Quotables
"The Americans have need of the telephone, but we do not. We have plenty of messenger boys."
Sir William Preece, chief engineer, British Post Office ; 1878
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7435998 | Semiconductor device, method of manufacturing the same, electro-optic device and electronic apparatus with a protective film The invention provides a semiconductor device, a method of manufacturing the same, an electro-optic device and an electronic apparatus which are capable of addressing or solving a problem of mechanical mounting of a semiconductor element chip on a substrate. A semic... | 10/14/2008 |
| 7436002 | Surface-mountable radiation-emitting component A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip. ... | 10/14/2008 |
| 7414269 | Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a numbe... | 08/19/2008 |
| 7411225 | Light source apparatus A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well... | 08/12/2008 |
| 7405433 | Semiconductor light emitting device A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encap... | 07/29/2008 |
| 7390684 | Light emitting apparatus and method of manufacturing the same A light emitting apparatus comprising a light emitting device (101) disposed on a supporting body (105), and coating layers ((108, 109) that bind a fluorescent substance that absorbs light emitted by the light emitting device (101) and em... | 06/24/2008 |
| 7368754 | Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus The invention provides a semiconductor integrated circuit which allows a plurality of devices to be integrated compactly, that is, with high density; a signal transmitting device; an electro-optical device; and an electronic apparatus. A semiconductor integrated cir... | 05/06/2008 |
| 7368307 | Method of manufacturing an OLED device with a curved light emitting surface A method of manufacturing an OLED device with a curved light-emitting surface comprising: a) forming a flexible substrate and providing the flexible substrate in a flat configuration; b) forming one or more OLEDs having a first electrode, one or more l... | 05/06/2008 |
| 7358599 | Optical semiconductor device having a lead frame and electronic equipment using same An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an ... | 04/15/2008 |
| 7352011 | Wide emitting lens for LED useful for backlighting Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak... | 04/01/2008 |
| 7342260 | Light emitting diode A light emitting diode. The light emitting diode comprises a lead frame and an LED chip therein. Packaging material in the lead frame is covers the LED chip. A plurality of ZnX quantum dots dispersed in the packaging material, wherein X is S, Se, Te or a combination... | 03/11/2008 |
| 7339202 | Backlight module and a light-emitting-diode package structure therefor The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging plastic body. Moreover, the plastic package body contains a light-convergin... | 03/04/2008 |
| 7339201 | Light emitting diode and process for producing the same A light emitting diode includes a casing having a concave surface, a reflecting surface formed by depositing a metallic layer on a concave surface thereof, and a lead having a light emitting element fitted thereto so as to confront the reflecting surface. A cationic... | 03/04/2008 |
| 7338823 | Side-emitting LED package and manufacturing method of the same The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also i... | 03/04/2008 |
| 7335922 | Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced... | 02/26/2008 |
| 7329907 | Phosphor-converted LED devices having improved light distribution uniformity A New Phosphor-converted LED Device (“NPCLD”) is disclosed. The NPCLD may include a lens over a phosphor body, in which the lens and the phosphor body each have a substantially convex upper surface. The NPCLD may alternatively include first and second lenses, th... | 02/12/2008 |
| 7329905 | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the... | 02/12/2008 |
| 7315046 | Semiconductor light-emitting device and method for manufacturing the device A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor light-emitting element of the upper end of another lead, and an envelope... | 01/01/2008 |
| 7307286 | Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same An epoxy resin composition for encapsulating an optical semiconductor element, which has small internal stress and also can obtain good light transmittance within a broad temperature range. An epoxy resin composition for encapsulating an optical semiconductor elemen... | 12/11/2007 |
| 7304326 | Light emitting device and sealing material A light emitting device has: a light emitting element; a conducting portion to supply power to the light emitting element; an element housing portion that houses the light emitting element therein; and a sealing material that seals the light emitting element housed ... | 12/04/2007 |
| 7297984 | Semiconductor light-emitting device and method for manufacturing the device A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor light-emitting element of the upper end of another lead, and an envelope... | 11/20/2007 |
