618 | Light-emitting device and production thereof A light-emitting device comprises a substrate, electrical terminals disposed on a top side of the substrate, and a light-emitting semiconductor device disposed above the substrate. The light-emitting semiconductor device has a bottom side oriented to face... | 11/04/2003 |
| 6627482 | Mass production technique for surface mount optical device with a focusing cup Surface mount diodes are mass produced by first cutting a metal plate to form a plurality of vertical slits within metal plate. Parallel lines are cut midway between the slits to form wings for the slits. The wings are folded to form the bottoms for surfa... | 09/30/2003 |
