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Class 257/E33.058 - Housing (EPO)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: This subclass is indented under subclass E33.056. This subclass
No. of patents: 106
Last issue date: 10/14/2008


1      
NumberTitleIssue Date
7436000Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source
A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to...
10/14/2008
7425083Light emitting device package
A light emitting device package is provided. The light emitting device package includes a light emitting device; a package body on which the light emitting device is loaded and which dissipates heat generated from the light emitting device to the outside; a first el...
09/16/2008
7419842Encapsulation of electroluminescent devices with shaped spacers
A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components fr...
09/02/2008
7414269Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a numbe...
08/19/2008
7411225Light source apparatus
A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well...
08/12/2008
7408203Light emitting device and fabrication method thereof and light emitting system using the same
A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to t...
08/05/2008
7405433Semiconductor light emitting device
A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encap...
07/29/2008
7394109LED lighting device
An LED lighting device comprises a seat with a conductor. A light emitting diode is disposed on the conductor of the seat, and has an upper positive conductive pad, a lower negative conductive pad, and an insulating pad disposed between the positive and negative con...
07/01/2008
7394153Encapsulation of electronic devices
An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of...
07/01/2008
7375381LED illumination apparatus and card-type LED illumination source
An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mo...
05/20/2008
7368329Diode housing
A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two ele...
05/06/2008
7361940Leadframe and packaged light emitting diode
A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supp...
04/22/2008
7358599Optical semiconductor device having a lead frame and electronic equipment using same
An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an ...
04/15/2008
7352010Photoelectric conversion module with cooling function
A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconduc...
04/01/2008
7352011Wide emitting lens for LED useful for backlighting
Lenses and certain fabrication techniques are described. A wide-emitting lens refracts light emitted by an LED die to cause a peak intensity to occur within 50-80 degrees off the center axis and an intensity along the center axis to be between 5% and 33% of the peak...
04/01/2008
7345322Light emitting diode
An LED including a substrate having a pair of terminal electrodes, at least one LED element mounted on the substrate, a frame disposed on the substrate, holes provided in the substrate, concave portions provided in positions of the frame facing the holes, and a pair...
03/18/2008
7339202Backlight module and a light-emitting-diode package structure therefor
The LED package structure includes a substrate, an LED chip, a plastic package body, and two leading legs. In addition, the LED chip is arranged on the substrate and covered by the packaging plastic body. Moreover, the plastic package body contains a light-convergin...
03/04/2008
7339201Light emitting diode and process for producing the same
A light emitting diode includes a casing having a concave surface, a reflecting surface formed by depositing a metallic layer on a concave surface thereof, and a lead having a light emitting element fitted thereto so as to confront the reflecting surface. A cationic...
03/04/2008
7335922Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip
A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced...
02/26/2008
7329904LED lamp device
An LED lamp device includes a light emitting element that emits light in a blue-based or violet-based color, an LED having a fluorescent material that emits fluorescent light in a yellow to yellow-green-based color in response to light received from the light emitti...
02/12/2008
7329907Phosphor-converted LED devices having improved light distribution uniformity
A New Phosphor-converted LED Device (“NPCLD”) is disclosed. The NPCLD may include a lens over a phosphor body, in which the lens and the phosphor body each have a substantially convex upper surface. The NPCLD may alternatively include first and second lenses, th...
02/12/2008
7329905Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
A packaged light emitting device includes a carrier substrate having a top surface and a bottom surface, first and second conductive vias extending from the top surface of the substrate to the bottom surface of the substrate, and a bond pad on the top surface of the...
02/12/2008
7326583Methods for packaging of a semiconductor light emitting device
Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective c...
02/05/2008
7312477Led lamp for light source
Whereas incandescent light bulbs and other similar light sources known in the related art emit light in all directions, LED lamps can emit light in a single direction, and this is manifested in the problem of being unable to achieve light distribution characteristic...
12/25/2007
7304326Light emitting device and sealing material
A light emitting device has: a light emitting element; a conducting portion to supply power to the light emitting element; an element housing portion that houses the light emitting element therein; and a sealing material that seals the light emitting element housed ...
12/04/2007
7291866Semiconductor light emitting device and semiconductor light emitting unit
A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner ...
11/06/2007
7282749Organic electroluminescent device and method of fabricating the same
An organic electroluminescent device includes: first and second substrates facing each other and spaced apart from each other, the first and second substrates having a central portion and a peripheral portion; an array layer on the first substrate, the array layer i...
10/16/2007
7279722Light emitting device with adjustable reflector cup
A light emitting device has a light emitting diode (LED), a reflector cup, and one or more adjustment mechanisms to control the intensity profile of light emitted from the light emitting device. The reflector cup has a base and a sidewall extending outward from the ...
10/09/2007
7276782Package structure for semiconductor
A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deform...
10/02/2007
7253447Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element
A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base ...
08/07/2007
7251010Semiconductor chip and display device using the same
To realize an area reduction of a semiconductor chip without adding a process, and to provide a semiconductor chip structure having an excellent pressure balance when mounted. In the structure of a semiconductor chip in which control/power supply lines are fo...
07/31/2007
7247509Method for manufacturing solid-state imaging devices
A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, is resin-molded. An aggregate wiri...
07/24/2007
7227194Semiconductor light emitting device
A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of the mold resin and/or one or more trenches extend from the cup-shape...
06/05/2007
7208772High power light emitting diode package
The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial ...
04/24/2007
7208773Cap for semiconductor device
In a cap for a semiconductor device in which a light transmissive window is fixed to a cap body provided with a light transmissive opening using low-melting glass as a fixing material so that the light transmissive window covers the light transmissive opening, the l...
04/24/2007
7199470Surface-mountable semiconductor component and method for producing it
Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip ...
04/03/2007
7187051Solid image-pickup device and method for manufacturing the solid image pickup device
It is an object of the invention to provide an improved solid image-pickup device which is compact in size and low in production cost. The solid image-pickup device is so formed that its semiconductor substrate has on its surface an image-pickup area having a plural...
03/06/2007
7170102Semiconductor laser device and fabrication method thereof
A semiconductor laser device aimed to be reduced in size and that can maintain high position accuracy, and a fabrication method of such a semiconductor laser device are achieved. A semiconductor laser device includes a stem as a base member, and a cap member. The st...
01/30/2007
7166873Light emitting device
A light emitting device includes a semiconductor laser chip which emits a laser beam; a coherence reducing member which receives the laser beam and reduces coherence of the laser beam to generate a lower coherence light beam; and a package which houses the laser chi...
01/23/2007
7161186Sideway-emission light emitting diode
A sideway-emission light emitting diode includes a light emitting diode package comprised of a light emitting diode dice that gives off light and a lens that is positioned in front of a front end face of the package for receiving the light and redirecting the receiv...
01/09/2007
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