| 7288795 | Semiconductor light-emitting device and method for manufacturing the device A semiconductor light-emitting device has a pair of leads placed in parallel, a light-emitting element on the upper end of one lead, a bonding wire for electrically connecting the semiconductor light-emitting element of the upper end of another lead, and an envelope... | 10/30/2007 |
| 7282749 | Organic electroluminescent device and method of fabricating the same An organic electroluminescent device includes: first and second substrates facing each other and spaced apart from each other, the first and second substrates having a central portion and a peripheral portion; an array layer on the first substrate, the array layer i... | 10/16/2007 |
| 7279346 | Method for packaging a light emitting device by one dispense then cure step followed by another Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsul... | 10/09/2007 |
| 7276782 | Package structure for semiconductor A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deform... | 10/02/2007 |
| 7264979 | Method of manufacturing light emitting device A high-quality light emitting device is provided which has a long-lasting light emitting element free from the problems of conventional ones because of a structure that allows less degradation, and a method of manufacturing the light emitting device is provided. Aft... | 09/04/2007 |
| 7256428 | Optoelectronic component and method for the production thereof In order to apply an optical element such as a lens, for example, to an optoelectronic component, the surface (3B), averted from the transmitter or receiver (2), of the filling material (3) is designed directly with a lens profile (7). Th... | 08/14/2007 |
| 7253450 | Light-emitting device A foam-holding body 52 having a large difference in refractive index between foams 521 and the surrounding material is disposed on the major light extraction surface of the sapphire substrate 50. The foam-holding body 52 has translucency ... | 08/07/2007 |
| 7208772 | High power light emitting diode package The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial ... | 04/24/2007 |
| 7193303 | Supporting frame for surface-mount diode package A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chi... | 03/20/2007 |
| 7166873 | Light emitting device A light emitting device includes a semiconductor laser chip which emits a laser beam; a coherence reducing member which receives the laser beam and reduces coherence of the laser beam to generate a lower coherence light beam; and a package which houses the laser chi... | 01/23/2007 |
| 7161186 | Sideway-emission light emitting diode A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the receiv... | 01/09/2007 |
| 7161187 | Light emitting diode and manufacturing method thereof A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat r... | 01/09/2007 |
| 7118931 | Radiation emitter device having an integral micro-groove lens The radiation emitter device of the present invention includes at least two radiation emitters emitting radiation of different wavelengths, first and second electrical leads electrically coupled to at least one of the radiation emitters, and an encapsulant configure... | 10/10/2006 |
| 7105863 | Light source with improved life A light source has an attachment element attached to a hollow outer element. First and second leads extend through the attachment element. A light-emitting diode (“LED”) die is attached to a substrate portion of a lead. Elastomeric encapsulant disposed within th... | 09/12/2006 |
| 7042089 | Group III nitride compound semiconductor device An object of the present invention is to provide a large-size light-emitting device from which uniform light emission can be obtained. That is, in the present invention, in a device having an outermost diameter of not smaller than 700 μm, a distance from an ... | 05/09/2006 |
| 6700692 | Electrochromic rearview mirror assembly incorporating a display/signal light According to one embodiment of the present invention, an electrochromic rearview mirror assembly for a vehicle includes an electrochromic mirror having a variable reflectivity, a glare sensor for sensing levels of light directed towards the front element ... | 03/02/2004 |
| 6696704 | Composite light-emitting device, semiconductor light-emitting unit and method for fabricating the unit A composite light-emitting device according to the present invention includes a light-emitting element including a transparent substrate and a multilayer structure formed on the substrate. The multilayer structure includes first and second semiconductor l... | 02/24/2004 |
| 6683325 | Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture An opto-electronic semiconductor element has a radiation emitting or receiving, that is, radiation active semiconductor chip secured to an electrically conductive base frame. One, or a plurality of chips, are surrounded by a housing which may be integral ... | 01/27/2004 |
| 6680490 | Light-emitting device After a light-emitting element exhibiting an emission peak wavelength in a wavelength range of not longer than 500 nm is mounted into a cup-like portion of a base member, the cup-like portion is filled with epoxy group-containing silicone rubber. An aroma... | 01/20/2004 |
